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MAX13046E/MAX13047E
Single- and Dual-Bidirectional
Low-Level Translator
General Description
The MAX13046E/MAX13047E ±15kV ESD-protected
bidirectional level translators provide level shifting for
data transfer in a multivoltage system. The MAX13046E
is a single-channel translator, and the MAX13047E is a
dual-channel translator. Externally applied voltages, VCC
and VL, set the logic level on either side of the device. The
MAX13046E/MAX13047E utilize a transmission-gatebased design to allow data translation in either direction
(VL↔VCC) on any single data line. The MAX13046E/
MAX13047E accept VL from +1.1V to the minimum of
either +3.6V or (VCC + 0.3V), and VCC from +1.65V
to +5.5V, making these devices ideal for data transfer
between low-voltage ASICs/PLDs and higher voltage
systems.
The MAX13046E/MAX13047E feature a shutdown mode
that reduces supply current to less than 1μA thermal
short-circuit protection, and ±15kV ESD protection on
the VCC side for enhanced protection in applications that
route signals externally. The MAX13046E/MAX13047E
operate at a guaranteed data rate of 8Mbps when pushpull driving is used.
Features
● Bidirectional Level Translation
● Operation Down to +1.1V on VL
● Ultra-Low Supply Current in Shutdown Mode 1μA
(max)
● Guaranteed Push-Pull Driving Data Rate
• 8Mbps (+1.2V ≤ VL ≤ +3.6V, VCC ≤ +5.5V)
• 16Mbps (+1.8V ≤ VL ≤ VCC ≤ +3.3V)
● Extended ESD Protection on the I/O VCC Lines
• ±15kV Human Body Model
• ±15kV IEC61000-4-2 Air-Gap Discharge Method
• ±8kV IEC61000-4-2 Contact Discharge
● Low Supply Current
● Short-Circuit Protection
● Space-Saving μDFN and UTQFN Packages
Pin Configurations
The MAX13046E is available in a 6-pin μDFN package,
and the MAX13047E is available in a 10-pin UTQFN. Both
devices are specified over the extended -40°C to +85°C
operating temperature range.
Applications
●
●
●
●
I2C and 1-Wire® Level Translation
CMOS Logic-Level Translation
Cell Phones
Portable Devices
Ordering Information/Selector Guide
PART
PIN-PACKAGE
NUMBER OF TOP
CHANNELS MARK
MAX13046EELT+
6 µDFN
(1mm x 1.5mm)
1
OC
MAX13047EEVB+
10 UTQFN
(1.4mm x 1.8mm)
2
AAC
Note: All devices are specified over the extended -40°C to
+85°C operating temperature range.
+Denotes a lead-free/RoHS-compliant package.
1-Wire is a registered trademark of Maxim Integrated Products, Inc.
19-4149; Rev 3; 7/21
Typical Application Circuits appear at end of data sheet.
MAX13046E/MAX13047E
Single- and Dual-Bidirectional
Low-Level Translator
Absolute Maximum Ratings
(All voltages referenced to GND.)
