FYLS-3528UWC

S MD FYLS-3528UWC Features: Chips can be controlled separately. Suitable for all SMT Assembly and solder process. Available on tape and Reel Package :2000pcs/ Reel Description. The White source color devices are made with Gallium arsenide Phosphide on Gallium Phosphide White light Emitting Diode. Package Dimensions 2 1 2 Polarity mark C0.8 1 Notes: 1. All dimension units are millimeters（Inches） 2. All dimension tolerance ±0.2mm unless otherwise noted. 3. An epoxy meniscus may extend about 1.5mm down the leads. S MD Selection Guide Part No. Dice lens type IV(mcd)@20mA Min FYLS-3528UWC White(InGaN) Yellow Diffused 1300 Viewing Angle 2θ1/2 120 Typ 2000 Electrical/Optical Characteristics at Ta=25 ゜с Symbol VF IR X Y Color Temperature Luminous Flux Parameter Forward Voltage Reverse Current Chromaticity Coordinates CCT Device White ---- min. 3.0 typ. 3.2 5 0.33 0.33 units V µA test conditions IF=20mA VR=5V --- 5000 --- 7000 6.5 K lm IF=20mA ΦV Absolute Maximum Ratings At= 25 ゜с Parameter Power dissipation DC Forward Current Peak Forward Current(1) Reverse Voltage Operating/storage Temperature White 114 30 150 5 -40℃ to +85℃ Units mW mA mA V Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. S MD Typical Electrical/Optical Characteristics Curves(Ta=25℃ Unless Otherwise Noted) Forward Current Vs Forward Voltage 50 40 30 20 10 0 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 Relative Luminous intensity vs Forward current Forward Current(mA) Relative Intensity (Lop@20mA=1) Forward Current IF(mA) Forward Voltage(V) Forward Current Derating Curve 60 Forward Current(mA) 50 40 30 20 10 0 0 10 20 30 40 50 60 70 80 90 InGaN/SiC InGaN/Al2O 3 Luminous Intensity Vs. Ambient Temperature Ambient Temperature TA( ) Relative Luminous Intensity Ambient Temperature TA( C ) S MD Precautions for use: 1. Suggest the LEDs should be kept between 5℃ and 30℃and 60%RH or less before opening the package, The max. storage period before opening the package is 1 year. 2. After opening the package, the LEDs should be kept at 30℃/35%RH or less, and it should be used within 1 hours. In the event of incomplete usage, it is advised that user preheat the remaining devices at 60±5℃ for 12 hours prior to use. 3. The temperature of manual of soldering not more then 300℃ within 2 sec. The temperature of Reflow soldering not more then 260℃ within 2 sec, should not be done more than twice. When soldering, don’t tress on LEDs during heating. After soldering, don’t warp the circuit board. 4. Repair should not be done after the LEDs have been soldered. When repair is unavoidable,Double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will be damaged by repair or not. (1) Reflow soldering Temperature profile Temperature Peak temperature Melting-point Pre-heat Soak Reflow Cooling Time Solder=Sn63-Pb37 Average ramp-up rate:4℃/sec.max Peak preheat temperature:100-150℃ preheat time:100seconds.max ramp-down rate:6℃/sec.max Peak temperature:230℃ Time within 5℃ of actual peak temperature=10 sec. max Duration above 183℃ is 80 sec. max Solder= Pb-Free Average ramp-up rate:4℃/sec.max Peak preheat temperature:100-150℃ preheat time:100seconds.max ramp-down rate:6℃/sec.max Peak temperature:250℃ Time within 5℃ of actual peak temperature=10 sec. max Duration above 217℃ is 80 sec. max S MD Recommended Soldering Pattern(Unit:mm) Taping Dimension (Unit:mm) Reel end of Tape no LED LED mounting part NO LED Reel Leed Min. 200mm Reel Leed Min. 200mm S MD Packing and Shipping Spec. L1 sb sb Zip-lock Desiccant Antistatic Bag W1 Desiccant Spec. Spec. 203.0. Spec. 198.0 Unit:mm Box Dimension(cm):30 * 19* 11.5 ) cs (p TY Q' . NO RT PA 10 Reels per box CARTON Dimension(cm):39*32*38 6boxs/carton 0603B/0603/0805: 4000pcs*10Reels*6boxs 0805B/1206B/1206 1210/1204: 3000pcs*10Reels*6boxs* 3528:2000pcs*10Reels*6boxs 5050:1000pcs*8Reels*6boxs S KG S KG W M G. 8C *3 W N. 8*31 3 : AS ME C/NO