TLE82642EXUMA1

Product Information January 2008 The Robust Path to Automotive Networks www.infineon.com/transceivers * and representative offices Edition 2008 Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All rights reserved. 08-01-16 RZ Transceiver Umschlag.indd 16-1 Order no. B152-H8619-G1-X-7600 16.01.2008 12:22:06 Uhr Yo u r P a r t n e r o f C h o i ce f o r A u t o m o t i v e Communication Interfaces Embedded Power – Relay Driver ICs – TLE78xx: Application Example W O R L D L E A D E R I N A U T O M O T I V E electronics for 35 years, Infineon focuses on the in-vehicle networking, a major driver today for innovation in the LIN TRX VBAT VReg automotive field, meeting the ever-increasing demands of consumers for comfort, FUSE performance and safety. W I T H O V E R T E N Y E A R S ’ E X P E R I E N C E developing communication M interfaces, Infineon offers an extensive product line of transceivers, system basis chips and Embedded Power solutions for CAN and LIN protocols, from the mature to the advanced. Relay Driver C O N T I N U O U S L Y I M P R O V I N G its S P T chip technology, Infineon provides solutions for the challenges faced by the automotive industry, featuring the best ESD and EMC combined performances. 8-bit µC XC8xx I N T H I S B R O C H U R E Infineon introduces its transceivers and system + 5 V Supply Position Detection Hall Sensor PWM (optional) basis chips portfolio, with a detailed description of their distinctive key functions and benefits. T H E P R O D U C T B R I E F S I N C L U D E D provide a comprehensive overview current sensing via shunt (optional) of current products, as well as the latest product proposals. Reverse Polarity Protection needed F O R M O R E D E T A I L E D I N F O R M A T I O N visit the Infineon website at www.infineon.com / transceivers or contact your sales partner listed on the back of this brochure. Tool Support for ePower Relay Driver Evaluation Board TLE78xx Application Window Lift Module Power & LIN Interface Seat module JTAG Connector (debugging / programming) Sun-roof module Switch Inputs, Relay, LEDs available 8-Bit μC XC8xx: KEIL μVision C-Compiler, Assembler, Debugger and Programmer for Flash Memory 2 08-01-16 RZ Transceiver Umschlag.indd 2-15 GNU “Open Source” Tools available KEIL Real Time Operating System RTX51 15 16.01.2008 12:22:10 Uhr Infineon Transceivers and System Basis Chips The experience of a leading edge automotive electronics supplier Comprehensive product portfolio of stand-alone transceivers and standard on-chip solutions Outstanding ESD and EMC combined performances Protocol High Speed CAN Low Speed CAN Stand-alone TLE6250G / GV33 transceivers TLE6251DS TLE7259-2G TLE6251G TLE7269G TLE 6254-3G LIN High Speed CAN + LIN TLE6258-2G System TLE6263-3G TLE6285G TLE7263E Basis Chips TLE6266G TLE6286G TLE826xE TLE8458G TLE7810 Embedded Power Abbreviations SPT Smart Power Technology ESD Electro Static Discharge SBC System Basis Chip OEM Original Equipment Manufacturer EMC Electro Magnetic Compatibility LIN Local Interconnect Network CAN Controller Area Network ePower: Embedded Power 3 08-01-16 RZ Transceiver Gesamt.indd 3 16.01.2008 12:23:27 Uhr The Benefits of an Automotive Dedicated Technolog y Living Automotive Excellence B eca u se t r ansceive r s play a vital role in today’s more and more complex interconnected cars, developing ­innovative solutions is not enough. With the “Automotive Excellence” program Infineon can ensure the highest safety ­possible, implementing a zero-defect mind-set for processes, product development, production and logistics: no compromise when it comes to quality! First results can be recognized already. Average failure (ppm) for TLE6250G 1,60 DPM Field Delivery 1,51 1,40 volume in pcs/BY quarter 1,20 dpm 1,00 