VCC...........................................................................-0.3V to +6V
VL.............................................................................-0.3V to +4V
I/O VCC...................................................... -0.3V to (VCC + 0.3V)
I/O VL........................................................... -0.3V to (VL + 0.3V)
SHDN.......................................................................-0.3V to +6V
Short-Circuit Duration I/O VL, I/O VCC to GND.........Continuous
Power Dissipation (TA = +70°C)
6-Pin μDFN (derate 2.1mW/°C above +70°C).............168mW
10-Pin UTQFN (derate 6.9mW/°C above +70°C)........559mW
Junction-to-Ambient Thermal Resistance (θJA) (Note 1)
6-Pin μDFN.................................................................477°C/W
10-Pin UTQFN...........................................................20.1°C/W
Junction-to-Ambient Thermal Resistance (θJC) (Note 1)
6-Pin μDFN................................................................20.1°C/W
10-Pin UTQFN.........................................................143.1°C/W
Operating Temperature Range............................ -40°C to +85°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................. +300°C
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
(VCC = +1.65V to +5.5V, VL = +1.1V to minimum of either +3.6V or ((VCC + 0.3V)), I/O VL and I/O VCC are unconnected, TA = -40°C
to +85°C, unless otherwise noted. Typical values are VCC = +3.3V, VL = +1.8V at TA = +25°C.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY
VL Supply Range
VCC Supply Range
Supply Current from VCC
Supply Current from VL
VCC Shutdown-Mode Supply Current
VL
VCC > 3.3V
1.1
VCC ≤ 3.3V
1.1
VCC
3.6V
VCC + 0.3V
1.65
V
5.5
V
IQVCC
10
µA
IQVL
15
µA
ISD-VCC
TA = +25°C, SHDN = GND
0.03
1
µA
VL Shutdown-Mode Supply Current
ISD-VL
TA = +25°C, SHDN = GND
0.03
1
µA
I/O VL and I/O VCC Shutdown-Mode
Leakage Current
ISD-LKG
TA = +25°C, SHDN = GND
0.02
0.5
µA
TA = +25°C
0.02
0.1
µA
SHDN Input Leakage
ESD PROTECTION
Human Body Model
±15V
I/O VCC (Note 4)
IEC 61000-4-2 Air-Gap Discharge
±15V
IEC 61000-4-2 Contact Discharge
±8V
All Other Pins
Human Body Model
kV
±2
kV
LOGIC-LEVEL THRESHOLDS
I/O VL Input-Voltage High
I/O VL Input-Voltage Low
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VIHL
VILL
VL - 0.2
V
0.15
V
Maxim Integrated │ 2
MAX13046E/MAX13047E
Single- and Dual-Bidirectional
Low-Level Translator
Electrical Characteristics (continued)
(VCC = +1.65V to +5.5V, VL = +1.1V to minimum of either +3.6V or ((VCC + 0.3V)), I/O VL and I/O VCC are unconnected, TA = -40°C
to +85°C, unless otherwise noted. Typical values are VCC = +3.3V, VL = +1.8V at TA = +25°C.) (Notes 2, 3)
PARAMETER
SYMBOL
I/O VCC Input-Voltage High
VIHC
I/O VCC Input-Voltage Low
VILC
CONDITIONS
VOHL
I/O VL Output-Voltage Low
VOLL
I/O VL sink current = 1mA,
VI/O VCC < 0.15V
I/O VCC Output-Voltage High
VOHC
I/O VCC source current = 20µA,
VI/O VL > VL - 0.2V
I/O VCC Output-Voltage Low
VOLC
I/O VCC sink current = 1mA,
VI/O VL < 0.15V
SHDN Input-Voltage Low
VIL-SHDN
MAX
VL > 1.2
1.1 ≤ VL < 1.2
0.67 x
VL
V
V
0.4
0.67 x
VCC
V
V
0.4
VL - 0.2
V
V
VL - 0.1
I/O VL-to-I/O VCC Resistance
UNITS
V
0.15
I/O VL Output-Voltage High
VIH-SHDN
TYP
VCC 0.4
I/O VL source current = 20µA,
VI/O VCC > VCC - 0.4V
SHDN Input-Voltage High
MIN
0.15
V
80
250
Ω
VCC Shutdown Threshold Low
VTH_L_VCC VCC falling, VL = +3.3V
0.5
0.8
1.1
V
VCC Shutdown Threshold High
VTH_H_VCC VCC rising, VL = +3.3V
0.3
0.6
0.9
V
0.35
0.75
1.06
V
6
10
15.5
kΩ
VL Shutdown Threshold
VTH_VL
Pullup Resistance
VCC = VL = +3.3V
