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74VHC161284MEAX

74VHC161284MEAX

  • 厂商:

    FAIRCHILD(仙童半导体)

  • 封装:

  • 描述:

    74VHC161284MEAX - IEEE 1284 Transceiver - Fairchild Semiconductor

  • 数据手册
  • 价格&库存
74VHC161284MEAX 数据手册
74VHC161284 IEEE 1284 Transceiver February 1998 Revised June 2005 74VHC161284 IEEE 1284 Transceiver General Description The VHC161284 contains eight bidirectional data buffers and eleven control/status buffers to implement a full IEEE 1284 compliant interface. The device supports the IEEE 1284 standard and is intended to be used in Extended Capabilities Port mode (ECP). The pinout allows for easy connection from the Peripheral (A-side) to the Host (cable side). Outputs on the cable side can be configured to be either open drain or high drive (r 14 mA). The pull-up and pulldown series termination resistance of these outputs on the cable side is optimized to drive an external cable. In addition, all inputs (except HLH) and outputs on the cable side contain internal pull-up resistors connected to the VCC supply to provide proper termination and pull-ups for open drain mode. Outputs on the Peripheral side are standard LOW-drive CMOS outputs. The DIR input controls data flow on the A1– A8/B1–B8 transceiver pins. Features s Supports IEEE 1284 Level 1 and Level 2 signaling standards for bidirectional parallel communications between personal computers and printing peripherals s Replaces the function of two (2) 74ACT1284 devices s All inputs have hysteresis to provide noise margin s B and Y output resistance optimized to drive external cable s B and Y outputs in high impedance mode during power down s Inputs and outputs on cable side have internal pull-up resistors s Flow-through pin configuration allows easy interface between the Peripheral and Host Ordering Code: Ordering Number Package Number 74VHC161284MEA 74VHC161284MTD MS48A MTD48 Package Description 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Surface mount packages are also available on Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Logic Symbol Connection Diagram © 2005 Fairchild Semiconductor Corporation DS500098 www.fairchildsemi.com 74VHC161284 Pin Descriptions Pin Names HD DIR A1–A8 B1–B8 A9–A13 Y9–Y13 A14–A17 C14–C17 PLHIN PLH HLHIN HLH Description HIGH Drive Enable Input (Active HIGH) Direction Control Input Inputs or Outputs Inputs or Outputs Inputs Outputs Outputs Inputs Peripheral Logic HIGH Input Peripheral Logic HIGH Output Host Logic HIGH Input Host Logic HIGH Output Truth Table Inputs DIR L HD L Outputs B1–B8 Data to A1–A8, and A9–A13 Data to Y9–Y13 (Note 1) C14–C17 Data to A14–A17 PLH Open Drain Mode L H B1–B 8 Data to A1–A8, and A9–A13 Data to Y9–Y13 C14–C17 Data to A14–A17 H L A1–A8 Data to B1–B8 (Note 2) A9–A13 Data to Y9–Y13 (Note 1) C14–C17 Data to A14–A17 PLH Open Drain Mode H H A1–A8 Data to B1–B8 A9–A13 Data to Y9–Y13 C14–C17 Data to A14–A17 Note 1: Y9–Y13 Open Drain Outputs Note 2: B1–B8 Open Drain Outputs Logic Diagram www.fairchildsemi.com 2 74VHC161284 Absolute Maximum Ratings(Note 3) Supply Voltage VCC Input Voltage (VI) (Note 4) A1–A 13, PLHIN, DIR, HD B1–B8, C14–C17, HLHIN B1–B8, C14–C17, HLHIN Output Voltage (VO) A1–A8, A14–A17, HLH B1–B 8, Y9–Y13, PLH