0,80 0,60 0,55 0,40 0,30 0,19 0,18 0,20 0,13 0,11 0,09 0,07 0,06 0,08 0,08 0,09 0,07 0,08 0,06 0,06 0,06 0,05 0,04 0,04 0,03 0,03 II/ I/2 00 2 20 0 III 2 /2 00 IV 2 /2 00 2 I/2 00 II/ 3 20 0 III 3 /2 0 IV 03 /2 00 I/2 3 00 II/ 4 20 0 III 4 /2 0 IV 04 /2 00 4 I/2 00 II/ 5 20 05 III /2 0 IV 05 /2 00 I/2 5 00 II/ 6 20 06 III /2 0 IV 06 /2 00 6 I/2 00 II/ 7 20 0 III 7 /2 00 IV 7 /2 00 7 0,00 0,15 DPM Field Delivery 4 08-01-16 RZ Transceiver Gesamt.indd 4 16.01.2008 12:23:27 Uhr robust Package: for a safer lead-free processing A N E L E M E N T O F T h E A u T O M O T I V E E x C E L L E N C E P r O G r A M , the robust package, significantly improves the reliability of both, the component and the application. This new package concept enables Infineon to address the lead-free requirements with improved quality, going beyond the today’s AEC Q101 specifications. Green and Robust package Solder Die Attach (PbSnAg) Low Stress / Molding Compound MC allowing increased solder reflow (260 °C) due to green requirement halogen free reducing thermomechanical stress in package Plating Robust Passivation lead free reducing passivation cracks and shifted metallisation Adhesion promoter providing good adhesion to all interfaces Robust package Stress test: Temperature Cycling (– 55 °C, + 150 °C) Preconditioning: 3 times solder reflow profile, 260 °C peak temp. Stress test: Autoclave (Temp. 121 °C, 100 % humidity) Preconditioning: 3 times solder reflow profile, 260 °C peak temp. Competition Competition Infineon Green & robust, SPT Technology Infineon Green & robust, SPT Technology Scanning acoustic microscope, ultrasonic images of the front, delamination in red (major) / yellow (minor) 5 08-01-16 RZ Transceiver Gesamt.indd 5 16.01.2008 12:23:29 Uhr ESD Robustness: holding the leadership in performance and innovation O ne of t h e specific c h allenges for a transceiver device is to withstand the harsh signals that occur on the bus, from ESD (Electro Static Discharges) to voltage peaks resulting from the parasitic inductances of bus cables. A robust ­transceiver also does not need expensive external protection components such a zener diodes or varistors. O ve r t h e past y ea r s Infineon developed and improved an innovative integrated protection that enables the ­dissipation of the energy, which is converted during an ESD event, through the chip from top to bottom. Silicon On Isolator (SOI) type technologies where the active side of the chip is decoupled from its bottom by an insulator do not allow such concepts. Infineons products can hold more than 10 kVolts of discharges using ISO 61000-4-2 test standard, an application oriented testing method that applies an energy which is five times higher than the standard HBM (Human Body Model) test that simulates typical handling events. resistance at bus pins (kV) Maximum ESD discharge ESD Robustness of TLE7259-2G in comparison with the competition +15 kV +15 kV Competition +1 kV +1 kV ISO 61000-4-2 150 pF / 330 T (without bus filter) Infineon TLE7259-2G ISO 61000-4-2 150 pF / 330 T (with bus filter C = 3.3 nF) resistance at bus pins (kV) Maximum ESD discharge ESD Robustness of TLE6251DS in comparison with the competition +13 kV +10 kV Competition +2 kV ISO 61000-4-2 150 pF / 330 T +1,5 kV Infineon TLE6251DS ISO 61000-4-2 150 pF / 2 kT 6 08-01-16 RZ Transceiver Gesamt.indd 6 16.01.2008 12:23:30 Uhr Stand-alone Transceivers High Speed CAN Transceivers Excellent robustness dedicated to a broad range TLE6251G – for permanently connected nodes of applications ­addition the supply for the entire node. Permanently powered A t fi r st u sed for powertrain networks, the High T h e T L E 6 2 5 1 G in a DSO-14 package controls in Speed Controller Area Network (CAN) is now the most used by the battery, it