RISE/FALL-TIME ACCELERATOR STAGE
Accelerator Pulse Duration
20
ns
VL = 1.7V
13
Ω
I/O VCC Output-Accelerator Source
Impedance
VCC = 2.2V
17
Ω
I/O VL Output-Accelerator Source
Impedance
VL = 3.2V
6
Ω
I/O VCC Output-Accelerator Source
Impedance
VCC = 3.6V
10
Ω
I/O VL Output-Accelerator Source
Impedance
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Maxim Integrated │ 3
MAX13046E/MAX13047E
Single- and Dual-Bidirectional
Low-Level Translator
Timing Characteristics For +1.2V ≤ VL ≤ Minimum Of Either +3.6V OR (VCC + 0.3V)
(VCC ≤ ±5.5V, +1.2V ≤ VL ≤ minimum of either +3.6V or ((VCC + 0.3V)), RS = 50Ω, RL = 1MΩ, CL = 15pF, TA = -40°C to +85°C, unless
otherwise noted. Typical values are VCC = +3.3V, VL = +1.8V at TA = +25°C.) (Notes 2, 3, 5)
PARAMETER
SYMBOL
I/O VCC Rise Time
tRVCC
I/O VCC Fall Time
tFVCC
I/O VL Rise Time
tRVL
I/O VL Fall Time
tFVL
Propagation Delay
tPD-VL-VCC
tPD-VCC-VL
Channel-to-Channel Skew
tSKEW
CONDITIONS
TYP
MAX
7
25
170
400
Push-pull driving, Figure 1a
6
37
Open-drain driving, Figure 1c
20
50
Push-pull driving, Figure 1b
8
30
180
400
Push-pull driving, Figure 1
3
56
Open-drain driving, Figure 1d
30
60
5
30
210
1000
4
30
190
1000
Open-drain driving, Figure 1c
Open-drain driving, Figure 1d
Push-pull driving
Driving I/O VL
Open-drain driving
Push-pull driving
Driving I/O VCC
Open-drain driving
Each translator equally
loaded
Push-pull driving
20
Open-drain driving
50
Push-pull driving
Maximum Data Rate
MIN
Push-pull driving, Figure 1a
Open-drain driving
UNITS
ns
ns
ns
ns
ns
ns
8
Mbps
500
kbps
Timing Characteristics For +1.1V ≤ VL ≤ +1.2V
(VCC ≤ ±5.5V, +1.1V ≤ VL ≤ +1.2V, RS = 50Ω, RL = 1MΩ, CL = 15pF, TA = -40°C to +85°C, unless otherwise noted. Typical values are
VCC = +3.3V, VL = +1.8V at TA = +25°C.) (Notes 2, 3, 5)
PARAMETER
SYMBOL
I/O VCC Rise Time
tRVCC
I/O VCC Fall Time
tFVCC
I/O VL Rise Time
tRVL
I/O VL Fall Time
tFVL
Propagation Delay
Channel-to-Channel Skew
Maximum Data Rate
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CONDITIONS
TYP
MAX
7
200
170
400
Push-pull driving, Figure 1a
6
37
Open-drain driving, Figure 1c
20
50
Open-drain driving, Figure 1c
Push-pull driving, Figure 1b
8
30
180
400
Push-pull driving, Figure 1
3
30
Open-drain driving, Figure 1d
30
60
Open-drain driving, Figure 1d
tPD-VL-VCC
Driving I/O VL
tPD-VCC-VL
Driving I/O VCC
tSKEW
MIN
Push-pull driving, Figure 1a
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Each translator equally Push-pull driving
loaded
Open-drain driving
5
200
210
1000
4
200
190
1000
20
50
UNITS
ns
ns
ns
ns
ns
ns
Push-pull driving
1.2
Mbps
Open-drain driving
500
kbps
Maxim Integrated │ 4
MAX13046E/MAX13047E
Single- and Dual-Bidirectional
Low-Level Translator
Timing Characteristics For +1.8V ≤ VL ≤ VCC ≤ +3.3V
(+1.8V ≤ VL ≤ VCC ≤ +3.3V, RS = 50Ω, RL = 1MΩ, CL = 15pF, TA = -40°C to +85°C, unless otherwise noted. Typical values are VCC
= +3.3V, VL = +1.8V at TA = +25°C.) (Notes 2, 3, 5)
PARAMETER
I/O VCC Rise Time
I/O VCC Fall Time
I/O VL Rise Time
I/O VL Fall Time
Propagation Delay
Channel-to-Channel Skew
Maximum Data Rate
SYMBOL
MAX
UNITS
tRVCC
Push-pull driving, Figure 1a
CONDITIONS
MIN
15
ns
tFVCC
Push-pull driving, Figure 1a
15
ns
tRVL
Push-pull driving, Figure 1b
15
ns
tFVL
Push-pull driving, Figure 1b
15
ns
tPD-VL-VCC Push-pull driving, driving I/O VL
TYP
15
tPD-VCC-VL Push-pull driving, driving I/O VCC
15
Push-pull driving, each translator
equally loaded
10
tSKEW
Push-pull driving
16
ns
ns
Mbps
Note 2: All units are 100% production tested at TA = +25°C. Limits over the operating temperature range are guaranteed by design
and not production tested.
