GP1601FSS18

GP1601FSS18 GP1601FSS18 Single Switch Low VCE(SAT) IGBT Module Replaces January 2000 version, DS5248-3.0 DS5248-4.2 January 2001 FEATURES s s s s s Low VCE(SAT) Non Punch Through Silicon Isolated Copper Baseplate Low Inductance Internal Construction 1600A Per module KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 1800V 2.6V 1600A 3200A External connection APPLICATIONS s s s s C1 Aux C C2 High Reliability Inverters Motor Controllers Traction Drives Resonant Converters G Aux E E1 E2 The Powerline range of high power modules includes dual and single switch configurations covering voltages from 600V to 3300V and currents up to 4800A. The GP1601FSS18 is a single switch 1800V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module. Designed with low VCE(SAT) to minimise conduction losses, the module is of particular relevance in low to medium frequency applications. The IGBT has a wide reverse bias safe operating area (RBSOA) ensuring reliability in demanding applications. The module incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise earthed heat sinks for safety. External connection Fig. 1 Single switch circuit diagram Aux C Aux E E1 C1 G ORDERING INFORMATION Order As: GP1601FSS18 Note: When ordering, please use the whole part number. E2 C2 Outline type code: F (See package details for further information) Fig. 2 Electrical connections - (not to scale) Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 1/9 www.dynexsemi.com GP1601FSS18 ABSOLUTE MAXIMUM RATINGS Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. Tcase = 25˚C unless stated otherwise Symbol VCES VGES IC IC(PK) Pmax Visol Parameter Collector-emitter voltage Gate-emitter voltage Continuous collector current Peak collector current Max. transistor power dissipation Isolation voltage Tcase = 70˚C for Tj = 125˚C 1ms, Tcase = 115˚C Tcase = 25˚C, Tj = 150˚C Commoned terminals to base plate. AC RMS, 1 min, 50Hz VGE = 0V Test Conditions Max. 1800 ±20 1600 3200 11.4 4000 Units V V A A kW V THERMAL AND MECHANICAL RATINGS Symbol Rth(j-c) Parameter Thermal resistance - transistor Test Conditions Continuous dissipation junction to case Rth(j-c) Thermal resistance - diode Continuous dissipation junction to case Rth(c-h) Thermal resistance - case to heatsink (per module) Mounting torque 5Nm (with mounting grease) Tj Junction temperature Transistor Diode Tstg Storage temperature range Screw torque Mounting - M6 Electrical connections - M4 Electrical connections - M8 –40 150 125 125 5 2 10 ˚C ˚C ˚C Nm Nm Nm 8 ˚C/kW 20 ˚C/kW Min. Max. 11 Units ˚C/kW 2/9 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com GP1601FSS18 ELECTRICAL CHARACTERISTICS Tcase = 25˚C unless stated otherwise. Symbol ICES Parameter Collector cut-off current Test Conditions VGE = 0V, VCE = VCES VGE = 0V, VCE = VCES, Tcase = 125˚C IGES VGE(TH) VCE(sat) Gate leakage current Gate threshold voltage Collector-emitter saturation voltage VGE = ±20V, VCE = 0V IC = 80mA, VGE = VCE VGE = 15V, IC = 1600A VGE = 15V, IC = 1600A, Tcase = 125˚C IF IFM VF Diode forward current Diode maximum forward current Diode forward voltage DC tp = 1ms IF = 1600A IF = 1600A, Tcase = 125˚C Cies LM Input capacitance Module inductance VCE = 25V, VGE = 0V, f = 1MHz Min. 4.5 Typ. 5.5 2.6 3.3 2.2 2.3 180 15 Max. 2 50 8 6.5 3.2 4 1600 3200 2.5 2.6 Units mA mA µA V V V A A V V nF nH Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 3/9 www.dynexsemi.com GP1601FSS18 ELECTRICAL CHARACTERISTICS Tcase = 25˚C unless stated otherwise Symbol td(off) tf EOFF td(on) tr EON Qrr Irr EREC Parameter Turn-off delay time Fall time Turn-off energy loss Turn-on delay time Rise time Turn-on energy loss Diode reverse recovery charge Diode reverse current Diode reverse recovery energy IF = 1600A, VR = 50% VCES, dIF/dt = 6000A/µs Test Conditions IC = 1600A VGE = ±15V VCE = 900V RG(ON) = RG(OFF) = 2.2Ω L ~ 50nH Min. Typ. 1500 300 850 400 300 500 300 750 200 Max. 1650 350 1050 550 450 700 400 Units ns ns mJ ns ns mJ µC