FYLS-3528RGBC

S MD FYLS 3528RGBC FYL FYLS – 3528RGBC Features: Suitable for all SMT assembly and solder process. Available on tape and Reel Package :2000pcs/ Reel Description. The Red source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Red Light Emitting Diode. The Green source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Green Light Emitting Diode. The Blue source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Blue Light Emitting Diode. Static electrostatic glove when handling the LEDS. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices.equipment and machinery must be electrically grounded. Package Dimensions Notes: 1. All dimension units are millimeters（Inches） 2. All dimension tolerance ±0.2mm unless otherwise noted. 3. An epoxy meniscus may extend about 1.5mm down the leads. S MD Selection Guide IV(mcd)@20mA Part No. lens type RED(GaAsP /GaP) Min FYLS-3528RGBC Water clear 180 GREEN(GaP ) Min 280 Viewing Angle BLUE(GaP) Min 72 Typ 300 Typ 450 Typ 115 2θ1/2 120 Electrical/Optical Characteristics at Ta=25゜с Red Symbol λd C VF IR Green min 520 Blue units test conditions IF=30mA VF=0V,f=1MHz IF=30mA VR=5V Parameter min Dominate wavelength Capacitance Forward Voltage Reverse Current 2.3 622 typ. 626 35 2.6 5 typ. 525 45 min 466 typ. 470 45 3.6 5 nm pF V A 3.2 3.6 5 Absolute Maximum Ratings At= 25゜с Parameter Power dissipation DC Forward Current Peak Forward Current(1) Reverse Voltage Operating/storage Temperature Red 65 30 185 5 Green 95 25 150 Units mW mA mA V -40℃ to +85℃ Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. S MD Reliability Test items And Conditions The reliability of products shall be satisfied with items listed below. Confidence level:90% LTPD:10% NO. 1 Items Reflow test condition Temp:240℃±5℃ Min:5sec H: +100℃ 15min.～5min L:-40℃～ 15min test sample Ac/Rc Hours/Cycles Size 6Min 22pcs 0/1 2 Temperature cycle 300 Cycles 22pcs 0/1 3 4 5 6 7 High Thermal shock High Temperature Storage LOW Temperature Storage DC Operating Life Temperature /High Humidity H: +100℃ 5min.～10sec. L:-10℃ 5min temp:100℃ temp:-55℃ IF=20mA 85℃/R,H80% 300 Cycles 1000hrs. 1000hrs. 1000hrs. 1000hrs. 22pcs 22pcs 22pcs 22pcs 22pcs 0/1 0/1 0/1 0/1 0/1 S MD SMT Reflow Soldering Instuctions Number of reflow process shall be less than 2 times and cooling Process to normal temperature is required between first and second soldering process Temperature Profile (lead Solder) 230°c 4°c/sec max 8sec max 260°c Temperature Profile (lead Solder) 4°c/sec max 5sec max 140-160°c 60sec.max Above 200°c 180-200°c 60sec.max Above 220°c Temperature Temperature 4°c/sec max OVER 120 sec 4°c/sec max OVER 120 sec Time Time Recommended Soldering Pattern(Units:mm) S MD Packing Packing and Shipping Spec. L1 sb sb Zip-lock Desiccant Antistatic Bag W1 Desiccant Spec. Spec. 203.0. Spec. 198.0 Unit:mm Box Dimension(cm):30 * 19* 11.5 ) cs (p TY Q' . NO RT PA 10 Reels per box CARTON Dimension(cm):39*32*38 6boxs/carton 0603B/0603/0805: 4000pcs*10Reels*6boxs 0805B/1206B/1206 1210/1204: 3000pcs*10Reels*6boxs* 3528:2000pcs*10Reels*6boxs 5050:1000pcs*8Reels*6boxs S KG KG W M G. 8C *3 W 31 N. 8* :3 AS S C/NO ME S MD