CYStech Electronics Corp.
P-Channel Enhancement Mode Power MOSFET
Spec. No. : C404J3 Issued Date : 2008.09.19 Revised Date :2009.02.04 Page No. : 1/7
MTP9575J3
Features
• Single Drive Requirement • Low On-resistance • Fast switching Characteristic • RoHS compliant package
BVDSS ID RDSON
-60V -15A 90mΩ
Symbol
MTP9575J3
Outline
TO-252
G:Gate D:Drain S:Source
GDS
Absolute Maximum Ratings (Ta=25°C)
Parameter Symbol Limits Unit
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @VGS=-10V, TC=25°C Continuous Drain Current @VGS=-10V, TC=100°C Pulsed Drain Current Total Power Dissipation (TC=25℃) Linear Derating Factor Operating Junction and Storage Temperature Note : *1. Pulse width limited by safe operating area
VDS VGS ID ID IDM Pd Tj, Tstg
-60 ±25 -15 -9.5 -45 *1 36 0.29 -55~+150
V V A A A W W/°C °C
MTP9575J3
CYStek Product Specification
CYStech Electronics Corp.
Thermal Data
Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max Symbol Rth,j-c Rth,j-a
Spec. No. : C404J3 Issued Date : 2008.09.19 Revised Date :2009.02.04 Page No. : 2/7
Value 3.5 110
Unit °C/W °C/W
Characteristics (Tj=25°C, unless otherwise specified)
Symbol Min. Typ. -0.06 14 17 5 6 10 19 46 53 1660 160 100 56 159 Max. -3.0 ±100 -1 -25 90 120 27 2660 -1.2 Unit V V/°C V S nA μA μA mΩ mΩ Test Conditions VGS=0, ID=-250μA Reference to 25°C, ID=-1mA VDS = VGS, ID=-250μA VDS =-10V, ID=-9A VGS=±25V VDS =-60V, VGS =0 VDS =-48V, VGS =0, Tj=150°C VGS =-10V, ID=-12A VGS =-4.5V, ID=-9A Static BVDSS -60 BVDSS/ΔTj VGS(th) -1.0 GFS IGSS IDSS IDSS *RDS(ON) *RDS(ON) Dynamic *Qg *Qgs *Qgd *td(ON) *tr *td(OFF) *tf Ciss Coss Crss Source-Drain Diode *VSD *trr *Qrr -
nC
ID=-9A, VDS=-48V, VGS=-4.5V VDS=-30, ID=-9A, VGS=-10V, RG=3.3Ω, RL=3.3Ω
ns
pF
VGS=0V, VDS=-25V, f=1MHz
V ns nC
IS=-9A, VGS=0V IS=-9A, VGS=0, dI/dt=100A/μs
*Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2%
Ordering Information
Device MTP9575J3 Package TO-252 (RoHS compliant) Shipping 2500 pcs / Tape & Reel Marking 9575
MTP9575J3
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Spec. No. : C404J3 Issued Date : 2008.09.19 Revised Date :2009.02.04 Page No. : 3/7
MTP9575J3
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves(Cont.)
Spec. No. : C404J3 Issued Date : 2008.09.19 Revised Date :2009.02.04 Page No. : 4/7
MTP9575J3
CYStek Product Specification
CYStech Electronics Corp.
Reel Dimension
Spec. No. : C404J3 Issued Date : 2008.09.19 Revised Date :2009.02.04 Page No. : 5/7
Carrier Tape Dimension
MTP9575J3
CYStek Product Specification
CYStech Electronics Corp.
Recommended temperature profile for IR reflow
Spec. No. : C404J3 Issued Date : 2008.09.19 Revised Date :2009.02.04 Page No. : 6/7
Note : All temperatures refer to topside of the package, measured on the package body surface.
Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature
Sn-Pb eutectic Assembly 3°C/second max. 100°C 150°C 60-120 seconds 183°C 60-150 seconds 240 +0/-5 °C 10-30 seconds 6°C/second max. 6 minutes max.
Pb-free Assembly 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds 260 +0/-5 °C 20-40 seconds 6°C/second max. 8 minutes max.
Recommended wave soldering condition
Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds
MTP9575J3
CYStek Product Specification
CYStech Electronics Corp.
TO-252 Dimension
A C
Spec. No. : C404J3 Issued Date : 2008.09.19 Revised Date :2009.02.04 Page No. : 7/7
Marking:
B L F G
D
Device Name Date code
9575 □□□□
3 H E K 2 I 1 J
Style: Pin 1.Gate 2.Drain 3.Source
3-Lead TO-252 Plastic Surface Mount Package CYStek Package Code: J3
*: Typical
DIM A B C D E F
Inches Min. Max. 0.0177 0.0217 0.0650 0.0768 0.0354 0.0591 0.0177 0.0236 0.2441 0.2677 0.2125 0.2283
Millimeters Min. Max. 0.45 0.55 1.65 1.95 0.90 1.50 0.45 0.60 6.20 6.80 5.40 5.80
DIM G H I J K L
Inches Min. Max. 0.0866 0.1102 *0.0906 0.0449 0.0346 0.2047 0.2165 0.0551 0.0630
Millimeters Min. Max. 2.20 2.80 *2.30 1.14 0.88 5.20 5.50 1.40 1.60
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: KFC; tin plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTP9575J3
CYStek Product Specification
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