features a sleep mode with very low quiescent automotive protocol within the car, with bus speeds from current and an inhibit output to power up a voltage regulator, 125 kBauds to 1 Mbauds, offering an excellent cost to when getting either a remote wake-up from the bus or a local ­performance ratio. wake-up on the wake-up pin. Functions include a set of fail- Building on the success of the TLE6250, Infineon addresses safe flags, and a network failure diagnosis. the additional needs of today’s High Speed CAN automotive Infineon presents herewith a solution for the most advanced networks used for body and comfort applications. Thanks to its High Speed CAN automotive concepts. unique expertise, Infineon could even greatly improve the ESD robustness of its new products. Overall functional description, TLE6250G TLE6250G and TLE6250GV33 – becoming market standards A dopted b y most of the OEMs around the world, Output stage this device (TLE6250G for 5 V logic, TLE6250GV33 for 3.3 V Transmitter + Mode logic TLE6250G 3 Vcc logic) is a new market standard due to its important benefits: Excellent EMC performance Outstanding ESD robustness (6 kV Human Body Model) Receive-only mode CAN H 7 6 CAN L Driver Output stage Temp. protection 1 TxD Mode control TLE6251DS – ideal for partially powered network concepts 5 RM T h e T L E 6 2 5 1 D S in a standard DSO-8 package can Receiver be compared to the TLE6250 with an additional Bus wakeup capability. Bus reverse current is zero when the device is 8 INH 4 RxD GND 2 ­unpowered, so that it does not affect the rest of the network as an “invisible” node. This makes the TLE6251DS suitable Receiver for key-on nodes applications in partially powered networks. 7 08-01-16 RZ Transceiver Gesamt.indd 7 16.01.2008 12:23:31 Uhr Stand-alone Transceivers Low Speed CAN Transceivers Setting up a new reference T h e 1 2 5 k B a u d Fault Tolerant CAN physical layer became a standard in Europe for body and convenience networks because of its ability to switch from a differential Application example TLE6254-3G VBAT CAN Bus communication mode to a single-wire mode in the event of Choke1) TLE6254-3G an open or shorted bus wire. Infineon continuously improved 11 the performances and the functionalities of its Fault Tolerant 12 8 ­transceivers resulting in the advanced TLE6254-3G, establi- 9 shing a new reference on the Low Speed CAN transceiver 14 7 ­market. 1 CANH RxD CANL TxD RTH ENT RTL NSTB Vs NERR WK INH VCC 3 2 6 Microcontroller 5 4 10 GND GND TLE6254-3G – approved by most major car manufacturers T h e T L E 6 2 5 4 - 3 G benefits from a zero-fail ­certification Voltage regulator features such as: Low quiescent current in sleep mode and standby mode Receive-only mode preventing erratic messages VCC INH of the ICT (International Conformance Testing) and enhanced + Vs GND + 6 kV (Human Body Model) ESD robustness 1) Optional, according to car manufacturers’ requirements 8 08-01-16 RZ Transceiver Gesamt.indd 8 16.01.2008 12:23:32 Uhr LIN Transceivers Top performances for low-cost networking TLE7269G – the first ever Twin-LIN device L ocal I nte r connect N etwo r k (LIN) bus by allowing a basic local network connection between the CAN T h e T L E 7 2 6 9 G offers two LIN transceiver cells type TLE7259-2 in a SO14 package, which gives ­additional benefits: backbone and actuators, sensors or switches has tremendous­ Smaller overall board area ly reduced the design efforts and costs. It is thus used in a Integrated pull-up resistors to Vcc for logic pins fast-growing range of body and convenience applications. As Reduced total quiescent current an active member of the LIN consortium Physical Layer and Layout single / twinLIN scalability Conformance Tests working groups, Infineon has adapted its portfolio to