HM772A

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : Preliminary Data Issued Date : 2000.12.01 Revised Date : 2001.01.01 Page No. : 1/3 HM772A PNP EPITAXIAL PLANAR TRANSISTOR Description The HM772A is designed for use in output stage of amplifier, voltage regulator, DC-DC converter and driver. Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ....................................................................................................... -55 ~ +150 °C Junction Temperature ............................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ........................................................................................1 W (Note1) Total Power Dissipation (Ta=25°C)........................................................................................ 2 W (Note2) Total Power Dissipation (Ta=25°C)..................................................................................... 1.5 W (Note3) • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage.................................................................................................... -60 V VCEO Collector to Emitter Voltage................................................................................................. -50 V VEBO Emitter to Base Voltage......................................................................................................... -5 V IC Collector Current (continuous) ..................................................................................................... -3 A IC Collector Current (pulse) ................................................................................................. -7 A (Note4) Note1: When tested in free air condition, without heat sinking. Note2: When mounted on a 40X40X1mm ceramic board. Note3: Printed circuit board 2mm thick, collector plating 1cm square or larger. Note4: Single pulse PW=1ms Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Min. -60 -50 -5 30 100 Typ. -0.3 -1 160 80 55 Max. -1 -1 -0.5 -2 500 Unit V V V uA uA V V Test Conditions IC=-100uA IC=-1mA IE=-10uA VCB=-30V VEB=-3V IC=-2A, IB=-0.2A IC=-2A, IB=-0.2A VCE=-2V, IC=-20mA VCE=-2V, IC=-1A VCE=-5V, IC=-100mA, f=100MHz VCB=-10V, f=1MHz *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% MHz pF Classification Of hFE2 Rank Range Q 100-200 P 160-320 E 250-500 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 10 Spec. No. : Preliminary Data Issued Date : 2000.12.01 Revised Date : 2001.01.01 Page No. : 2/3 Saturation Voltage & Collector Current VCE=2V 100 Saturation Voltage (V) 1 VBE(sat) @ IC=10IB hFE 10 0.1 VCE(sat) @ IC=10IB 1 0.01 0.1 1 10 100 1000 10000 0.01 0.01 0.1 1 10 100 1000 10000 Collector Current (mA) Collector Current (mA) Capacitance & Reverse-Biased Voltage 1000 1000 Cutoff Frequency & Collector Current Cutoff Frequency (MHz) Capacitance (pF) 100 100 VCE=5V Cob 10 10 1 0.1 1 10 100 1 1 10 100 1000 Reverse-Biased Voltage (V) Collector Current (mA) Power Derating 1200 Safe Operating Area 10000 1000 Power Dissipation-PD(mW) Collector Current-IC (mA) 1000 PT=1ms PT=100ms 800 600 100 PT=1s 400 10 200 0 0 20 40 60 80 100 o 1 120 140 160 1 10 100 Ambient Temperature-Ta( C) Forward Biased Voltage-VCE (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. SOT-89 Dimension Marking : Spec. No. : Preliminary Data Issued Date : 2000.12.01 Revised Date : 2001.01.01 Page No. : 3/3 C H Date Code Part Number HSMC Logo Package Code B 1 E F G A 2 3 D Style : Pin 1.Base 2.Collector 3.Emitter I 3-Lead SOT-89 Plastic Surface Mounted Package HSMC Package Code : M *:Typical DIM A B C D E Inches Min. Max. 0.1732 0.1811 0.1594 0.1673 0.0591 0.0663 0.0945 0.1024 0.0141 0.0201 Millimeters Min. Max. 4.40 4.60 4.05 4.25 1.50 1.70 2.40 2.60 0.36 0.51 DIM F G H I Inches Min. Max. 0.0583 0.0598 0.1165 0.1197 0.0551 0.0630 0.0138 0.0161 Millimeters Min. Max. 1.48 1.52 2.96 3.04 1.40 1.60 0.35 0.41 Notes : 1.Dimension and tolerance based on our Spec. dated May. 05,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 • Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification