ME810A-HV35R-BK

ME810A-HV35R module Datasheet Version 1.1 D oc ument Reference N o.: FT _001232 C learance N o.: FT DI# 468 Future Technology Devices International Datasheet ME810A-HV35R Display Module General Purpose Multi Media Controller 1 Introduction 1.1 Features The ME810A-HV35R is a development module for FTDI’s FT810, Embedded Video Engine (EVE) graphics controller IC. This module behaves as an SPI slave, and requires a SPI Master for proper micro-controller interface and system integration. The ME810A-HV35R module includes a 3.5 inch 320*480, portrait TFT LCD panel with resistive touch screen and buzzer for audio output. Users can also connect to different LCD screens which meet the FT810 technical specification and fit with the ME810A-HV35R LCD interface connector. The ME810A-HV35R utilises the FTDI FT810 Embedded Video Engine. Graphic, audio and touch features of the FT810 can be accessed with the ME810A-HV35R. For a full list of the FT810’s features, please see the FT81x datasheet. The ME810A-HV35R has the following features:  Ready to use LCD module.  Supports resistive touch with pressure sensing.  Supports portrait and landscape display mode.  Supports mono audio output.  On board LCD backlight LED driver.  On board buzzer with a transistor control.  +3.3V single power supply.  Supports configurable LCD with 4-line SPI.  Direct connect with MM900EV module series as a display module.  Bezel with four mounting holes for system assembly. N either the whole nor any part of the information c ontained in, or the product desc ribed in this manual, may be adapted or reproduced in any material or electronic form without the prior written cons ent of the copyright holder. This product and its documentat ion are s upplied on an as-is basis and no warranty as to their s uitability for any partic ular purpose is either made or implied. Future T ec hnology D evices International L td will not accept any claim for damages hows oever aris ing as a res ult of us e or failure of this produ c t. Y our s tatutory rights are not affec ted. T his produc t or any varian t of it is not intended for use in any medical appliance, device or sys tem in whic h the failure of the produc t might reasonably be expec ted to res ult in personal injury. T his doc ument provides preliminar y information that may be s ubjec t to c hange without n otice. N o freedom to us e patents or other intellec tual property rights is implied by the public ation of this document. Future Tec hnology Devic es I nternational Ltd, U nit 1 , 2 Seaward P lace, C enturion Business Pa rk, G las gow G 4 1 1 HH U nited Kingdom. Sc otland R egistered Company N umber: SC136640 Copyright © Future Technology Devices International Limited 1 ME810A-HV35R module Datasheet Version 1.1 D oc ument Reference N o.: FT _001232 C learance N o.: FT DI# 468 2 Ordering Information Part No. Description ME810A-HV35R-BK FT810 module, with FPC/FFC 50 LCD connector, 3.5 inch TFT LCD display panel preinstalled with resistive touch. Black bezel. ME810A-HV35R-PL FT810 module, with FPC/FFC 50 LCD connector, 3.5 inch TFT LCD display panel preinstalled with resistive touch. Pearl bezel. Table 2-1 – Ordering information Note: This module is recommended as an accessory to the MM900EV series (due Nov 2015) for development purposes. For more information on the MM900EV series, refer to: http://www.ftdichip.com/Products/ICs/FT90x.html. Copyright © Future Technology Devices International Limited 2 ME810A-HV35R module Datasheet Version 1.1 D oc ument Reference N o.: FT _001232 C learance N o.: FT DI# 468 Table of Contents 1 Introduction ................................................................. 