FDMS8690 N-Channel Power Trench® MOSFET
February 2007
FDMS8690 N-Channel Power Trench® MOSFET
30V, 27A, 9.0mΩ Features General Description
Max rDS(on) = 9.0mΩ at VGS = 10V, ID = 14.0A Max rDS(on) = 12.5mΩ at VGS = 4.5V, ID = 11.5A High performance trench technology for extremely low rDS(on) and gate charge Minimal Qgd (2.9nC typical) RoHS Compliant
tm
This device has been designed specifically to improve the efficiency of DC/DC converters. Using new techniques in MOSFET construction, the various components of gate charge and capacitance have been optimized to reduce switching losses. Low gate resistance and very low Miller charge enable excellent performance with both adaptive and fixed dead time gate drive circuits. Very low rDS(on) has been maintained to provide an extremely versatile device.
Application
High Efficiency DC-DC converters. Notebook CPU power supply Multi purpose Point of Load
Pin 1
S
S
S
G
D D D D
D D D D Power 56 (Bottom view)
5 6 7 8
4G 3S 2S 1S
MOSFET Maximum Ratings TA = 25°C unless otherwise noted
Symbol VDS VGS Parameter Drain to Source Voltage Gate to Source Voltage Drain Current ID -Continuous (Package limited) -Continuous (Silicon limited) -Continuous -Pulsed PD TJ, TSTG Power Dissipation Power Dissipation TC = 25°C TA = 25°C (Note 1a) TC = 25°C TC = 25°C TA = 25°C (Note 1a) Ratings 30 ±20 27 52 14 100 37.8 2.5 -55 to +150 W °C A Units V V
Operating and Storage Junction Temperature Range
Thermal Characteristics
RθJC RθJA Thermal Resistance, Junction to Case Thermal Resistance, Junction to Ambient (Note 1a) 3.3 50 °C/W
Package Marking and Ordering Information
Device Marking FDMS8690 Device FDMS8690 Package Power 56 Reel Size 13’’ Tape Width 12mm Quantity 3000 units
©2007 Fairchild Semiconductor Corporation FDMS8690 Rev.C2
1
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FDMS8690 N-Channel Power Trench® MOSFET
Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BVDSS ∆BVDSS ∆TJ IDSS IGSS Drain to Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate to Source Leakage Current ID = 250µA, VGS = 0V ID = 250µA, referenced to 25°C VDS = 24V , VGS = 0V VGS = ±20V, VDS = 0V 30 34 1 ±100 V mV/°C µA nA
On Characteristics
VGS(th) ∆VGS(th) ∆TJ rDS(on) Gate to Source Threshold Voltage Gate to Source Threshold Voltage Temperature Coefficient Drain to Source On Resistance VGS = VDS, ID = 250µA ID = 250µA, referenced to 25°C VGS = 10V, ID = 14.0A VGS = 4.5V, ID = 11.5A VGS = 10V, ID = 14.0A, TJ = 125°C 1 1.6 -4.5 7.4 9.9 10.6 9.0 12.5 13.3 mΩ 3 V mV/°C
Dynamic Characteristics
Ciss Coss Crss Rg Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance VDS = 15V, VGS = 0V, f = 1MHz f = 1MHz 1260 535 80 1.1 1680 715 120 5.0 pF pF pF Ω
Switching Characteristics
td(on) tr td(off) tf Qg(TOT) Qg(5) Qgs Qgd Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge at 10V Total Gate Charge at 5V Gate to Source Gate Charge Gate to Drain “Miller” Charge VGS = 0V to 10V VGS = 0V to 5V VDD = 15V ID = 14.0A VDD = 15V, ID = 1.0A VGS = 10V, RGEN = 6Ω 8 1.8 26 19 18.8 10 3.5 2.9 16 10 42 35 27 14 ns ns ns ns nC nC nC nC
Drain-Source Diode Characteristics
VSD trr Qrr Source to Drain Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0V, IS = 2.1A (Note 2) 0.7 1.2 45 33 V ns nC IF = 14.0 A, di/dt = 100A/µs
Notes: 1: RθJA is determined with the device mounted on a 1in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθCA is determined by the user's board design. a. 50°C/W when mounted on a 1 in2 pad of 2 oz copper b. 125°C/W when mounted on a minimum pad of 2 oz copper
2: Pulse Test: Pulse Width < 300µs, Duty cycle < 2.0%.
