EALP05RDLRA0

Lamp EALP05RDLRA0 Features ˙Popular T-1 3/4 round package. ˙High efficiency. ˙Available on tape and reel. ˙Reliable and robust. ˙UV resistant epoxy ˙The product itself will remain within RoHS compliant version. Descriptions ˙The series is specially designed for applications requiring higher brightness. ˙The LED lamps are available with different colors, intensities, epoxy colors, etc. Applications ˙Color Graphic Signs ˙Message boards ˙Variable message signs (VMS) ˙Commercial outdoor advertising 1 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29.Mar.2012. Issue No: 1 Rev:1 www.everlightamericas.com DATASHEET Lamp EALP05RDLRA0 Device Selection Guide Chip Materials Emitted Color Resin Color AlGaInP Brilliant Red Water clear Absolute Maximum Ratings (Ta=25℃ ℃) Parameter Symbol Rating Unit Reverse Voltage VR 5 V Forward Current IF 50 mA IFP 160 mA Pd 120 mW Topr -40 ~ +85 Tstg -40 ~ +100 ESDHBM 2000 Peak Forward Current (Duty 1/10 @1KHz) Power Dissipation Operating Temperature Storage Temperature ESD Soldering Temperature 2 Tsol Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29.Mar.2012. Issue No: 1 Rev:1 ℃ ℃ 260 ℃ for 5 sec. V www.everlightamericas.com DATASHEET Lamp EALP05RDLRA0 Electro-Optical Characteristics (Ta=25℃ ℃) Parameter Symbol Min. Typ. Max. Unit Condition Iv 4500 7150 11250 mcd IF=20mA 2θ1/2 -- 30 -- deg IF=20mA Peak Wavelength λp -- 632 -- nm IF=20mA Dominant Wavelength λd 619 624 628 nm IF=20mA Spectrum Radiation Bandwidth ∆λ -- 20 -- nm IF=20mA Forward Voltage VF 1.8 2.0 2.6 V IF=20mA Reverse Current IR -- -- 10 µA VR=5V Luminous Intensity Viewing Angle Bin Range of Luminous Intensity Bin Code Min. Max. Unit Condition R S T U 4500 5650 7150 9000 5650 7150 9000 11250 mcd IF =20mA Note: Tolerance of Luminous Intensity: ±10% Bin Range of Dominant Wavelength Bin Code Min. Max. Unit Condition 1 2 3 619 622 625 622 625 628 nm IF =20mA Bin Code Min. Max. Unit Condition 1 2 3 4 1.8 2.0 2.2 2.4 2.0 2.2 2.4 2.6 V IF =20mA Note: Tolerance of Dominant Wavelength: ±1nm Bin Range of Forward Voltage Note: Tolerance of Forward Voltage: ±0.1V 3 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29.Mar.2012. Issue No: 1 Rev:1 www.everlightamericas.com DATASHEET Lamp EALP05RDLRA0 Typical Electro-Optical Characteristics Curves ℃) ℃) Relative Intensity vs. Wavelength (Ta=25 Directivity (Ta=25 0.8 Radiation Angle Relative Intensity (a.u.) 1.0 0.6 0.4 0.2 0.0 450 500 550 600 650 700 Wavelength (nm) Relative Intensity (a.u.) ℃) ℃) Relative Intensity vs. Forward Current (Ta=25 50 2.5 40 2.0 Relative Intensity(a.u.) Forward Current (mA) Forward Current vs. Forward Voltage (Ta=25 30 20 10 1.5 1.0 0.5 0.0 0 1.0 1.5 2.0 2.5 3.0 3.5 0 10 Forward Voltage (V) 50 60 Forward Current (mA) Relative Intensity(a.u.) 40 Forward Current vs. Ambient Temp. 2.0 1.5 1.0 0.5 30 35 40 45 50 55 60 Ambient Temperature Ta(℃) 4 30 Forward Current (mA) Relative Intensity vs. Ambient Temp. 0.0 25 20 65 70 50 40 30 20 10 0 0 20 40 60 80 100 Ambient Temperature Ta(℃) Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29.Mar.2012. Issue No: 1 Rev:1 www.everlightamericas.com DATASHEET Lamp EALP05RDLRA0 Package Dimension Note: ˙Other dimensions are in millimeters, tolerance is 0.25mm except being specified. ˙Protruded resin under flange is 1.5mm Max LED. 5 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29.Mar.2012. Issue No: 1 Rev:1 www.everlightamericas.com DATASHEET Lamp EALP05RDLRA0 Moisture Resistant Packing Materials Label Explanation ‧CPN: Customer’s Product Number Product Number ‧QTY: Packing Quantity ‧CAT: Ranks of Luminous Intensity and Forward Voltage ‧HUE: Rank of Dominant Wavelength ‧REF: Reference ‧LOT No: Lot Number ‧P/N: Packing Specification ■ Anti-electrostatic bag ■ Inner Carton ■ Outside Carton Label Pb EL ECTR OSTATIC ELECTR ONAGNET IC MAGNETIC OR RADIOACTIVE RELDS anti-static for 750 ■ Packing Quantity 1. Min 200pcs to Max 500 PCS/1 Bag, 5 Bags/1 Inner Carton. 2. 10 Inner Cartons/1 Outside Carton 6 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29.Mar.2012. Issue No: 1 Rev:1 www.everlightamericas.com DATASHEET Lamp EALP05RDLRA0 Notes 1. Lead Forming
