TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
SP1001 Series - 8pF 15kV Unidirectional TVS Array
RoHS
Pb GREEN
Description
Avalanche breakdown diodes fabricated in a proprietary
silicon avalanche technology protect each I/O pin to provide
a high level of protection for electronic equipment that
may experience destructive electrostatic discharges (ESD).
These robust diodes can safely absorb repetitive ESD
strikes above the maximum level specified in IEC 61000-42 international standard (Level 4, ±8kV contact discharge)
without performance degradation. Their very low loading
capacitance also makes them ideal for protecting highspeed signal pins.
Pinout
Features
*SP1001-02
(SC70-3)
*SP1001-04
(SC70-5)
1
1
5
2
3
3
2
4
SP1001-04
(SOT 553)
1
6
NC
2
5
2
3
4
NC
SP1001-05
(SOT 563)
1
5
2
3
4
SP1001-02
(SOT 553)
*SP1001-05
(SC70-6)
SP1001-05
(SOT 963)
1
6
1
6
2
5
2
5
3
4
3
4
5
4
• Low capacitance of 8pF
(TYP) per I/O
• Low leakage current of
0.5μA (MAX) at 5V
• ESD protection of ±15kV
contact discharge, ±30kV
air discharge, (Level 4,
IEC 61000-4-2)
• Small package saves
board space
• EFT protection, IEC
61000-4-4, 40A
(5/50ns)
• AEC-Q101 Qualified
• Lightning Protection, IEC
61000-4-5, 2A (8/20µs)
Note: * AEC-Q101 Qualified
Functional Block Diagram
Applications
SP1001-02
SP1001-02
2
1
4
5
3
• Computer Peripherals
• LCD/PDP TVs
• Mobile Phones
• Set Top Boxes
• Digital Cameras
• DVD Players
• Desktops/Notebooks
• MP3/PMP
2
Application Example
SP1001-04
2
3
6
1
5
2
3
LCD module
Controller
Input
4
D1
D2
D3
D4
Outside World
1
SP1001-05
4
5
SP 1001-04JTG (SC70-5)
SP 1001-04XTG (SOT553)
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
Shield
Ground
Signal
Ground
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/05/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Absolute Maximum Ratings
Symbol
Thermal Information
Parameter
Value
IPP
Peak Current (tp=8/20μs)
TOP
Operating Temperature
TSTOR
Storage Temperature
Units
Parameter
Rating
Units
2
A
Storage Temperature Range
-55 to 150
°C
-40 to 125
°C
Maximum Junction Temperature
150
°C
°C
Maximum Lead Temperature
(Soldering 20-40s)
260
°C
-505 to 150
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the
component. This is a stress only rating and operation of the component at these or any other conditions above
those indicated in the operational sections of this specification is not implied.
Thermal resistance junction to ambient
124.21
o
Thermal resistance junction to case
190.54
o
Power dissipation
C/W
C/W
1
W
Electrical Characteristics (TOP = 25°C)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
VF
IF=10mA
0.7
0.9
1.2
V
7.0
7.8
Forward Voltage Drop
VR
IR=1mA
Reverse Standoff Voltage
Reverse Voltage Drop
VRWM
IR≤1µA
Reverse Leakage Current
ILEAK
Clamp Voltage1
VR=5V
VC
Dynamic Resistance
RDYN
ESD Withstand Voltage1,2
VESD
Diode Capacitance1
CD
8.5
V
5.5
V
0.1
µA
IPP=1A, tp=8/20µs, Fwd
8.0
11.0
V
IPP=2A, tp=8/20µs, Fwd
9.7
13.0
(VC2 - VC1) / (IPP2 - IPP1)
1.7
V
Ω
IEC 61000-4-2 (Contact)
±15
kV
IEC 61000-4-2 (Air)
±30
kV
Reverse Bias=0V
12
pF
Reverse Bias=2.5V
8
pF
Reverse Bias=5V
7
pF
Notes:
1
Parameter is guaranteed by component characterization
2
A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode
Capacitance vs. Reverse Bias
Design Consideration
Because of the fast rise-time of the ESD transient,
placement of ESD components is a key design
consideration. To achieve optimal ESD suppression, the
components should be placed on the circuit board as
close to the source of the ESD transient as possible.