FDMS8690 Rev.C2
2
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FDMS8690 N-Channel Power Trench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
VGS = 10V
NORMALIZED DRAIN TO SOURCE ON-RESISTANCE
100 80 60 40 20 0 0.0
VGS = 3.5V PULSE DURATION = 80µs DUTY CYCLE = 0.5%MAX VGS = 4.5V VGS = 3V
2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0 20 40 60 ID, DRAIN CURRENT(A) 80 100
VGS = 10V VGS = 4.5V VGS = 3.5V VGS = 3V PULSE DURATION = 80µs DUTY CYCLE = 0.5%MAX
ID, DRAIN CURRENT (A)
0.5 1.0 1.5 2.0 2.5 VDS, DRAIN TO SOURCE VOLTAGE (V)
3.0
Figure 1. On-Region Characteristics
Figure 2. Normalized On-Resistance vs Drain Current and Gate Voltage
20
rDS(on), DRAIN TO SOURCE ON-RESISTANCE (mΩ)
PULSE DURATION = 80µs DUTY CYCLE = 0.5%MAX
NORMALIZED DRAIN TO SOURCE ON-RESISTANCE
1.6
PULSE DURATION = 80µS DUTY CYCLE = 0.5% MAX
1.4 1.2 1.0 0.8 0.6 -75
ID = 14A VGS = 10V
ID = 14A
16
TJ = 150oC
12
8
TJ = 25oC
-50
-25 0 25 50 75 100 125 150 o TJ, JUNCTION TEMPERATURE ( C)
4 2 4 6 8 VGS, GATE TO SOURCE VOLTAGE (V) 10
Figure 3. Normalized On- Resistance vs Junction Temperature
100
PULSE DURATION = 80µs DUTY CYCLE = 0.5%MAX
Figure 4. On-Resistance vs Gate to Source Voltage
200 100
VGS = 0V
ID, DRAIN CURRENT (A)
80 60 40 20 0 1.0
IS, REVERSE DRAIN CURRENT (A)
10
TJ = 150oC
1
TJ = 25oC
TJ = 150oC TJ = 25oC TJ =-55oC
0.1
TJ = -55oC
1.5
2.0
2.5
3.0
3.5
4.0
0.01 0.2
VGS, GATE TO SOURCE VOLTAGE (V)
0.4 0.6 0.8 1.0 1.2 VSD, BODY DIODE FORWARD VOLTAGE (V)
Figure 5. Transfer Characteristics
Figure 6. Source to Drain Diode Forward Voltage vs Source Current
FDMS8690 Rev.C2
3
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FDMS8690 N-Channel Power Trench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
VGS,GATE-SOURCE VOLTAGE(V) 10
ID= 14A
4000
CISS
VDD= 10V VDD= 15V
8 6 4 2 0 0 5
CAPACITANCE (pF)
1000
COSS
VDD= 20V
100
CRSS
f = 1MHz VGS = 0V
10 15 Qg,GATE CHARGE (nC)
20
10 0.1
1 10 VDS, DRAIN TO SOURCE VOLTAGE (V)
30
Figure 7. Gate Charge Characteristics
Figure 8. Capacitance vs Drain to Source Voltage
15 12
VGS = 10V
50 IAS, AVALANCHE CURRENT(A)
TJ = 25oC
10
TJ = 100oC
ID, DRAIN CURRENT (A)
9 6
VGS = 4.5V
TJ
= 125oC
3
RθJA = 50 C/W
o
1 1E-3
0.01
0.1
1
10
100 300
0 25
tAV, TIME IN AVALANCHE(ms)
50 75 100 125 TA, AMBIENT TEMPERATURE (oC)
150
Figure 9. Unclamped Inductive Switching Capability
200 100
ID, DRAIN CURRENT (A)
100us
Figure 10. Maximum Continuous Drain Current vs Ambient Temperature
2000 1000
P(PK), PEAK TRANSIENT POWER (W)
VGS = 10V
FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS:
10
1ms
100
I = I25
150 – T A ---------------------125 TA = 25oC
1
10ms 100ms 1s DC
10
0.1
OPERATION IN THIS AREA MAY BE LIMITED BY rDS(on)
SINGLE PULSE TJ = MAX RATED TA = 25oC
0.01 0.1
1
10
100
SINGLE PULSE 1 0.5 -4 -3 -2 10 10 10
10
-1
10
0
10
1
10
2
10
3
VDS, DRAIN-SOURCE VOLTAGE (V)
t, PULSE WIDTH (s)
Figure 11. Forward Bias Safe Operating Area
Figure 12. Single Pulse Maximum Power Dissipation
FDMS8690 Rev.C2
4
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FDMS8690 N-Channel Power Trench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
2
1 DUTY CYCLE - DESCENDING ORDER D = 0.5 0.2 0.1 0.05 0.02 0.01
NORMALIZED THERMAL IMPEDANCE ZθJA
0.1
PDM
0.01
t1 t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZθJA x RθJA + TA
SINGLE PULSE
1E-3
5E-4 -4 10
10
-3
10
-2
10 10 t, RECTANGULAR PULSE DURATION (s)
-1
0
10
1
10
2
10
3
Figure 13. Transient Thermal Response Curve
FDMS8690 Rev.C2
5
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FDMS8690 N-Channel Power Trench® MOSFET
FDMS8690 Rev.C2
6
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Rev. I23
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