1 1.1 Features ................................................................................ 1 2 Ordering Information .................................................... 2 3 Board Interface Description .......................................... 4 3.1 Board Profile .......................................................................... 4 3.2 J1- SPI interface and control signals ....................................... 5 3.3 JP1- On board buzzer enable .................................................. 5 4 Application Example...................................................... 6 4.1 Getting Start With an MM900EV Module .................................. 6 4.2 Hardware Setup ..................................................................... 6 4.3 Software Setup ...................................................................... 7 5 Mechanical Dimensions ................................................. 8 5.1 J1 Pin Header Dimensions ...................................................... 8 5.2 Bezel Mechanical Drawing ...................................................... 9 5.3 Board Schematics .................................................................10 6 Specifications ............................................................. 11 6.1 Electrical Specification ..........................................................11 6.2 Display Specification .............................................................11 6.3 Optical Specification..............................................................12 7 Contact Information .................................................... 13 Appendix A - References .................................................. 14 Document References ...................................................................14 Acronyms and Abbreviations .........................................................14 Appendix B - List of Figures and Tables ............................ 15 List of Figures ...............................................................................15 List of Tables ................................................................................15 Appendix C – Revision History.......................................... 16 Copyright © Future Technology Devices International Limited 3 ME810A-HV35R module Datasheet Version 1.1 D oc ument Reference N o.: FT _001232 3 C learance N o.: FT DI# 468 Board Interface Description The ME810A-HV35R module is intended for direct use into existing applications that require a display. This module is suitable for interfacing with an external microcontroller (e.g. MM900EV series ) that has a SPI Master channel. 3.1 Board Profile Figure 3-1 – ME810A-HV35R board bottom view Copyright © Future Technology Devices International Limited 4 ME810A-HV35R module Datasheet Version 1.1 D oc ument Reference N o.: FT _001232 C learance N o.: FT DI# 468 3.2 J1- SPI interface and control signals Pin No. Name Type Description 1 J1_SC K I SPI clock input 2 J1_C S0# I FT810 SPI chip select, active low 3 J1_MISO I/O SPI master input, slave output or QSPI IO1 4 J1_MOSI I/O SPI master output, slave input or QSPI IO0 5 J1_IO3 I/O FT810 GPIO1 or QSPI IO3 6 J1_IO2 I/O FT810 GPIO0 or QSPI IO2 LC D panel data / command selection pin 7 J1_DC X I Low: C ommand High: Parameter 8 J1_C