Note 3: For normal operation, ensure VL < (VCC + 0.3V). During power-up, VL > (VCC + 0.3V) does not damage the device.
Note 4: ESD protection is guaranteed by design. To ensure maximum ESD protection, place a 1μF ceramic capacitor between VCC
and GND. See Typical Application Circuits.
Note 5: Timing is measured using 10% of input to 90% of output.
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Maxim Integrated │ 5
MAX13046E/MAX13047E
Single- and Dual-Bidirectional
Low-Level Translator
Typical Operating Characteristics
(VCC = +3.3V, VL = +1.8V, RL = 1MΩ, CL = 15pF, push-pull driving data rate = 8Mbps, TA = +25°C, unless otherwise noted.)
VCC DYNAMIC SUPPLY CURRENT
vs. VL SUPPLY VOLTAGE
(PUSH-PULL DRIVING ONE I/O VCC)
MAX13046E/7E toc04
80
70
60
50
40
30
20
180
1.2
1.9
2.6
VL SUPPLY VOLTAGE (V)
VL DYNAMIC SUPPLY CURRENT
vs. CAPACITIVE LOAD
(PUSH-PULL DRIVING ONE I/O VL)
MAX13046E/7E toc07
120
VL SUPPLY CURRENT (µA)
100
80
60
40
20
0
160
140
120
100
80
60
40
0
3.3
0
10
20
30
40
CAPACITIVE LOAD (pF)
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50
1.2
1.9
2.6
VL SUPPLY VOLTAGE (V)
3.3
VL DYNAMIC SUPPLY CURRENT
vs. TEMPERATURE
(PUSH-PULL DRIVING ONE I/O VCC)
300
250
200
150
100
50
-40
-15
10
35
60
TEMPERATURE (°C)
0
85
VCC DYNAMIC SUPPLY CURRENT
vs. CAPACITIVE LOAD
(PUSH-PULL DRIVING ONE I/O VL)
1200
1000
25
800
600
400
-40
-15
0
10
20
30
40
CAPACITIVE LOAD (pF)
50
10
35
60
TEMPERATURE (°C)
85
RISE/FALL TIME vs. CAPACITIVE LOAD
(PUSH-PULL DRIVING ONE I/O VL)
20
tFVCC
15
10
tRVCC
5
200
0
MAX13046E/7E toc03
100
350
20
VCC SUPPLY CURRENT (µA)
0
200
0
VL DYNAMIC SUPPLY CURRENT
vs. TEMPERATURE
(PUSH-PULL DRIVING ONE I/O VL)
200
10
300
1.65 2.20 2.75 3.30 3.85 4.40 4.95 5.50
VCC SUPPLY VOLTAGE (V)
RISE/FALL TIME (ns)
VCC SUPPLY CURRENT (µA)
0
1.65 2.20 2.75 3.30 3.85 4.40 4.95 5.50
VCC SUPPLY VOLTAGE (V)
VL SUPPLY CURRENT (µA)
0
MAX13046E/7E toc02
50
50
400
MAX13046E/7E toc06
100
100
500
MAX13046E/7E toc09
150
150
VCC DYNAMIC SUPPLY CURRENT
vs. VL SUPPLY VOLTAGE
(PUSH-PULL DRIVING ONE I/O VL)
600
VCC SUPPLY CURRENT (µA)
200
MAX13046E/7E toc05
250
200
MAX13046E/7E toc08
VL SUPPLY CURRENT (µA)
300
250
VL SUPPLY CURRENT (µA)
MAX13046E/7E toc01
350
VL DYNAMIC SUPPLY CURRENT
vs. VCC SUPPLY VOLTAGE
(PUSH-PULL DRIVING ONE I/O VCC)
VL SUPPLY CURRENT (µA)
VL DYNAMIC SUPPLY CURRENT
vs. VCC SUPPLY VOLTAGE
(PUSH-PULL DRIVING ONE I/O VL)
0
0
10
20
30
40
CAPACITIVE LOAD (pF)
50
Maxim Integrated │ 6
MAX13046E/MAX13047E
Single- and Dual-Bidirectional
Low-Level Translator
Typical Operating Characteristics (continued)
(VCC = +3.3V, VL = +1.8V, RL = 1MΩ, CL = 15pF, push-pull driving data rate = 8Mbps, TA = +25°C, unless otherwise noted.)