During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs.
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs. 2. Storage
The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight Americas and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. 3. Soldering
Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended.
Recommended soldering conditions: Hand Soldering 300℃ Max. (30W Temp. at tip of iron Max.) Soldering time 3 sec Max. Distance 3mm Min.(From solder joint to epoxy bulb) 7 DIP Soldering 100 ℃ Max. (60 sec Preheat temp. Max.) Bath temp. & time 260 Max., 5 sec Max Distance 3mm Min. (From solder joint to epoxy bulb) Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29.Mar.2012. Issue No: 1 Rev:1 www.everlightamericas.com DATASHEET Lamp EALP05RDLRA0
Recommended soldering profile laminar wave Fluxing Prehead
Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering.
Dip and hand soldering should not be done more than one time
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
Although the recommended soldering conditions are specified in the above table, dip or handsoldering at the lowest possible temperature is desirable for the LEDs.
Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4. Cleaning
When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than one minute. Dry at room temperature before use.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the LED. 5. Circuit Protection
Below the zener reference voltage Vz, all the current flows through LED and as the voltage rises to Vz, the zener diode “breakdown." If the voltage tries to rise above Vz current flows through the zener branch to keep the voltage at exactly Vz.
When the LED is connected using serial circuit, if either piece of LED is no light up but current can’t flow through causing others to light down. In new design, the LED is parallel with zener diode. if either piece of LED is no light up but current can flow through causing others to light up. 8 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29.Mar.2012. Issue No: 1 Rev:1 www.everlightamericas.com DATASHEET Lamp EALP05RDLRA0 6. Heat Management
Heat management of LEDs must be taken into consideration during the design stage of LED application. The current should be de-rated appropriately by referring to the de-rating curve found in each product specification.
The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating curve. 7. ESD (Electrostatic Discharge)
Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.
An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling LEDs.
All devices, equipment and machinery must be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of friction between LEDs during storage and handing. 8. Other
Above specification may be changed without notice. Everlight Americas will reserve authority on material change for above specification.
When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. Everlight Americas assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets.
These specification sheets include materials protected under copyright of Everlight Americas corporation. Please don’t reproduce or cause anyone to reproduce them without Everlight Americas' consent. 9 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29.Mar.2012. Issue No: 1 Rev:1 www.everlightamericas.com