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G965-15ADJP1UF

G965-15ADJP1UF

  • 厂商:

    GMT(致新科技)

  • 封装:

  • 描述:

    G965-15ADJP1UF - 1.5A Low Dropout Regulator with Enable - Global Mixed-mode Technology Inc

  • 数据手册
  • 价格&库存
G965-15ADJP1UF 数据手册
Global Mixed-mode Technology Inc. G965 1.5A Low Dropout Regulator with Enable Features Adjustable Output from 1.2V to 4.8V Using External Resistors 1.5V, 1.8V and 2.5V Options by Setting ADJ Pin Below 0.2V Over Current and Over Temperature Protection 500mV Dropout @1.5A Enable Pin 10μA Quiescent Current in Shutdown 1.5V, 1.8V and 2.5V Fixed Vo Options by Setting ADJ Pin Below 0.2V SOT-223-5 and SOP-8 Package General Description The G965 is a high performance positive voltage regulator designed for use in applications requiring very low dropout voltage at up to 1.5 Amps. Since it has superior dropout characteristics compared to regular LDOs, it can be used to supply 2.5V on motherboards or 1.5V, 1.8V on peripheral cards from the 3.3V supply thus allowing the elimination of costly heatsinks. An enable pin further reduces power dissipation while shut down. The G965 provides excellent regulation over variations in line, load and temperature. The G965 is available with 1.5V, 1.8V and 2.5V internally preset outputs that are also adjustable using external resistors. Applications Battery Powered Systems Motherboards Peripheral Cards Network Cards Set Top Boxes Medical Equipment Notebook Computers Ordering Information ORDER NUMBER G965-15ADJTS1U G965-18ADJTS1U G965-25ADJTS1U G965-15ADJP1U G965-18ADJP1U G965-25ADJP1U ORDER NUMBER (Pb free) G965-15ADJTS1Uf G965-18ADJTS1Uf G965-25ADJTS1Uf G965-15ADJP1Uf G965-18ADJP1Uf G965-25ADJP1Uf MARKING G965-15 G965-18 G965-25 G965-15 G965-18 G965-25 TEMP. RANGE -40°C ~ +85°C -40°C ~ +85°C -40°C ~ +85°C -40°C ~ +85°C -40°C ~ +85°C -40°C ~ +85°C PACKAGE SOT-223-5 SOT-223-5 SOT-223-5 SOP-8 SOP-8 SOP-8 Note: TS: SOT-223-5 P1: SOP-8 1: Bonding Code U : Tape & Reel e.g. 18 denotes the 1.8V output voltage. Pin Configuration Typical Application Circuit R3 VEN VIN VO 8 7 6 5 GND GND GND GND IENH G965 VEN VIN VO GND GND 5 VEN VIN 4 VO VO ADJ 1 2 3 4 G965 R1 C1 22µF C2 47µF R2 ADJ Top View 1 2 3 VEN VIN VO ADJ SOT-223-5 SOP-8 VO = Volts R2 R2=12kΩ is recommended R3 should be connected for current IENH restriction as VEN > VIN+0.3V R2=0Ω sets VO to fixed output mode. 1.2 (R1+R2) Ver: 1.7 Jan 08, 2007 TEL: 886-3-5788833 http://www.gmt.com.tw 1 Global Mixed-mode Technology Inc. Absolute Maximum Ratings (Note 1) Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V VEN Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . .VIN+0.3V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature . . . . . . . . . . . . 150°C Storage Temperature Range . . . . -65°C ≤TJ ≤ +150°C Reflow Temperature (soldering, 10sec) . . .. . . 260°C Thermal Resistance Junction to Ambient, (θJA) SOT-223-5. . . . . . . . . . . . . . . . . . . . . . . . . . .141°C/W SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .162°C/W Thermal Resistance Junction to Case, (θJC) SOT-223-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . 20°C/W SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31°C/W ESD Rating (Human Body Model) . . . . . . . . . . . . 2kV Electrical Characteristics G965 Operation Conditions (Note 1) Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . 2.2V ~5.5V Temperature Range . . . . . . . . . . . . -40°C ≤TA ≤ +85°C VEN=VIN, VIN =5V, IO = 0.5A, CIN = 4.7μF, COUT =10μF, TA = TJ = 25°C unless otherwise specified (Note 3) PARAMETER Supply Voltage Output Voltage Line Regulation Load Regulation Quiescent Current Ripple Rejection Dropout Voltage Short Circuit Current Over Temperature VEN Voltage High VEN Voltage Low VEN Bias Current Low ADJ Reference Voltage ADJ Pin Threshold VENH VENL IENL VREF Output Active Output Disabled VEN=0.4V VIN=2.2V, VADJ=VOUT, IO=10mA VD IQ SYMBOL VIN VO CONDITION VIN=VO +0.7V, IO=10mA VO+0.7V < VIN < 5.5V, IO=10mA 10mA < IO < 1.5A VIN=3.3V,VEN=VIN VIN=3.3V,VEN=0V fi=120Hz, 1VP-P, IO=100mA IO=1.5A MIN 2.2 -2 ----------------1.6 ----1.188 --- TYP --VO 0.2 0.8 1.7 16 55 0.5 0.8 150 ------1.2 0.2 MAX 5.5 2 2 2 2.5 35 --0.65 ------0.4 20 1.212 --- UNIT V % % % mA μA dB V A °C V V μA V V Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is (Tjmax-TA) / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The type of output capacitor should be tantalum or aluminum. Definitions Dropout Voltage The input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value, dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Ver: 1.7 Jan 08, 2007 Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. TEL: 886-3-5788833 http://www.gmt.com.tw 2 Global Mixed-mode Technology Inc. Typical Performance Characteristics VEN=VIN, VIN =5V, IO = 0.5A, CIN = 4.7μF, COUT =10μF, TA = TJ = 25°C Line Transient(G965-15) G965 Load Transient(G965-15) Line Transient Response(G965-18) Load Transient Response(G965-18) Line Transient Response(G965-25) Load Transient Response(G965-25) Ver: 1.7 Jan 08, 2007 TEL: 886-3-5788833 http://www.gmt.com.tw 3 Global Mixed-mode Technology Inc. Typical Performance Characteristics (continued) G965 Start-UP(G965-15) Overcurrent Protection Characteristics(G965-15) Start-up(G965-18) Overcurrent Protection Characteristics(G965-18) Start-up(G965-25) Overcurrent Protection Characteristics(G965-25) Ver: 1.7 Jan 08, 2007 TEL: 886-3-5788833 http://www.gmt.com.tw 4 Global Mixed-mode Technology Inc. Typical Performance Characteristics (continued) G965 Dropout Voltage vs.Temperature(G965-15) Quiescent Current vs. Temperature(G965-15) 1.7 1.65 Quiescent Current (mA) 700 600 Dropout Voltage (mV) 500 400 300 200 100 0 -25 -15 -5 IL = 300mA 5 15 25 35 45 55 65 75 85 Temperature ( oC) IL = 1A 1.6 1.55 1.5 1.45 1.4 1.35 1.3 -25 -15 -5 5 15 25 35 45 55 65 75 85 Temperature ( oC) V IN = 3V V IN = 5V Quiescent Current vs. Temperature(G965-18) 2.00 1.95 1.90 Dropout Voltage (mV) Quiescent Current (mA) Dropout Voltage vs. IL (G965-18) 700 600 1.85 1.80 1.75 1.70 1.65 1.60 1.55 1.50 -25 -15 -5 V IN = 5V 500 400 300 200 100 0 T=25oC T = 85oC V IN = 3V T=-25oC 5 15 25 35 45 55 65 75 85 Temperature ( oC) 0 250 500 750 1000 IL (mA) 1250 1500 Quiescent Current vs. Temperature(G965-25) 4.00 3.75 Dropout Voltage (mV) Quiescent Current (mA) Dropout Voltage vs. I L (G965-25) 700 600 500 400 300 200 100 0 T = -25oC 0 0.25 0.5 0.75 1 IL ( A) 1.25 1.5 T = 25oC T = 85oC 3.50 V IN = 5V 3.25 3.00 2.75 2.50 -25 -15 -5 5 15 25 35 45 55 65 75 85 Temperature ( oC) V IN = 4V Ver: 1.7 Jan 08, 2007 TEL: 886-3-5788833 http://www.gmt.com.tw 5 Global Mixed-mode Technology Inc. Typical Performance Characteristics (continued) G965 Output Voltage vs. VIN (G965-15) Output Voltage vs. Temperature(G965-15) 1.54 1.53 Output Voltage (V) 1.52 1.51 1.5 1.49 1.48 -25 -15 -5 V IN = 3V IL = 10mA Output Voltage (V) 1.54 1.53 1.52 1.51 1.5 