B1–B 8, Y9–Y13, PLH DC Output Current (IO) A1–A8, HLH B1–B8, Y9–Y13 PLH (Output LOW) PLH (Output HIGH) Input Diode Current (IIK) (Note 4) DIR, HD, A9–A13, PLH, HLH, C14–C17 Output Diode Current (IOK) A1–A8, A14–A17, HLH B1–B8, Y9–Y13, PLH DC Continuous VCC or Ground Current Storage Temperature ESD (HBM) Last Passing Voltage 2000V Recommended Operating Conditions Supply Voltage VCC DC Input Voltage (VI) Open Drain Voltage (VO) Operating Temperature (TA) 4.5V to 5.5V 0V to VCC 0V to 5.5V 0.5V to  7.0V 0.5V to VCC  0.5V 0.5V to  5.5V (DC) 2.0V to  7.0V * *40 ns Transient 40qC to  85qC 0.5V to VCC  0.5V 0.5V to  5.5V (DC) 2.0V to  7.0V* *40 ns Transient r25 mA r50 mA 84 mA 50 mA 20 mA r50 mA 50 mA r200 mA 65qC to  150qC Note 3: Absolute Maximum continuos ratings are those values beyond which damage to the device may occur. Exposure to these indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied. Note 4: Either voltage limit or current limit is sufficient to protect inputs. DC Electrical Characteristics Symbol VIK VIH Input Clamp Diode Voltage Minimum HIGH Level Input Voltage An, PLHIN, DIR, HD Bn Cn HLHIN VIL Maximum LOW Level Input Voltage An, PLHIN, DIR, HD Bn Cn HLHIN Parameter VCC (V) 3.0 4.5  5.5 4.5  5.5 4.5  5.5 4.5  5.5 4.5  5.5 4.5  5.5 4.5  5.5 4.5  5.5 4.5  5.5 4.5  5.5 5.0 5.0 4.5 4.5 Bn, Yn PLH 4.5 4.5 TA 40qC to 85qC 1.2 0.7 VCC 2.0 2.3 2.6 0.3 VCC 0.8 0.8 1.6 0.4 0.4 0.8 0.3 4.4 3.8 3.73 4.45 Units V II Conditions Guaranteed Limits 18 mA V V 'VT Minimum Input Hysteresis An, PLHIN, DIR, HD Bn Cn HLHIN V VT –VT VT  –VT VT  –VT VT  –VT VOH Minimum HIGH Level Output Voltage An, HLH IOH V IOH IOH IOH 50 PA 8 mA 14 mA 500 PA 3 www.fairchildsemi.com 74VHC161284 DC Electrical Characteristics Symbol VOL Parameter Maximum LOW Level Output Voltage (Continued) VCC (V) 4.5 4.5 4.5 4.5 5.0 5.0 5.0 5.0 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 0.0 0.0 0.0 5.5 HIGH). TA 40qC to 85qC 0.1 0.44 0.77 0.7 55 35 1650 1150 1.0 100 Units Conditions IOL 50 PA 8 mA 14 mA 84 mA Guaranteed Limits IOL IOL IOL An, HLH Bn, Yn PLH V RD RP IIH IIL IOZH IOZL IOFF IOFF IOFF  ICC ICC Maximum Output Impedance Minimum Output Impedance Maximum Pull-Up Resistance Minimum Pull-Up Resistance Maximum Input Current in HIGH State Maximum Input Current in LOW State Maximum Output Disable Current (HIGH) Maximum Output Disable Current (LOW) Power Down Output Leakage Power Down Input Leakage Power Down Leakage to VCC Maximum Supply Current B1–B8, Y9–Y13 B1–B8, Y9–Y13 B1–B8, Y9–Y13, C14–C17 B1–B8, Y9–Y13, C14–C17 A9–A13, PLHIN, HD, DIR, HLHIN C14–C17 A9–A13, PLHIN, HD, DIR, HLHIN C14–C17 A1—A8 B1–B8 A1—A8 B1–B8 B1–B8, Y9–Y13, PLH C14–C17, HLHIN : : : : PA PA mA (Note 5)(Note 6) (Note 5)(Note 6) VI VI VI VI VO VO VO VO VI VI 5.5V 5.5V 0.0V 0.0V 5.5V 5.5V 0.0V 5.5V 5.5V VCC or GND 1.0 5.0 20 100 PA PA mA 20 5.0 100 100 250 70 PA PA PA mA (Note 7) Note 5: Output impedance is measured with the output active LOW and active HIGH (HD Note 6: This parameter is guaranteed but not tested, characterized only. Note 7: Power-down leakage to VCC is tested by simultaneously forcing all pins on the cable-side (B1–B8, Y9–Y13, PLH, C14–C17 and HLHIN to 5.5V and measuring the resulting ICC. www.fairchildsemi.com 4 74VHC161284 AC