A mJ Tcase = 125˚C unless stated otherwise Symbol td(off) tf EOFF td(on) tr EON Qrr Irr EREC Parameter Turn-off delay time Fall time Turn-off energy loss Turn-on delay time Rise time Turn-on energy loss Diode reverse recovery charge Diode reverse current Diode reverse recovery energy IF = 1600A, VR = 50% VCES, dIF/dt = 5000A/µs Test Conditions IC = 1600A VGE = ±15V VCE = 900V RG(ON) = RG(OFF) = 2.2Ω L ~ 50nH Min. Typ. 1700 300 1100 500 350 700 550 850 320 Max. 1900 380 1300 700 500 900 650 Units ns ns mJ ns ns mJ µC A mJ 4/9 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com GP1601FSS18 TYPICAL CHARACTERISTICS Vge = 20/15/12/10V 3200 2800 2400 Collector current, Ic - (A) Collector current, Ic - (A) Vge = 20/15/12/10V 3200 2800 2400 2000 1600 1200 800 400 0 0 Common emitter Tcase = 125˚C Common emitter Tcase = 25˚C 2000 1600 1200 800 400 0 0 1.0 2.0 3.0 4.0 Collector-emitter voltage, Vce - (V) 5.0 1.0 2.0 3.0 4.0 5.0 Collector-emitter voltage, Vce - (V) 6.0 Fig. 3 Typical output characteristics Fig. 4 Typical output characteristics 1200 Tcase = 125˚C VGE = ±15V VCE = 900V Rg = 2.2Ω 2000 1800 EOFF 1000 1600 1400 Tcase = 125˚C VGE = ±15V VCE = 900V IT = 1600A EON 800 Energy - (mJ) Energy - (mJ) 1200 1000 800 600 400 EOFF 600 EON 400 EREC 200 EREC 200 0 0 0 200 400 600 800 1000 1200 1400 Collector current, IC - (A) 1600 0 1 2 3 4 5 6 7 8 9 10 Gate resistance, RG - (Ohms) Fig. 5 Typical turn-on energy vs collector current Fig. 6 Typical turn-off energy vs collector current Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 5/9 www.dynexsemi.com GP1601FSS18 3200 2800 Tj = 25˚C 2400 2000 Tj = 125˚C 1600 3500 3000 1200 800 400 0 0 Collector current, IC - (A) 2500 Foward current, IF - (A) 2000 1500 1000 Conditions: Tcase = 125˚C, Vge = 15V, Rg(off) = 2.2Ω 0 200 400 600 800 1000 1200 1400 1600 1800 2000 500 0 0.5 2.0 1.0 1.5 2.5 Foward voltage, VF - (V) 3.0 3.5 Collector-emitter voltage, Vce - (V) Fig. 7 Diode typical forward characteristics Fig. 8 Reverse bias safe operating area 10000 IC max. (single pulse) 100 Transient thermal impedance, Zth(j-c) - (˚C/kW) 1000 Collector current, IC - (A) Diode IC C .D ax m ) us uo tin on (c 50µs 100µs 10 Transistor 100 tp = 1ms 1 10 1 1 10 100 1000 Collector-emitter voltage, Vce - (V) 10000 0.1 0.001 0.01 0.1 Pulse width, tp - (s) 1 10 Fig. 9 Forward bias safe operating area Fig. 10 Transient thermal impedance 6/9 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com GP1601FSS18 PACKAGE DETAILS For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 62 15 5 15 62 6 E1 Aux C C1 18.5 16 2.5 Aux E E2 C2 14.5 11 6x M4 35 20 4x M8 38 28 5 140 Nominal weight: 1600g Module outline type code: F Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 31.5 43.3 57 65 6x Ø7 G 18 57 65 7/9 www.dynexsemi.com GP1601FSS18 ASSOCIATED PUBLICATIONS Title Electrostatic handling precautions An introduction to IGBTs IGBT ratings and characteristics Heatsink requirements for IGBT modules Calculating the junction temperature of power semiconductors Gate drive considerations to maximise IGBT efficiency Parallel operation of IGBTs – punch through vs non-punch through characteristics Guidance notes for formulating technical enquiries Principle of rating parallel connected IGBT modules Short circuit withstand capability in IGBTs Driving Dynex Semincoductor IGBT modules with Concept gate drivers Application Note Number AN4502 AN4503 AN4504 AN4505 AN4506 AN4507 AN4508 AN4869 AN5000 AN5167 AN5384 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer service office. 8/9 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com GP1601FSS18 http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontarion, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Central Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Central Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2001 Publication No. DS5248-4 Issue No. 4.2 January 2001 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 9/9 www.dynexsemi.com