S1# I LC D panel SPI chip select, active low 9 J1_3V3 P 3.3V power supply input 10 J1_5V P NC 11 GND P Ground 12 GND P Ground 13 J1_PD# I FT810 powers down input, active low. C onnect to 3.3V if not used. 14 J1_INT# O FT810 interrupts output, active low. On board 10kΩ pull-up to 3.3V. 15 J1_AUDL O FT810 PWM audio output 16 J1_DISP I LC D display reset. C onnect to GND if not used. Table 3-1 – J1 Pinout 3.3 JP1- On board buzzer enable Jumper fitted by default. Remove the jumper to disable the buzzer. Copyright © Future Technology Devices International Limited 5 ME810A-HV35R module Datasheet Version 1.1 D oc ument Reference N o.: FT _001232 4 C learance N o.: FT DI# 468 Application Example 4.1 Getting Start With an MM900EV Module As a quick start with the ME810A-HV35R development board, connecting to an MM900EV module development platform is recommended. Demo applications are provided for users to experiment and experience the FT810 in the ME810A system. The following paragraphs provide a short description for development procedures. The MM900EV series of FT900 MCU evaluation platforms allows user to develop various applications with rich peripheral interfaces. The following MM900EV modules are compatible:   MM900EV1A: with a 32-bit high performance FT900 MCU, 10/100Mbps Ethernet, USB2.0 Host, USB2.0 Device, SD3.0, Audio Codec, SPI Master Quad Interface, and 40-pin external GPIOs. MM900EV-Lite: Tiny board with a 32-bit high performance FT900 MCU, USB2.0 Device, SD3.0, SPI Master Quad Interface, and 40-pin external GPIOs. Detailed information of MM900EV module can be found at: http://www.ftdichip.com/Products/ICs/FT90x.html 4.2 Hardware Setup Figure 4-1 shows the ME810A-HV35R module connected to an MM900EV-Lite module. Figure 4-1 – ME810A-HV35R connects to MM900EV Module Copyright © Future Technology Devices International Limited 6 ME810A-HV35R module Datasheet Version 1.1 D oc ument Reference N o.: FT _001232 C learance N o.: FT DI# 468 The ME810A-HV35R J1 pin header connects to the MM900EV module J2 dual-enter socket (See Table 4-1 for pin mapping).  Connect a USB cable or Power Supply to the MM900EV module to power the system. Pin number J1 Signal J2 Signal 1 J1_SCK SPIM_SCK 2 J1_CS0# SPIM_SS0 3 J1_MISO SPIM_MISO 4 J1_MOSI SPIM_MOSI 5 J1_IO3 SPIM_IO3 6 J1_IO2 SPIM_IO2 7 J1_DCX DCX 8 J1_CS1# CS1# 9 J1_3V3 VDD_3V3 10 NC VDD_5V 11 GND GND 12 GND GND 13 J1_PD# PWD# 14 J1_INT# INT# 15 J1_AUDL AUD_LIN 16 J1_DISP DISP Table 4-1 – ME810A-HV35R J1 and MM900EV module J2 connection 4.3 Software Setup  Download the FT90x toolchain and sample application for ME810A-HV35R from the FTDI website at http://www.ftdichip.com/Products/ICs/FT90x.html.  Install the FT90x toolchain on a Windows PC.  Download the sample application binary file to the MM900EV module. The sample applications will demonstrate display, touch and audio functions of the ME810A-HV35R module. Refer to AN_381_ME810A_HV35R_Sample_Application for more details. Copyright © Future Technology Devices International Limited 7 ME810A-HV35R module Datasheet Version 1.1 D oc ument Reference N o.: FT _001232 5 C learance N o.: FT DI# 468 Mechanical Dimensions 5.1 J1 Pin Header Dimensions J1 pin header is a 2x8 way, 2.54mm pitch vertical pin. The Figure 6-2 illustrates the first pin dimensions and pin header parameters (in millimeters). Figure 5-1 – J1 Pin Header Dimensions Copyright © Future Technology Devices International Limited 8 ME810A-HV35R module Datasheet Version 1.1 D oc ument Reference