CPS053-CS92D-CT20

CPS053-CS92D Silicon Controlled Rectifier Die 0.8 Amp, 400 Volt w w w. c e n t r a l s e m i . c o m The CPS053-CS92D is a Silicon Controlled Rectifier designed for sensing circuit and control system applications. MECHANICAL SPECIFICATIONS: Die Size 53.2 x 53.2 MILS Die Thickness 8.7 MILS Gate Bonding Pad Size 7.9 x 7.9 MILS Source Bonding Pad Size 20.1 x 10.2 MILS Top Side Metalization Al – 45,000Å Back Side Metalization Al/Mo/Ni/Ag – 32,000Å Scribe Alley Width 1.96 MILS Wafer Diameter 4 INCHES Gross Die Per Wafer 3,884 MAXIMUM RATINGS: (TA=25°C unless otherwise noted) SYMBOL Peak Repetitive Off-State Voltage VDRM, VRRM RMS On-State Current IT(RMS) 400 0.8 A Peak One Cycle Surge Current (t=10ms) 10 A 0.24 A2s I2t Value for Fusing (t=10ms) Peak Gate Power Dissipation (tp=10μs) Average Gate Power Dissipation Peak Gate Current (tp=10μs) Peak Gate Voltage (tp=10μs) ITSM I2t PGM PG(AV) IGM UNITS V 2.0 W 0.1 W 1.0 A 8.0 V Operating Junction Temperature VGM TJ -65 to +125 °C Storage Temperature Tstg -65 to +150 °C MIN MAX 1.0 UNITS μA ELECTRICAL SYMBOL IDRM, IRRM IGT CHARACTERISTICS: (TA=25°C) TEST CONDITIONS VDRM, VRRM=400V, RGK=1.0kΩ VD=12V IH VGT IT=100mA, RGK=1.0kΩ VD=12V VTM ITM=1.0A, tp=380μs 200 μA 5.0 mA 0.8 V 1.7 V R0 (7-May 2018) BARE DIE PACKING OPTIONS BARE DIE IN TRAY (WAFFLE) PACK CT: Singulated die in tray (waffle) pack. (example: CP211-PART NUMBER-CT) CM: S  ingulated die in tray (waffle) pack 100% visually inspected as per MIL-STD-750, (method 2072 transistors, method 2073 diodes). (example: CP211-PART NUMBER-CM) UNSAWN WAFER WN: Full wafer, unsawn, 100% tested with reject die inked. (example: CP211-PART NUMBER-WN) SAWN WAFER ON PLASTIC RING WR: F  ull wafer, sawn and mounted on plastic ring, 100% tested with reject die inked. (example: CP211-PART NUMBER-WR) Please note: Sawn Wafer on Metal Frame (WS) is possible as a special order. Please contact your Central Sales Representative at 631-435-1110. Visit the Central website for a complete listing of specifications: www.centralsemi.com/bdspecs R2 (3-April 2017) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)