4
3
2
6
tFVL
4
2
1
0
8
0
10
20
30
40
CAPACITIVE LOAD (pF)
50
0
MAX13046E/7E toc12
5
tRVL
10
3.5
3.0
PROPAGATION DELAY (ns)
PROPAGATION DELAY (ns)
6
12
RISE/FALL TIME (ns)
MAX13046E/7E toc10
7
PROPAGATION DELAY vs. CAPACITIVE LOAD
(PUSH-PULL DRIVING ONE I/O VCC)
RISE/FALL TIME vs. CAPACITIVE LOAD
(PUSH-PULL DRIVING ONE I/O VCC)
MAX13046E/7E toc11
PROPAGATION DELAY vs. CAPACITIVE LOAD
(PUSH-PULL DRIVING ONE I/O VL)
2.5
2.0
1.5
1.0
0.5
0
10
20
30
40
CAPACITIVE LOAD (pF)
RAIL-TO-RAIL DRIVING
(DRIVING ONE I/O VL)
50
0
0
10
20
30
40
CAPACITIVE LOAD (pF)
50
EXISTING SHUTDOWN MODE
MAX13046E/7E toc14
MAX13046E/7E toc13
1V/div
1V/div
I/O VL
2V/div
I/O VL
I/O VCC
1V/div
1V/div
SHDN
I/O VCC
25ns/div
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250ns/div
Maxim Integrated │ 7
MAX13046E/MAX13047E
Single- and Dual-Bidirectional
Low-Level Translator
MAX13046E Pin Description
MAX13046E
µDFN
1
2
3
4
5
6
FUNCTION
NAME
VL
GND
VL Input Supply Voltage. Bypass VL with a 0.1µF ceramic capacitor located as close as possible to the input.
Ground
I/O VL
Input/Output. Referenced to VL.
SHDN
Shutdown Input. Drive SHDN high to enable the device. Drive SHDN low to put the device in shutdown mode.
I/O VCC
VCC
Input/Output. Referenced to VCC.
VCC Input Supply Voltage. Bypass VCC with a 1µF ceramic capacitor located as close as possible to the input
for full ESD protection. If full ESD protection is not required, bypass VCC with a 0.1µF ceramic capacitor.
MAX13047E Pin Description
MAX13047E
UTQFN
NAME
1
I/O VL2
2
VL
3, 7
N.C.
4
SHDN
5
6
8
FUNCTION
Input/Output 2. Referenced to VL.
VL Input Supply Voltage. Bypass VL with a 0.1µF ceramic capacitor located as close as possible to the input.
Not Connected. Internally not connected.
Enable Input. Drive SHDN high to enable the device. Drive SHDN low to put the device in shutdown mode.
I/O VCC2 Input/Output 2. Referenced to VCC.
VCC
VCC Input Supply Voltage. Bypass VCC with a 1µF ceramic capacitor located as close as possible to
the input for full ESD protection. If full ESD protection is not required, bypass VCC with a 0.1µF ceramic
capacitor.
I/O VCC1 Input/Output 1. Referenced to VCC.
9
GND
10
I/O VL1
Ground
Input/Output 1. Referenced to VL.
Detailed Description
The MAX13046E/MAX13047E ±15kV ESD-protected
bidirectional level translators provide level shifting for
data transfer in a multivoltage system. The MAX13046E
is a single-channel translator and the MAX13047E is a
dual-channel translator. Externally applied voltages, VCC
and VL, set the logic level on either side of the device. The
MAX13046E/MAX13047E utilize a transmission-gatebased design to allow data translation in either direction
(VL ↔ VCC) on any single data line. The MAX13046E/
MAX13047E accept VL from +1.1V to the minimum of
either +3.6V or (VCC + 0.3V) and VCC from +1.65V
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to +5.5V, making these devices ideal for data transfer
between low-voltage ASICs/PLDs and higher voltage
systems.
The MAX13046E/MAX13047E feature a shutdown mode
that reduces supply current to less than 1μA thermal
short-circuit protection, and ±15kV ESD protection on
the VCC side for enhanced protection in applications that
route signals externally. The MAX13046E/MAX13047E
operate at a guaranteed data rate of 8Mbps when pushpull driving is used. See the Functional Diagram.
Maxim Integrated │ 8
MAX13046E/MAX13047E
Single- and Dual-Bidirectional
Low-Level Translator
Functional Diagram
VL
VCC
PU1
ONE-SHOT
RISE-TIME
ACCELERATOR
ONE-SHOT
RISE-TIME
ACCELERATOR
10kΩ
PU2
10kΩ
GATE BIAS
I/O VL
I/O VCC
N
SHDN
GND
Level Translation
For proper operation, ensure that +1.65V ≤ VCC ≤ +5.5V
and +1.1V ≤ VL ≤ the minimum of either +3.6V or (VCC
+ 0.3V). During power-up sequencing, VL ≥ (VCC + 0.3V)
does not damage the device. The speed of the rise time
accelerator circuitry limits the maximum data rate for the
MAX13046E/MAX13047E to 16Mbps.
decreases the supply current to less than 1μA. The highimpedance I/O lines in shutdown mode allow for use in a
multidrop network. The MAX13046E/MAX13047E have a
diode from each I/O to the corresponding supply rail and
GND. Therefore, when in shutdown mode, do not allow
the voltage at I/O VL to exceed (VL + 0.3V), or the voltage
at I/O VCC to exceed (VCC + 0.3V).
Rise-Time Accelerators
Operation with One Supply Disconnected
The MAX13046E/MAX13047E have an internal rise-time
accelerator, allowing operation up to 16Mbps. The risetime accelerators are present on both sides of the device
and act to speed up the rise time of the input and output
of the device, regardless of the direction of the data. The
triggering mechanism for these accelerators is both level
and edge sensitive. To guarantee operation of the rise
time accelerators the maximum parasitic capacitance
should be less than 200pF on the I/O lines.
Shutdown Mode
Drive SHDN low to place the MAX13046E/MAX13047E in
shutdown mode and drive SHDN high for normal operation.
Activating the shutdown mode disconnects the internal
10kΩ pullup resistors on the I/O VCC and I/O VL lines.
This forces the I/O lines to a high-impedance state, and
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Certain applications require sections of circuitry to be
disconnected to save power. When VL is connected and
VCC is disconnected or connected to ground, the device
enters shutdown mode. In this mode, I/O VL can still be
driven without damage to the device; however, data does
not translate from I/O VL to I/O VCC. If VCC falls more
than VTH_L_VCC below VL, the device disconnects the
pullup resistors at I/O VL and I/O VCC. To achieve the
lowest possible supply current from VL when VCC is disconnected, it is recommended that the voltage at the VCC
supply input be approximately equal to GND.
When VCC is connected and VL is less than VTH_VL, the
device enters shutdown mode. In this mode, I/O VCC can
still be driven without damage to the device; however,
data does not translate from I/O VCC to I/O VL.