the latest applications and norms. TLE6258-2G – a standard k-Line (ISO9141) and LIN transceiver Pin out TLE7269G T h e T L E 6 2 5 8 - 2 G is a cost-optimized solution suiting a broad range of designs: TLE7269G (P-DSO-14) Compatible to the LIN norms LIN 1.3, 2.1 TLE7259G Bus wake-up capability with low power mode (standby) Bus short to ground and battery protection TLE7259-2G – the enhanced Infineon LIN transceiver RxD1 1 14 INH1 EN 2 13 VS WK 3 12 BUS1 TxD1 4 11 GND TxD2 5 10 BUS2 Vio 6 9 W2O RxD2 7 8 INH2 T h e T L E 7 2 5 9 - 2 G offers a sleep mode in conjunction with an inhibit output pin to control the voltage regulator, mastering the whole node supply for an optimized overall ­consumption. The TLE7259-2G is a leading product combining outstanding benefits: Excellent EMC coupled to a strong ESD robustness Very low quiescent current and bus leakage current in sleep mode Compatibility to 3.3 V and 5 V logic Specific LIN 1.3, 2.1 version: TLE7259-2GE Specific SAE J 2602 version: TLE7259-2GU 9 08-01-16 RZ Transceiver Gesamt.indd 9 16.01.2008 12:23:36 Uhr System Basis Chips I nfineon h as developed several integrated components to enable the design of cost-effective, robust and Customer’s Benefit high-performance modules, to meet the harsh requirements of the automotive industry for quiescent current, system area and the design-in time significantly. The hardware is herewith costs. ­simplified, and the software can be adapted to fit to new Using a standa r d integrated solution, reduces requirements, enabling an efficient reuse of the running A s a well - establis h ed automotive supplier, designs. Infineon combines its experience with a wide portfolio of transceivers, voltage regulators, high side and low side switches, to design standard integrated solutions meeting the specific all the functions requiring a permanent connection to demands of its customers. the battery are integrated in one chip. The system cost can A ve r y low quiescent current is achieved, because be significantly reduced due to the fact that none of the T h e fle x ibilit y and performance of the SPT ­technology allows Infineon to use a systematic cell block additional external components required in a discrete solution are needed. approach, up-integrating already approved and qualified ­circuits. This allows a fast and reliable concept phase, and reduces the product time to market. early warning, window watchdog, temperature warning flag I nteg r ated f u nctions including low battery and over-temperature protection, meet the increasing need Typical car application for safety in the applications, with a minimum increase of cost or system area. Switches 5 V LDO Supervision CAN Bridges T h e devices can wo r k within wide battery ­voltage and temperature ranges. Fail-safe outputs allow the implementation of a “limp-home” hardware, in case of ­malfunctions in the vehicle. Microcontroller Sensor LIN SBC Common function of any automotive module Application dependent T h e I nfineon p r od u ct po r tfolio offers a wide range of protocols currently used by OEMs, High Speed CAN, Low Speed Fault Tolerant CAN and LIN. All products fit the ­relevant ISO standard and have ICT certification. 10 08-01-16 RZ Transceiver Gesamt.indd 10 16.01.2008 12:23:36 Uhr The Low Speed CAN SBCs A s a pionee r of System Basis Chips solutions, Block diagram TLE6266G Infineon has offered SBCs with Fault Tolerant Low Speed CAN OUTL1 interface since 1998, dedicated to body and convenience Charge pump modules. The products below benefit from the performances of the latest transceiver cell generation. Drive OUTL2 Drive VS TLE6263-3G – the universal body IC OUTH1 Switch fall defect Protection + Drive PWM OUTH2 T h e T L E 6 2 6 3 - 3 G meets the main smart power and Drive supply