N o.: FT _001232 C learance N o.: FT DI# 468 5.2 Bezel Mechanical Drawing Figure 5-2 – Bezel dimensions Copyright © Future Technology Devices International Limited 9 ME810A-HV35R module Datasheet Version 1.1 SP1 [BUZZER] JP1 1 2 EVE_3V3 Q1 D1 1N4148 T_NPN C2 C3 0.1uF EVE_3V3 U2 4 OE GND 2 1 2 4 6 8 10 12 14 16 33R J1_5V AUDIO_L R13 10K EVE_SCK EVE_MISO EVE_MOSI EVE_CS0# EVE_IO2 EVE_IO3 EVE_INT# EVE_PD# [CS0] [DATA0] [DATA2] [CS1] J1_INT# [Interrupt output] J1_DISP [Display] J1_CS0# J1_MOSI J1_IO2 J1_CS1# R17 SN74LVC1G125DBVR J1_3V3 J1 EVE_AUDL GND 4.7uF R16 2.55K J1_SCK J1_MISO J1_IO3 J1_DCX 2 4 6 8 10 12 14 16 R14 10K 1 2 3 4 5 6 7 8 9 10 11 12 C8 18pF EVE_3V3 R29 100k U1 AUDIO_L GND SCK MISO/IO1 MOSI/IO0 CS_N GPIO0/IO2 GPIO1/IO3 VCCIO1 GPIO2 INT_N PD_N Y1 12MHz C7 18pF GND R37 R15 33R 33R 33R 33R EVE_IO2 EVE_CS0# EVE_MOSI EVE_MISO EVE_SCK EVE_DISP 600R/0.5A FB2 EVE_3V3 C13 GND C14 C16 EVE_3V3 C11 FT810 GND B2 B3 B4 B5 B6 B7 DCLK DISP HSYNC VSYNC DE C12 C18 4.7uF 0.1uF LCD_3V3 GND C17 GND 0.1uF 0.1uF C15 GND 4.7uF 0.1uF 36 35 34 33 32 31 30 29 28 27 26 25 R2 R3 R4 R5 R6 R7 G2 G3 G4 G5 G6 G7 B2 B3 B4 B5 B6 B7 1 R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R18 R20 R21 R22 R23 R24 R25 R19 R26 R27 R28 BCKL YM XM YP XP 330R 330R 330R 330R 330R 330R 330R 330R 330R 330R 330R 330R C4 330R 330R 330R 330R 330R 330R 330R 330R 330R 330R 330R LCD_B2 LCD_B3 LCD_B4 LCD_B5 LCD_B6 LCD_B7 LCD_G2 LCD_G3 LCD_G4 LCD_G5 LCD_G6 LCD_G7 C6 LCD_R2 LCD_R3 LCD_R4 LCD_R5 LCD_R6 LCD_R7 DCLK C5 U3 EN 0.1uF C1 LCD_3V3 1 2 U4 600R/0.5A FB1 EVE_3V3 GND OE LCD_3V3 4 GND LEDK LEDK LEDA LCD_3V3 LCD_RST EVE_CS1# EVE_DCX EVE_SCK 33R 33R 33R 33R EVE_MOSI LCD_SDO LCD_B2 LCD_B3 LCD_B4 LCD_B5 LCD_B6 LCD_B7 LCD_G2 LCD_G3 LCD_G4 LCD_G5 LCD_G6 LCD_G7 LCD_R2 LCD_R3 LCD_R4 LCD_R5 LCD_R6 LCD_R7 DE DCLK HSYNC VSYNC R30 10K R31 10K R32 10K R33 R34 R35 R36 1 exposed copper exposed copper PAD2 1 PAD1 YP XM YM XP LCD_3V3 SN74LVC1G125DBVR LCD_RST EVE_MISO U5 4 4 5 6 74V1G32 LED3 LED2 LED1 GND DS9300A LED4 GND EVE_3V3 DISP HSYNC VSYNC DE 1 2 GNDGNDGND 3 2 1 U6 SN74LVC1G08DBVR 4 EVE_3V3 [FT900 GPIO] EVE_DISP [FT810 GPIO] DISP LCD_RST 2 GND BCKL GND 5 3 SMD XL1 Shunt 2.0mm GND [CLK] [DATA1] [DATA3] [Data/Cmd] 1 3 5 7 9 11 13 15 1 3 5 7 9 11 13 15 8x2 Male SMD Pin Header GND J1_DISP R38 33R EVE_IO3 GND J1_SCK R39 33R EVE_CS1# GND J1_MISO R40 33R EVE_DCX I/O Daughter J1_MOSI R41 33R EVE_PD# GND 0.1uF 0.1uF 5 3 [Power down] J1_PD# [Audio ouput] J1_AUDL GND J1_CS0# R42 33R EVE_INT# VCORE_1V2 J1_IO2 R43 33R J1_3V3 J1_IO3 R44 33R C10 J1_CS1# R45 C9 J1_DCX R46 EVE_AUDL 0.1uF J1_PD# 33R 4.7uF J1_INT# R47 VCORE_1V2 J1_AUDL 5 3 49 48 47 46 45 44 43 42 41 40 39 38 37 EP R2 R3 R4 R5 R6 R7 G2 G3 G4 G5 G6 G7 X1/CLK X2 GND VCC VOUT1V2 VCC XP YP XM YM GND BACKLIGHT 13 14 15 16 17 18 19 20 21 22 23 24 5 3 YU XL YD XR GND GND GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 GND LEDA LEDK1 LEDK2 LEDK3 LEDK4 LEDK5 LEDK6 GND GND VCC VCC REST CSX RS WRX(SCL) RDX SPI-SDA SDO DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 DB8 DB9 DB10 DB11 DB12 DB13 DB14 DB15 DB16 DB17 DE PCLK HSYNC VSYNC IM2 IM1 IM0 GND YU [Top] XL [Left] YD [Bottom] XR [Right] GND CN1 DISP1 KD035C-11-TP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 CN_50Pin_FPC/FFC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 10 Copyright © Future Technology Devices International Limited C learance N o.: FT DI# 468 D oc ument Reference N o.: FT _001232 5.3 Board Schematics Figure 5-3 – Board Schematic ME810A-HV35R module