GHB-1206L-DR

55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-1206L-DR Features ! 3.2mmx1.6mm ! LOW ! WIDE ! IDEAL Description SMT LED,1.8mm THICKNESS. The Super Bright Red source color devices are made with Gallium Aluminum Arsenide Red Light Emitting Diode. POWER CONSUMPTION. VIEWING ANGLE. FOR BACKLIGHT AND INDICATOR. 2000PCS / REEL. ! PACKAGE : 3.2x1.6mm SMD CHIP LED LAMP Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.3 DATE: DEC/10/2002 PAGE: 1 OF 4 Selection Guide Par t No.. Pa No. art No Dic e ic L ens Ty p e Lens Typ ens Ty s d Iv (m c d ) Iv (mcd (mcd) @ 20 mA in. Min . in GHB-1206L-DR V i ew i n g Viewin Vi iewing Angle Ty p.. Typ Ty p yp 300 50 ° ) SUPER BRIGHT RED( GaAlAs WATER CLEAR 110 Note: 1 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C Sy m b o l Sy ymbo ymbol peak D 1/2 C VF IR P a r a m e t er Pa aramete Peak Wavelength D ominate Wavelength Spectral Line Half-width C apacitance Forward Voltage Reverse Current D ev i c e evic e Super Bright Red Super Bright Red Super Bright Red Super Bright Red Super Bright Red Super Bright Red Ty p.. Ty p yp 660 640 20 45 1.85 2.5 10 Max .. ax x Un its nit nm nm nm pF V uA Tes t Co n d it io ns Test Cond ition s est s I F =20mA I F =20mA I F =20mA VF=0V;f=1MHz I F =20mA VR = 5V Absolute Maximum Ratings at TA=25 C P ar a m e t er Paramete Pa arameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. S u p er B r i g h t R ed Su uper Br uper Bright Red Bright Re B 100 30 155 5 -40 C To +85 C Un its Unit nit mW mA mA V REV NO: V.3 DATE: DEC/10/2002 PAGE: 2 OF 4 REV NO: V.3 DATE: DEC/10/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.3 DATE: DEC/10/2002 PAGE: 4 OF 4