requirements, among the most important features: Fault Tolerant Low Speed CAN transceiver VCC Drive UVLO Voltage regulator (5 V / 150 mA) SPI Window watchdog module control, offering: Fault Tolerant Low Speed CAN transceiver Voltage regulator (5 V / 45 mA) 2 Low Side drivers LDO VCC RTL CANH Reset generator + Window watchdog RO Mode control WK H Output stage CANL RTH L Output stage Filter Receiver Fail management TLE6266G – the dedicated door module IC T h e T L E 6 2 6 6 G reflects the specific needs for door Timer Oscillator Band gap VS TxD Driver Temp. protect Input stage Window watchdog VCC VCC RxD 3 High Side drivers Local wake-up pin(s) DO VCC - + CLK DI 1 High Side driver (150 mA) Local wake-up pin(s) OUTH3 CSN CAN fail defect GND 11 08-01-16 RZ Transceiver Gesamt.indd 11 16.01.2008 12:23:37 Uhr The LIN SBCs I N F I N E O N P r O V I D E D one of the first LIN SBCs on TLE6285G and TLE6286G – smart cost and space optimization the market and is now extending its portfolio to provide ideal T W O F u N C T I O N S in one package covering standard alternative to common discrete component sets of LIN slave requirements: LIN Transceiver, LIN2.1 compliant control units. Voltage regulator (5 V / 150 mA) TLE8458G – for the simplest LIN applications Watchdog (TLE6286G) A C O S T E F F I C I E N T solution for LIN slave modes with Adjustable under-voltage reset (TLE6285G) SO16 standard package low power needs: LIN transceiver LIN 2.1 and J2602 compliant Voltage regulator (5 V / 40 mA) Local wake-up pin SO8 standard package Pin out TLE8458G TLE8458G rxD 1 8 VCC EN 2 7 VS Wk 3 6 uN TxD 4 5 GND 12 08-01-16 RZ Transceiver Gesamt.indd 12 16.01.2008 12:23:42 Uhr The high Speed CAN SBCs A M O N G T h E L A S T product developments, Infineon sets its know-how to meet the growing demand for high Speed TLE8261/2/3/4E – for flexible and scalable designs T h I S N E W P r O D u C T F A M I L y combines a cost CAN body networking, with higher supply capacity as well as optimized concept with a flexible supply capability and a optimized low power current consumption and extended safety scalable number of LIN cells over the four pin compatible benefits. family members: high Speed CAN Transceiver (with bus wake-up, bus failure TLE7263E – serves the most demanding needs diagnostics), ISO 11898-5 compliant for CAN to LIN gateways Multiple LIN cells from 0 (TLE8261E) to 3 (TLE8264E) T h E T L E 7 2 6 3 E meet the requirements for CAN to LIN Dual integrated voltage regulator (each 5 V / 150 mA) gateways commonly needed on Central Body Modules, climate External power transistor tracking (up to 5 V / 400 mA) or door modules, with enhanced safety features and a quies- 1 Local wake-up pin cent current als low as 60 µA : Window watchdog high Speed CAN Transceiver (with bus wake-up, bus failure Configurable Limp home output diagnostics), ISO11898-5 compliant LIN Transceiver, LIN2.1 and SAEJ2602 compliant Dual Voltage regulator Block diagram TLE7263 V1 (5 V / 150 mA) for microcontroller Vbat V2 (5 V / 150 mA) for internal CAN and external devices HS-CAN bus 1 high Side driver (150 mA) 4 Local wake-up pins Window watchdog Sense Input and fail-safe output HS-CAN Voltage reg. 2 SPI diagnostic/ctrl. Wake-up control Voltage reg. 1 Watchdog High-side switch LIN Fail safe output LIN-bus 13 08-01-16 RZ Transceiver Gesamt.indd 13 16.01.2008 12:23:46 Uhr Embedded Power E mbedded P owe r is a System in a Package (SiP) solution. It incorporates an 8-bit microcontroller compatible to the standard 8051 core with On-Chip debug Support (OCDS) and a System-Basis-Chip (SBC). The SBC is equipped with LIN / SAE J2602 compliant LIN Transceiver, low-dropout voltage regulator (LDO) as well as two low-side switches (relay driver) and supply (+ 5 V), e.g. to supply hall sensors (TLE4966). An additional high-side driver for driving LEDs is also available. F o r M ic r ocont r olle r supervision and additional protection of the circuit a programmable window watchdog circuit with a reset feature, supply voltage supervision and integrated temparture sensor is implemented. S B C , M ic r ocont r olle r and L I N module offer power modes in order to support terminal 30 connected ­automotive applications. A wake-up from the low power mode is possible via a LIN bus message or wake-up inputs. T h is integ r ated ci r c u it is realized as Multi-Chip-Module (MCM) in a P-DSO-28 and in P-DSO-52 package in the future, and is designed to withstand the severe conditions of automotive and industrial applications. Customer’s benefits: Cost efficiency and quality Embedded Power Product Family – Relay Driver TLE78xx VBAT Space saving Zero defect Features: 8-bit µController 8051 compatible Flash / EEPROM 10-bit A/D Converter 16-bit Timers On-Chip-Debug System Voltage Regulator LIN Transceiver High-Side Switches (Hall & SED Supply) SBC 8-bit µC Supply Output (Hall Sensor) Voltage Regulator 16/24/32 KB JTAG Flash Low-Side Switch 1 SPI Diagnostic / Ctrl. GPIOs Hall Sensor I/F Low-Side Switch 2 Watchdog Reset wake-up inputs Temp. / VBAT Measurement I/F 10-bit ADC LED-Driver LIN Serial I/F 2 x Low-Side Switch 5 x wake-up inputs Standard SPI Interface LIN-Bus 14 08-01-16 RZ Transceiver Gesamt.indd 14 16.01.2008 12:23:46 Uhr Yo u r P a r t n e r o f C h o i ce f o r A u t o m o t i v e Communication Interfaces Embedded Power – Relay Driver ICs – TLE78xx: Application Example W O R L D L E A D E R I N A U T O M O T I V E electronics for 35 years, Infineon focuses on the in-vehicle networking, a major driver today for innovation in the LIN TRX VBAT VReg automotive field, meeting the ever-increasing demands of consumers for comfort, FUSE performance and safety. W I T H O V E R T E N Y E A R S ’ E X P E R I E N C E developing communication M interfaces, Infineon offers an extensive product line of transceivers, system basis chips and Embedded Power solutions for CAN and LIN protocols, from the mature to the advanced. Relay Driver C O N T I N U O U S L Y I M P R O V I N G its S P T chip technology, Infineon provides solutions for the challenges faced by the automotive industry, featuring the best ESD and EMC combined performances. 8-bit µC XC8xx I N T H I S B R O C H U R E Infineon introduces its transceivers and system + 5 V Supply Position Detection Hall Sensor PWM (optional) basis chips portfolio, with a detailed description of their distinctive key functions and benefits. T H E P R O D U C T B R I E F S I N C L U D E D provide a comprehensive overview current sensing via shunt (optional) of current products, as well as the latest product proposals. Reverse Polarity Protection needed F O R M O R E D E T A I L E D I N F O R M A T I O N visit the Infineon website at www.infineon.com / transceivers or contact your sales partner listed on the back of this brochure. Tool Support for ePower Relay Driver Evaluation Board TLE78xx Application Window Lift Module Power & LIN Interface Seat module JTAG Connector (debugging / programming) Sun-roof module Switch Inputs, Relay, LEDs available 8-Bit μC XC8xx: KEIL μVision C-Compiler, Assembler, Debugger and Programmer for Flash Memory 2 08-01-16 RZ Transceiver Umschlag.indd 2-15 GNU “Open Source” Tools available KEIL Real Time Operating System RTX51 15 16.01.2008 12:22:10 Uhr Product Information January 2008 The Robust Path to Automotive Networks www.infineon.com/transceivers * and representative offices Edition 2008 Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All rights reserved. 08-01-16 RZ Transceiver Umschlag.indd 16-1 Order no. B152-H8619-G1-X-7600 16.01.2008 12:22:06 Uhr