GHB-1206-Y

55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-1206-Y Features ! 3.2mmx1.6mm ! LOW Description SMT LED, 1.1mm THICKNESS. The Super Bright Yellow source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. POWER CONSUMPTION. VIEWING ANGLE. FOR BACKLIGHT AND INDICATOR. LENS TYPES AVAILABLE. ! WIDE ! IDEAL !VARIOUS COLORS AND ! PACKAGE : 3.2x1.6mm SMD CHIP LED LAMP 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.3 DATE: JAN/25/2003 PAGE: 1 OF 4 Selection Guide Part No Par t No.. Pa No. art Dice ic e ic Lens Typ L ens Ty pe ens Typ s Ty Iv (mcd) Iv (m c d ) (mcd d @ 20 mA Miin. in . n Ty p.. Typ Ty p yp 10 0 120 Viewing Viewin g View in i Angle GHB-1206-Y S UPER BRIGHTYELLOW (InGaAlP) W ATER CLEAR 36 Note: 1 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C Sy m b o l Sy ymbol ymbo peak D 1/2 C VF IR P ar a m e t er Pa aramete P eak Wavelength D ominate Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current D ev i c e evic e Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Ty p.. Ty p yp 590 588 28 25 2.0 2.5 10 Max .. ax x Un its nit nm nm nm pF V uA Tes t Co n d it io ns Test Cond ition s est s I F =20mA I F =20mA I F =20mA VF =0V;f=1MHz I F =20mA V R = 5V Absolute Maximum Ratings at TA=25 C P a r a m e t er Paramete Pa arameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Sup er Briigh t Yellow Su p er B r g h Yello w u uper Br Brigh Ye B Yello Y 125 30 150 5 -40 C To +85 C Un its nit W A mA V REV NO: V.3 DATE: JAN/25/2003 PAGE: 2 OF 4 REV NO: V.3 DATE: JAN/25/2003 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.3 DATE: JAN/25/2003 PAGE: 4 OF 4