Datasheet Version 1.1 D oc ument Reference N o.: FT _001232 6 C learance N o.: FT DI# 468 Specifications 6.1 Electrical Specification Parameter Description Minimum Typical Maximum Units VCC VCC operating supply voltage 3.0 3.3 3.6 V Icc VCC operating current Voh Output Voltage High VCC-0.4 - - V Vol Output Voltage Low - - 0.4 V Vih Input High Voltage 2.0 - - V Vil Input Low Voltage - - 0.8 V T Operating temperature -20 - +70 ℃ 110 mA Notes J1 pin 9 Backlight LED on Table 6-1 - Operating Voltage and Current 6.2 Display Specification Item Spec Units Display area(AA) 49.0(H) * 73.4(V) mm Driver Element TFT active matrix mA Display Colors 262K - Number of Pixels 320(RGB)*480 dots Pixel pitch 0.051(H) * 0.051(V) mm Viewing Angle 6:00 o’clock Display mode Transmissive/ Normally White - LCD Luminance 100 cd/m2 Touch screen resistive Table 6-2 - LCD and Touch Information Notes 3.5 inch diagonal - Copyright © Future Technology Devices International Limited 11 ME810A-HV35R module Datasheet Version 1.1 D oc ument Reference N o.: FT _001232 C learance N o.: FT DI# 468 6.3 Optical Specification Table 6-3 - 3.5” TFT Optical specification Copyright © Future Technology Devices International Limited 12 ME810A-HV35R module Datasheet Version 1.1 D oc ument Reference N o.: FT _001232 7 C learance N o.: FT DI# 468 Contact Information Head Office – Glasgow, UK Branch Office – Tigard, Oregon, USA Unit 1, 2 Seaward Place, Centurion Business Park Glasgow G41 1HH United Kingdom Tel: +44 (0) 141 429 2777 Fax: +44 (0) 141 429 2758 7130 SW Fir Loop Tigard, OR 97223 USA Tel: +1 (503) 547 0988 Fax: +1 (503) 547 0987 E-mail (Sales) E-mail (Support) E-mail (General Enquiries) E-Mail (Sales) E-Mail (Support) E-Mail (General Enquiries) sales1@ftdichip.com support1@ftdichip.com admin1@ftdichip.com us.sales@ftdichip.com us.support@ftdichip.com us.admin@ftdichip.com Branch Office – Taipei, Taiwan Branch Office – Shanghai, China 2F, No. 516, Sec. 1, NeiHu Road Taipei 114 Taiwan , R.O.C. Tel: +886 (0) 2 8797 1330 Fax: +886 (0) 2 8751 9737 Room 1103, No. 666 West Huaihai Road, Shanghai, 200052 C hina Tel: +86 (0)21 6235 1596 Fax: +86 (0)21 6235 1595 E-mail (Sales) E-mail (Support) E-mail (General Enquiries) E-mail (Sales) E-mail (Support) E-mail (General Enquiries) tw.sales1@ftdichip.com tw.support1@ftdichip.com tw.admin1@ftdichip.com cn.sales@ftdichip.com cn.support@ftdichip.com cn.admin@ftdichip.com Web Site http://ftdichip.com Distributor and Sales Representatives Please visit the Sales Network page of the FTDI Web site for the contact details of our distributor(s) and sales representative(s) in your country. System and equipment manufac turers and des igners are res pons ible to ens ure that their sys tems , and any Future T ec hnology Devices I nternational Ltd (FTDI ) devic es incorporated in their s ystems , meet all applicable safety, regulatory and sys tem-level performanc e requirements . All application- related information in this doc ument (including applic ation desc riptions , s uggested FTDI devic es and other materials ) is provided for reference only. While FTDI has taken c are to ass ure it is acc urate, this information is s ubjec t to c us tomer c onfirmation, and FTDI disclaims all liability for sys tem designs and for any applic ations assis tanc e provided by FTDI . Us e o f FTDI devic es in life s upport and/or safety applications is entirely at the us er’s risk, and the us er agrees to defend, indemnify and hold harmless FTDI from any and all damages , claims , s uits or expens e resulting from s uch use. T his doc ument is s ubject to change without notice. N o freedom to use patents or other intellec tual property rights is implied by the publication of this doc u ment. N either the whole nor any part of the information c ontained in, or the product desc ribed in this document, may be adapted or reproduced in any material or elec tronic form without the prior written c onsent of the c opyright holder. Future Tec hnology D e vices I nternational L td, U nit 1 , 2 Seaward P lac e, C enturion Business P ark, G lasgow G 4 1 1HH, U nited Kingdom. Sc otland Registered Company N umber: SC136640 Copyright © Future Technology Devices International Limited 13 ME810A-HV35R module Datasheet Version 1.1 D oc ument Reference N o.: FT _001232 C learance N o.: FT DI# 468 Appendix A - References Document References For module documentations, please refer to URL below: FT81x datasheet: DS_FT81x FT81x software programming guide: FT81x_Programmer_Guide Acronyms and Abbreviations Terms EVE IC Description Embedded Video Engine Integrated Circuit LCD Liquid Crystal Display LED Light Emitting Diode PC Personal Computer SPI Serial Peripheral Interface TFT Thin Film Transistor Copyright © Future Technology Devices International Limited 14 ME810A-HV35R module Datasheet Version 1.1 D oc ument Reference N o.: FT _001232 C learance N o.: FT DI# 468 Appendix B - List of Figures and Tables List of Figures Figure 3-1 – ME810A-HV35R board bottom view ..................................................................................... 4 Figure 4-1 – ME810A-HV35R connects to MM900EV Module .................................................................... 6 Figure 5-1 – J1 Pin Header Dimensions ................................................................................................... 8 Figure 5-2 – Bezel dimensions ................................................................................................................ 9 Figure 5-3 – Board Schematic............................................................................................................... 10 List of Tables Table 2-1 – Ordering information............................................................................................................ 2 Table 3-1 – J1 Pinout ............................................................................................................................. 5 Table 4-1 – ME810A-HV35R J1 and MM900EV module J2 connection ....................................................... 7 Table 6-1 - Operating Voltage and Current ........................................................................................... 11 Table 6-2 - LCD and Touch Information ................................................................................................ 11 Table 6-3 - 3.5” TFT Optical specification .............................................................................................. 12 Copyright © Future Technology Devices International Limited 15 ME810A-HV35R module Datasheet Version 1.1 D oc ument Reference N o.: FT _001232 C learance N o.: FT DI# 468 Appendix C – Revision History Document Title: ME810A-HV35R module Document Reference No.: FT_001232 Clearance No.: FTDI# 468 Product Page: http://www.ftdichip.com/eve.htm Document Feedback: Send Feedback Revision Changes Date 1.0 Initial Release 2015-09-29 1.1 Updated Release 2016-03-11 Copyright © Future Technology Devices International Limited 16