Maxim Integrated │ 9
MAX13046E/MAX13047E
VL
Single- and Dual-Bidirectional
Low-Level Translator
VL
VCC
VL
VCC
VL
VCC
RS
50Ω
MAX13046E/
MAX13047E
MAX13046E/
MAX13047E
I/O VCC
I/O VL
VCC
SHDN
SHDN
GND
DATA
DATA
RL
CL
CL
I/O VL
(tRISE,
tFALL < 10ns)
I/O VCC
I/O VL
RL
RS
50Ω
GND
I/O VCC
(tRISE,
tFALL < 10ns)
tPD-VL-VCC
tPD-VL-VCC
I/O VCC
tPD-VCC-VL
tPD-VCC-VL
I/O VL
tRVCC
tFVCC
tRVL
tFVL
Figure 1a. Rail-to-Rail Driving I/O VL
Figure 1b. Rail-to-Rail Driving I/O VCC
When VCC is disconnected or connected to ground, I/O
VCC must not be driven more than VCC + 0.3V. When VL
is disconnected or connected to ground, I/O VL must not
be driven more than VL + 0.3V.
operation, shutdown mode, and powered down. The I/O
VCC lines of the MAX13046E/MAX13047E are characterized
for protection to the following limit:
Short-Circuit Protection
ESD Test Conditions
Thermal-overload detection protects the MAX13046E/
MAX13047E from short-circuit fault conditions. In the
event of a short-circuit fault, when the junction temperature
(TJ) exceeds +150°C, the device enters shutdown mode.
When the device has cooled to below +140°C, normal
operation resumes.
±15kV ESD Protection
ESD protection structures are incorporated on all pins
to protect against electrostatic discharges encountered
during handling and assembly. The ESD structures
withstand electrostatic discharge in all states: normal
www.maximintegrated.com
● ±15kV using the Human Body Model
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents test
setup, test methodology, and test results.
Human Body Model
Figure 2a shows the Human Body Model, and Figure
2b shows the current waveform it generates when
discharged into a low-impedance state. This model
consists of a 100pF capacitor charged to the ESD
voltage of interest that is then discharged into the test
device through a 1.5kΩ resistor.
Maxim Integrated │ 10
MAX13046E/MAX13047E
Single- and Dual-Bidirectional
Low-Level Translator
VL
VL
VCC
VL
VCC
VL
VCC
VCC
SHDN
SHDN
MAX13046E/
MAX13047E
MAX13046E/
MAX13047E
I/O VCC
I/O VL
DATA
DATA
RL
GND
CL
I/O VL
CL
I/O VCC
I/O VL
RL
GND
I/O VCC
tPD-VL-VCC
tPD-VL-VCC
I/O VCC
tPD-VCC-VL
tPD-VCC-VL
I/O VL
tRVCC
tFVCC
tRVL
Figure 1c. Open-Drain Driving I/O VL
Figure 1d. Open-Drain Driving I/O VCC
IEC 61000-4-2
Applications Information
The IEC 61000-4-2 standard covers ESD testing and
performance of finished equipment; it does not specifically
refer to integrated circuits. The MAX13046E/MAX13047E
help to design equipment that meets Level 4 of IEC
61000-4-2 without the need for additional ESD-protection
components. The major difference between tests done
using the Human Body Model and IEC 61000-4-2 is
higher peak current in IEC 61000-4-2 because series
resistance is lower in the IEC 61000-4-2 model. Hence,
the ESD withstand voltage measured to IEC 61000-4-2
can be lower than that measured using the Human Body
Model. Figure 3a shows the IEC 61000-4-2 model, and
Figure 3b shows the current waveform for the ±8kV, IEC
61000-4-2, Level 4, ESD contact-discharge test. The AirGap test involves approaching the device with a charged
probe. The contact-discharge method connects the probe
to the device before the probe is energized.
www.maximintegrated.com
tFVL
Power-Supply Decoupling
To reduce ripple and the chance of transmitting incorrect
data, bypass VL and VCC to ground with a 0.1μF ceramic
capacitor. To ensure full ±15kV ESD protection, bypass
VCC to ground with a 1μF ceramic capacitor. Place all
capacitors as close as possible to the power-supply
inputs.
I2C Level Translation
The MAX13046E/MAX13047E level shifts the data
present on the I/O lines between +1.1V and +5.5V, making
them ideal for level translation between a low-voltage
ASIC and an I2C device. A typical application involves
interfacing a low-voltage microprocessor to a +3V or +5V
D/A converter, such as the MAX517.