Install the ESD suppressors directly behind the connector
so that they are the first board-level circuit component
encountered by the ESD transient. They are connected
from signal/data line to ground.
14
12
Capacitance (pF)
10
8
6
4
2
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
DC Bias (V)
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/05/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Soldering Parameters
Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
260
Time within 5°C of actual peak Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes max.
Do not exceed
260°C
+0/-5
tP
TP
°C
Part Numbering System
Temperature
Reflow Condition
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
tS
time to peak temperature
Time
Product Characteristics
SP 1001 -0* * T G
TVS Diode Arrays
(SPA® Diodes)
G= Green
T= Tape & Reel
Package
Series
Number of Channels
J = SC70-3, SC70-5 or SC70-6
X = SOT553 or SOT563
V = SOT963
02 = 2 Channel
04 = 4 Channel
05 = 5 Channel
Lead Plating
Matte Tin (SC70-x) Pre-Plated Frame (SOT5x3,
SOT963)
Lead Material
Copper Alloy
Lead Coplanarity
0.004 inches(0.102mm)
Substrate material
Silicon
Body Material
Molded Compound
Flammability
UL Recognized compound meeting flammability
rating V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
Part Marking System
A* *
A**
Product Series
Number of Channels
A = SP1001 series
(varies)
Assembly Site
(varies)
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SP1001-02JTG
SC70-3
A*2
3000
SP1001-02XTG
SOT553
A*2
3000
SP1001-04JTG
SC70-5
A*4
3000
SP1001-04XTG
SOT553
A*4
3000
SP1001-05JTG
SC70-6
A*5
3000
SP1001-05VTG
SOT963
A5
8000
SP1001-05XTG
SOT563
A*5
3000
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/05/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Package Dimensions — SC70
SC70-3
B
Solder Pad Layout
3
Package
SC70-3
Pins
3
JEDEC
MO-203
Millimeters
E
HE
Min
2
1
e
e
D
A2 A
A1
L
5
6
SC70-5
e
e
Solder Pad Layout
4
not used
0.80
1.10
0.031
0.043
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
0.66 BSC
B
D
A2 A
A1
HE
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
Package
SC70-5
Pins
5
JEDEC
MO-203
L
6
SC70-6
B
5
4
Solder Pad Layout
E
2
1
HE
Max
Min
Max
A
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
0.65 BSC
D
A2 A
A1
C
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
Package
SC70-6
Pins
6
JEDEC
MO-203
Millimeters
Inches
Min
Max
Min
Max
A
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
0.65 BSC
e
L
0.026 BSC
HE
3
B
Inches
Min
e
C
B
0.026 BSC
Millimeters
3
2
1
Max
A
HE
E
Min
A1
e
C
Inches
Max
0.026 BSC
HE
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/05/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Package Dimensions — SOT553 and SOT563
A
6
Package
L
D
SOT 553
5
(not used)
4
E
Solder Pad Layout
HE
e
5
Millimeters
3
2
SOT 553
Pins
Max
Min
Max
A
0.50
B
0.17
0.60
0.020
0.024
0.27
0.007
c
0.011
0.08
0.18
0.003
0.007
D
1.50
1.70
0.059
0.067
E
1.10
1.30
0.043
0.051
c
B
0.50 BSC
e
A
D
6
5
2
4
3
e
E
L
Inches
Min
0.020 BSC
L
0.10
0.30
0.004
0.012
HE
1.50
1.70
0.059
0.067
Package
