SP1001-02XTG

TVS Diode Array (SPA® Diodes) General Purpose ESD Protection - SP1001 Series SP1001 Series - 8pF 15kV Unidirectional TVS Array RoHS Pb GREEN Description Avalanche breakdown diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in IEC 61000-42 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting highspeed signal pins. Pinout Features *SP1001-02 (SC70-3) *SP1001-04 (SC70-5) 1 1 5 2 3 3 2 4 SP1001-04 (SOT 553) 1 6 NC 2 5 2 3 4 NC SP1001-05 (SOT 563) 1 5 2 3 4 SP1001-02 (SOT 553) *SP1001-05 (SC70-6) SP1001-05 (SOT 963) 1 6 1 6 2 5 2 5 3 4 3 4 5 4 • Low capacitance of 8pF (TYP) per I/O • Low leakage current of 0.5μA (MAX) at 5V • ESD protection of ±15kV contact discharge, ±30kV air discharge, (Level 4, IEC 61000-4-2) • Small package saves board space • EFT protection, IEC 61000-4-4, 40A (5/50ns) • AEC-Q101 Qualified • Lightning Protection, IEC 61000-4-5, 2A (8/20µs) Note: * AEC-Q101 Qualified Functional Block Diagram Applications SP1001-02 SP1001-02 2 1 4 5 3 • Computer Peripherals • LCD/PDP TVs • Mobile Phones • Set Top Boxes • Digital Cameras • DVD Players • Desktops/Notebooks • MP3/PMP 2 Application Example SP1001-04 2 3 6 1 5 2 3 LCD module Controller Input 4 D1 D2 D3 D4 Outside World 1 SP1001-05 4 5 SP 1001-04JTG (SC70-5) SP 1001-04XTG (SOT553) Life Support Note: Not Intended for Use in Life Support or Life Saving Applications Shield Ground Signal Ground The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/05/19 TVS Diode Array (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Absolute Maximum Ratings Symbol Thermal Information Parameter Value IPP Peak Current (tp=8/20μs) TOP Operating Temperature TSTOR Storage Temperature Units Parameter Rating Units 2 A Storage Temperature Range -55 to 150 °C -40 to 125 °C Maximum Junction Temperature 150 °C °C Maximum Lead Temperature (Soldering 20-40s) 260 °C -505 to 150 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal resistance junction to ambient 124.21 o Thermal resistance junction to case 190.54 o Power dissipation C/W C/W 1 W Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions Min Typ Max Units VF IF=10mA 0.7 0.9 1.2 V 7.0 7.8 Forward Voltage Drop VR IR=1mA Reverse Standoff Voltage Reverse Voltage Drop VRWM IR≤1µA Reverse Leakage Current ILEAK Clamp Voltage1 VR=5V VC Dynamic Resistance RDYN ESD Withstand Voltage1,2 VESD Diode Capacitance1 CD 8.5 V 5.5 V 0.1 µA IPP=1A, tp=8/20µs, Fwd 8.0 11.0 V IPP=2A, tp=8/20µs, Fwd 9.7 13.0 (VC2 - VC1) / (IPP2 - IPP1) 1.7 V Ω IEC 61000-4-2 (Contact) ±15 kV IEC 61000-4-2 (Air) ±30 kV Reverse Bias=0V 12 pF Reverse Bias=2.5V 8 pF Reverse Bias=5V 7 pF Notes: 1 Parameter is guaranteed by component characterization 2 A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode Capacitance vs. Reverse Bias Design Consideration Because of the fast rise-time of the ESD transient, placement of ESD components is a key design consideration. To achieve optimal ESD suppression, the components should be placed on the circuit board as close to the source of the ESD transient as possible. Install the ESD suppressors directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. 14 12 Capacitance (pF) 10 8 6 4 2 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 DC Bias (V) © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/05/19 TVS Diode Array (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes max. Do not exceed 260°C +0/-5 tP TP °C Part Numbering System Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Product Characteristics SP 1001 -0* * T G TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel Package Series Number of Channels J = SC70-3, SC70-5 or SC70-6 X = SOT553 or SOT563 V = SOT963 02 = 2 Channel 04 = 4 Channel 05 = 5 Channel Lead Plating Matte Tin (SC70-x) Pre-Plated Frame (SOT5x3, SOT963) Lead Material Copper Alloy Lead Coplanarity 0.004 inches(0.102mm) Substrate material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. Part Marking System A* * A** Product Series Number of Channels A = SP1001 series (varies) Assembly Site (varies) Ordering Information Part Number Package Marking