Maxim Integrated │ 11
MAX13046E/MAX13047E
RC
1MΩ
CHARGE-CURRENTLIMIT RESISTOR
HIGHVOLTAGE
DC
SOURCE
Cs
100pF
Single- and Dual-Bidirectional
Low-Level Translator
RC
50MΩ TO 100MΩ
RD
1500Ω
DISCHARGE
RESISTANCE
CHARGE-CURRENTLIMIT RESISTOR
DEVICE
UNDER
TEST
STORAGE
CAPACITOR
Figure 2a. Human Body ESD Test Model
IP 100%
90%
Cs
150pF
DISCHARGE
RESISTANCE
DEVICE
UNDER
TEST
STORAGE
CAPACITOR
Figure 3a. IEC 61000-4-2 ESD Test Model
I
100%
90%
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
IPEAK
Ir
HIGHVOLTAGE
DC
SOURCE
RD
330Ω
AMPERES
36.8%
10%
0
10%
0
tRL
TIME
tDL
CURRENT WAVEFORM
tr = 0.7ns TO 1ns
30ns
t
60ns
Figure 2b. Human Body Current Waveform
Figure 3b. IEC 61000-4-2 ESD Generator Current Waveform
1-Wire Interface Translation
PCB Layout
The MAX13046E/MAX13047E are ideal for level
translation between a low-voltage ASIC and 1-Wire
device. A typical application involves interfacing a lowvoltage microprocessor to an external memory, such as
the DS2502. The maximum data rate depends on the
1-Wire device. For the DS2502, the maximum data rate
is 16.3kbps. A 5kΩ pullup resistor is recommended when
interfacing with the DS2502.
Push-Pull vs. Open-Drain Driving
The MAX13046E/MAX13047E can be driven in a
pushpull or open-drain configurations. For open-drain
configuration, internal 10kΩ resistors pull up I/O VL and
I/O VCC to their respective power supplies. See the
Timing Characteristics table for maximum data rates
when using open-drain drivers.
www.maximintegrated.com
The MAX13046E/MAX13047E require good PCB layout
for proper operation and optimal rise/fall time performance.
Ensure proper high-frequency PCB layout even when
operating at low data rates.
Driving High-Capacitive Load
Capacitive loading on the I/O lines impacts the rise time
(and fall time) of the MAX13046E/MAX13047E when driving
the signal lines. The actual rise time is a function of
the load capacitance, parasitic capacitance, the supply
voltage, and the drive impedance of the MAX13046E/
MAX13047E.
Operating the MAX13046E/MAX13047E at a low data
rate does NOT increase capacitive load driving capability.
Maxim Integrated │ 12
MAX13046E/MAX13047E
Single- and Dual-Bidirectional
Low-Level Translator
Typical Application Circuits
+1.8V
+3.3V
0.1µF
1µF
VL
VCC
SHDN
+1.8V
SYSTEM
+3.3V
SYSTEM
MAX13046E
DATA
I/O VL
DATA
I/O VCC
+1.8V
+3.3V
0.1µF
1µF
VL
VCC
SHDN
+1.8V
SYSTEM
+3.3V
SYSTEM
MAX13047E
DATA
www.maximintegrated.com
I/O VL1
I/O VCC1
I/O VL2
I/O VCC2
DATA
Maxim Integrated │ 13
MAX13046E/MAX13047E
Chip Information
PROCESS: BiCMOS
Single- and Dual-Bidirectional
Low-Level Translator
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
www.maximintegrated.com
PACKAGE
CODE
DOCUMENT
NO
6 µDFN
L611-1
21-0147
10 UTQFN
V101A1CN-1
21-0028
Maxim Integrated │ 14
MAX13046E/MAX13047E
Single- and Dual-Bidirectional
Low-Level Translator
Revision History
REVISION
NUMBER
REVISION
DATE
0
5/08
Initial release
1
8/08
Removing future product asterisks from MAX13047, changing Electrical
Characteristics Table, packaging changes, changing ESD information
2
10/19
Updated MAX13047E Pin Description table
8
3
7/21
Updated Pin Configurations.
1
PAGES
CHANGED
DESCRIPTION
—
1–4, 6, 10
For pricing, delivery, and ordering information, please visit Maxim Integrated’s online storefront at https://www.maximintegrated.com/en/storefront/storefront.html.
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
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