SOT 563
SOT 563
Pins
6
Solder Pad Layout
Millimeters
HE
Max
Min
Max
0.50
0.60
0.020
0.024
B
0.17
0.27
0.007
0.011
c
0.08
0.18
0.003
0.007
D
1.50
1.70
0.059
0.067
E
1.10
1.30
0.043
0.051
A
c
B
Inches
Min
0.50 BSC
e
0.020 BSC
L
0.10
0.30
0.004
0.012
HE
1.50
1.70
0.059
0.067
Package Dimensions — SOT963
Package
SOT 963
Pins
6
Millimeters
Min
Nom
A
0.44
B
0.10
c
Inches
Max
Min
Nom
Max
0.48
0.50
0.0173
0.0189
0.0197
0.15
0.20
0.004
0.006
0.008
0.05
0.10
0.15
0.002
0.004
0.006
D
0.95
1.00
1.05
0.037
0.039
0.041
E
0.75
0.80
0.85
0.029
0.031
0.033
E1
0.95
1.00
1.05
0.037
0.039
0.041
0.35 BSC
e
0.014 BSC
L
0.05
0.10
0.15
0.002
0.004
0.006
L1
0.125
0.15
0.175
0.005
0.006
0.007
ø
3º
5º
7º
3º
5º
7º
Recommanded Solder Pad Layout
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/05/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Embossed Carrier Tape & Reel Specification — SC70-3
Dimensions
Symbol
Millimetres
Inches
Min
Max
Min
Max
E
1.65
1.85
0.065
0.073
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.077
0.081
D
1.40
1.60
0.055
0.063
D1
1.00
1.25
0.039
0.049
P0
3.90
4.10
0.154
0.161
10P0
40.0 +/- 0.20
1.574 +/- 0.008
W
7.70
8.10
0.303
0.318
P
3.90
4.10
0.153
0.161
A0
2.30
2.50
0.090
1.00 Ref
A1
B0
2.30
K0
2.50
0.090
1.90 Ref
B1
1.10
0.098
0.039 Ref
0.098
0.074
1.30
0.043
0.051
K1
0.60 Ref
0.023 Ref
t
0.27 max
0.010
Embossed Carrier Tape & Reel Specification — SC70-5 and SC70-6
Dimensions
Symbol
Millimetres
Min
Inches
Max
Min
Max
0.073
E
1.65
1.85
0.065
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.077
0.081
D
1.40
1.60
0.055
0.063
D1
1.00
1.25
0.039
0.049
P0
3.90
4.10
0.154
0.161
10P0
40.0 +/- 0.20
W
7.70
1.574 +/- 0.008
8.10
0.303
0.318
P
3.90
4.10
0.153
0.161
A0
2.14
2.34
0.084
0.092
B0
2.24
2.44
0.088
0.096
K0
1.12
1.32
0.044
0.052
t
0.27 max
0.010 max
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/05/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SP1001 Series
Embossed Carrier Tape & Reel Specification — SOT553 and SOT563
Dimensions
Symbol
Millimetres
Min
Inches
Max
Min
Max
E
1.65
1.85
0.065
0.073
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.077
0.081
D
1.40
1.60
0.055
0.063
D1
0.45
0.55
0.017
0.021
P0
3.90
4.1
0.154
0.161
10P0
40.0 +/- 0.20
1.574 +/- 0.008
W
7.70
8.10
0.303
0.318
P
3.90
4.10
0.153
0.161
A0
1.73
1.83
0.068
0.072
B0
1.73
1.83
0.068
0.072
K0
0.64
0.74
0.025
0.029
0.22 max
t
.009 max
Embossed Carrier Tape & Reel Specification – SOT963
PO
o/ D
t
W
E
P2
Dimensions
Symbol
Min
Max
E
1.65
1.85
0.065
0.073
F
3.45
3.55
0.136
0.140
D1
0.45
0.55
0.018
0.022
4.10
0.154
1.50 min
D
F
AO
10P0
BO
P
Inches
Max
P0
oD1
/
Millimetres
Min
3.90
0.059 min
40.0 +/- 0.20
0.161
1.575 +/- 0.008
P
1.95
2.05
0.077
0.081
P2
1.95
2.05
0.077
0.081
W
7.90
8.20
0.311
0.323
A0
1.11
1.21
0.044
0.048
B0
1.11
1.21
0.044
0.048
K0
0.58
0.68
0.023
0.027
0.22 max
0.009 max
KO
t
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are
not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics.
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/05/19
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