Electrical Characteristics TA Symbol Parameter 40qC to 85qC 4.5V  5.5V Max 30.0 30.0 30.0 30.0 30.0 30.0 30.0 30.0 6.0 30.0 30.0 30.0 30.0 18.0 18.0 25.0 25.0 25.0 25.0 28.0 28.0 20.0 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Figure 5 Figure 4 Figure 6 (Note 10) Figure 1 Figure 2 Figure 3 Figure 3 Figure 1 Figure 2 Figure 3 Figure 3 (Note 9) Figure 1 Figure 2 Figure 3 Figure 3 Figure 7 Figure 8 Figure 9 Figure 2 Figure 2 Units Figure Number VCC Min 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 tPHL tPLH tPHL tPLH tPHL tPLH tPHL tPLH tSKEW tPHL tPLH tPHL tPLH tPHZ tPLZ tPZH tPZL tPHZ tPLZ tpEN tpDis tpEn–tpDis tSLEW tPLH tPHL tr, tf A1–A8 to B1–B8 A1–A8 to B1–B8 B1–B8 to A1–A8 B1–B8 to A1–A8 A9–A13 to Y9–Y13 A9–A13 to Y9–Y13 C14–C17 to A14–A17 C14–C17 to A14–A17 LH-LH or HL-HL PLHIN to PLH PLHIN to PLH HLHIN to HLH HLHIN to HLH Output Disable Time DIR to A1–A8 Output Enable Time DIR to A1–A8 Output Disable Time DIR to B1–B8 Output Enable Time HD to B1–B8, Y9–Y13 Output Disable Time HD to B1–B8, Y9–Y13 Output Enable-Output Disable Output Slew Rate B1–B8, Y9–Y13 tRISE and tFALL B1–B8, Y9–Y13 (Note 8) 0.05 0.05 0.40 0.40 120 120 V/ns ns Note 8: Open Drain Note 9: tSKEW is measured for common edge output transitions and compares the measured propagation delay for a given path type. (i) A1–A8 to B1–B8, A9–Y13 to Y9–Y13 (ii) B1–B8 to A1–A8 (iii) C14–C17 to A14–A17 Note 10: This parameter is guaranteed but not tested, characterized only. Capacitance (Note 11) Symbol CIN CI/O Parameter Input Capacitance I/O Pin Capacitance 1 MHz. Typ 5 12 Units pF pF VCC VCC 3.3V Conditions 0.0V (HD, DIR, A9—A13, C14—C17, PLHIN and HLHIN) Note 11: Capacitance is measured at frequency 5 www.fairchildsemi.com 74VHC161284 AC Loading and Waveforms Pulse Generator for all pulses: Rate d 1.0 MHz; ZO d 50:; tf d 2.5 ns, tr d 2.5 ns. FIGURE 1. Part A to B and A to Y Propagation Delay Load and Waveforms FIGURE 2. Port A to B and a to Y Output Waveforms FIGURE 3. Port B to A, C to A and HLHin to HLH Propagation Delay Waveforms www.fairchildsemi.com 6 74VHC161284 AC Loading and Waveforms (Continued) FIGURE 4. Port A to B and A to Y HL Slew Test Load and Waveforms FIGURE 5. Part A to b and A to Y LH Slew Test Load and Waveforms tr tf Output Rise Time, Open Drain Output Fall Time, Open Drain FIGURE 6. tRISE and tFALL Test Load and Waveforms for Open Drain Outputs A1–A8 to B1–B8, A9–A13 to Y9–Y13 7 www.fairchildsemi.com 74VHC161284 AC Loading and Waveforms (Continued) FIGURE 7. tPHZ and tPLZ Test Load and Waveforms, DIR to A1–A8 FIGURE 8. tPZH and tPZL Test Load and Waveforms, DIR to A1–A8 www.fairchildsemi.com 8 74VHC161284 AC Loading and Waveforms (Continued) FIGURE 9. tPHZ and tPLZ Test Load and Waveforms, DIR to B1–B8 9 www.fairchildsemi.com 74VHC161284 Physical Dimensions inches (millimeters) unless otherwise noted 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide Package Number MS48A www.fairchildsemi.com 10 74VHC161284 IEEE 1284 Transceiver Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Package Number MTD48 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 11 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com www.fairchildsemi.com
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