Min. Order Qty. SP1001-02JTG SC70-3 A*2 3000 SP1001-02XTG SOT553 A*2 3000 SP1001-04JTG SC70-5 A*4 3000 SP1001-04XTG SOT553 A*4 3000 SP1001-05JTG SC70-6 A*5 3000 SP1001-05VTG SOT963 A5 8000 SP1001-05XTG SOT563 A*5 3000 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/05/19 TVS Diode Array (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Package Dimensions — SC70 SC70-3 B Solder Pad Layout 3 Package SC70-3 Pins 3 JEDEC MO-203 Millimeters E HE Min 2 1 e e D A2 A A1 L 5 6 SC70-5 e e Solder Pad Layout 4 not used 0.80 1.10 0.031 0.043 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 0.66 BSC B D A2 A A1 HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package SC70-5 Pins 5 JEDEC MO-203 L 6 SC70-6 B 5 4 Solder Pad Layout E 2 1 HE Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 0.65 BSC D A2 A A1 C 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package SC70-6 Pins 6 JEDEC MO-203 Millimeters Inches Min Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 0.65 BSC e L 0.026 BSC HE 3 B Inches Min e C B 0.026 BSC Millimeters 3 2 1 Max A HE E Min A1 e C Inches Max 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/05/19 TVS Diode Array (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Package Dimensions — SOT553 and SOT563 A 6 Package L D SOT 553 5 (not used) 4 E Solder Pad Layout HE e 5 Millimeters 3 2 SOT 553 Pins Max Min Max A 0.50 B 0.17 0.60 0.020 0.024 0.27 0.007 c 0.011 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 c B 0.50 BSC e A D 6 5 2 4 3 e E L Inches Min 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 Package SOT 563 SOT 563 Pins 6 Solder Pad Layout Millimeters HE Max Min Max 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 A c B Inches Min 0.50 BSC e 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 Package Dimensions — SOT963 Package SOT 963 Pins 6 Millimeters Min Nom A 0.44 B 0.10 c Inches Max Min Nom Max 0.48 0.50 0.0173 0.0189 0.0197 0.15 0.20 0.004 0.006 0.008 0.05 0.10 0.15 0.002 0.004 0.006 D 0.95 1.00 1.05 0.037 0.039 0.041 E 0.75 0.80 0.85 0.029 0.031 0.033 E1 0.95 1.00 1.05 0.037 0.039 0.041 0.35 BSC e 0.014 BSC L 0.05 0.10 0.15 0.002 0.004 0.006 L1 0.125 0.15 0.175 0.005 0.006 0.007 ø 3º 5º 7º 3º 5º 7º Recommanded Solder Pad Layout © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/05/19 TVS Diode Array (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Embossed Carrier Tape & Reel Specification — SC70-3 Dimensions Symbol Millimetres Inches Min Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0 +/- 0.20 1.574 +/- 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.30 2.50 0.090 1.00 Ref A1 B0 2.30 K0 2.50 0.090 1.90 Ref B1 1.10 0.098 0.039 Ref 0.098 0.074 1.30 0.043 0.051 K1 0.60 Ref 0.023 Ref t 0.27 max 0.010 Embossed Carrier Tape & Reel Specification — SC70-5 and SC70-6 Dimensions Symbol Millimetres Min Inches Max Min Max 0.073 E 1.65 1.85 0.065 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0 +/- 0.20 W 7.70 1.574 +/- 0.008 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.096 K0 1.12 1.32 0.044 0.052 t 0.27 max 0.010 max © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/05/19 TVS Diode Array (SPA® Diodes) General Purpose ESD Protection - SP1001 Series Embossed Carrier Tape & Reel Specification — SOT553 and SOT563 Dimensions Symbol Millimetres Min Inches Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.1 0.154 0.161 10P0 40.0 +/- 0.20 1.574 +/- 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 1.73 1.83 0.068 0.072 B0 1.73 1.83 0.068 0.072 K0 0.64 0.74 0.025 0.029 0.22 max t .009 max Embossed Carrier Tape & Reel Specification – SOT963 PO o/ D t W E P2 Dimensions Symbol Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.136 0.140 D1 0.45 0.55 0.018 0.022 4.10 0.154 1.50 min D F AO 10P0 BO P Inches Max P0 oD1 / Millimetres Min 3.90 0.059 min 40.0 +/- 0.20 0.161 1.575 +/- 0.008 P 1.95 2.05 0.077 0.081 P2 1.95 2.05 0.077 0.081 W 7.90 8.20 0.311 0.323 A0 1.11 1.21 0.044 0.048 B0 1.11 1.21 0.044 0.048 K0 0.58 0.68 0.023 0.027 0.22 max 0.009 max KO t Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/05/19