1.49 1.48 5 15 25 35 45 55 65 75 85 Temperature ( oC) 2.5 IL=10mA T = 25oC V IN = 5V T = 85oC T = -25oC 3 3.5 4 4.5 V IN ( V) 5 5.5 Output Voltage vs. Temperature(G965-18) 1.824 1.819 Output Voltage (V) 1.814 1.809 1.804 1.799 1.794 1.789 1.784 -25 -15 -5 5 15 25 35 45 55 65 75 85 Temperature ( C) o Output Voltage vs. VIN (G965-18) 1.825 IL = 10mA Output Voltage (V) V IN = 5V 1.82 1.815 1.81 1.805 IL = 10mA T = 85oC T = 25oC V IN = 3V T = -25oC 1.8 2.5 3.5 4.5 V IN ( V) 5.5 6.5 Output Voltage vs. Temperature(G965-25) 2.545 2.535 Output Voltage (V) 2.525 2.515 2.505 2.495 2.485 2.475 -25 -15 -5 V IN = 4V IL = 10mA Output Voltage (V) V IN = 5V 2.545 2.540 2.535 2.530 2.525 2.520 2.515 2.510 2.505 2.500 5 15 25 35 45 55 65 75 85 Temperature (oC) 3 Output Voltage vs. VIN (G965-25) IL = 10mA T = 85oC T = 25oC T = -25oC 4 5 V IN ( V) 6 7 Ver: 1.7 Jan 08, 2007 TEL: 886-3-5788833 http://www.gmt.com.tw 6 Global Mixed-mode Technology Inc. Typical Performance Characteristics (continued) Short Circuit Current 60 50 Ripple Rejection (dB) G965 Ripple Rejection IL = 10mA 40 30 20 10 0 10 IL = 1.5A IL = 500mA V IN = 4V COUT = 10μF V ripple = 224mV 100 1000 10000 100000 1000000 Frequency (Hz) G965 Max. Power Dissipation vs. PCB Top Copper Area 2.5 2 1.5 1 0.5 0 0 1 2 3 4 5 PCB Top Copper Area (in2) 2.5 G965 Max. Power Dissipation vs. TAMB (still air) Unit:in2 A=0.1 A=0.2 Max. Dissipation Power (W) Max. Dissipation Power (W) 2 1.5 1 0.5 0 25 35 45 55 TAMB ( oC) 65 75 85 A=0.3 A=0.4 A=0.5 A=1.0 A=1.5 A=2.0 A=2.5 A=3.0 A=3.5 A=4.0 A=4.5 A=5.0 Recommended Minimum Footprint SOT-223-5 SOP-8 Ver: 1.7 Jan 08, 2007 TEL: 886-3-5788833 http://www.gmt.com.tw 7 Global Mixed-mode Technology Inc. Package Information D b1 A A2 α C G965 13°(4X) E E1 L e L2 Gauge plane 0.2000 13°(4X) A1 b SOT-223-5 Package SYMBOL A A1 A2 b b1 c D E1 e E L L2 α 0° MIN 1.52 0.02 1.50 0.60 2.90 0.24 6.30 3.30 6.70 DIMENSION IN MM NOM 1.66 0.06 1.60 0.70 3.00 0.28 6.55 3.50 1.50 BSC 7.00 0.90 MIN 0.06 BSC 5° MAX 1.80 0.10 1.70 0.80 3.10 0.32 6.80 3.70 7.30 MIN 0.061 0.0008 0.059 0.024 0.114 0.009 0.248 0.130 0.264 DIMENSION IN INCH NOM 0.066 0.0024 0.063 0.0275 0.118 0.011 0.258 0.138 0.059 BSC 0.2755 0.036 MIN 0.0024 BSC MAX 0.071 0.0040 0.067 0.031 0.122 0.013 0.268 0.146 0.287 10 ° 0° 5° 10 ° Ver: 1.7 Jan 08, 2007 TEL: 886-3-5788833 http://www.gmt.com.tw 8 Global Mixed-mode Technology Inc. C G965 E H L D θ 7 ° (4X) A2 y B A1 A e SOP-8 Package Note: 1. Package body sizes exclude mold flash and gate burrs 2. Dimension L is measured in gage plane 3. Tolerance 0.10mm unless otherwise specified 4. Controlling dimension is millimeter converted inch dimensions are not necessarily exact. SYMBOL A A1 A2 B C D E e H L θ MIN 1.45 0.10 1.35 0.306 0.153 4.81 3.84 ----5.84 0.45 0° DIMENSION IN MM NOM 1.60 ----1.45 ----------------1.27 ------------- MAX 1.75 0.25 1.55 0.506 0.253 5.01 4.04 ----6.24 1.00 8° MIN 0.057 0.004 0.053 0.012 0.006 0.189 0.151 ----0.230 0.018 0° DIMENSION IN INCH NOM 0.063 ----0.057 ----------------0.050 ------------- MAX 0.069 0.010 0.061 0.020 0.010 0.197 0.159 ----0.246 0.039 8° Taping Specification PACKAGE SOT-223-5 SOP-8 Feed Direction SOT-223-5 Package Orientation Feed Direction Typical SOP Package Orientation Q’TY/REEL 2,500 ea 2,500 ea GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications. Ver: 1.7 Jan 08, 2007 TEL: 886-3-5788833 http://www.gmt.com.tw 9
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