BAS21U

BAS21... Silicon Switching Diode • For high-speed switching applications • High breakdown voltage • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BAS21 ! BAS21-03W BAS21U $ # " , , ,!    ! Type BAS21 BAS21-03W BAS21U Parameter Diode reverse voltage Peak reverse voltage Forward current Peak forward current Peak forward current Package SOT23 SOD323 SC74 Configuration single single parallel triple Symbol VR VRM IF IFM IFM IFS IFSM Ptot 350 250 250 Tj Tstg 150 -65 ... 150 Value 200 250 250 625 625 4 - Marking JSs D JSs Unit V mA mA A mW Maximum Ratings at TA = 25°C, unless otherwise specified Surge forward current, t = 10 µs Non-repetitive peak surge forward current Total power dissipation BAS21, T S ≤ 70°C BAS21-03W, TS ≤ 124°C BAS21U, TS ≤ 122°C Junction temperature Storage temperature 1Pb-containing °C package may be available upon special request 1 2007-04-19 BAS21... Thermal Resistance Parameter Junction - soldering point 1) BAS21 BAS21-03W BAS21U Symbol RthJS Value ≤ 230 ≤ 105 ≤ 110 Unit K/W Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics 250 V Breakdown voltage V(BR) I(BR) = 100 µA Reverse current VR = 200 V VR = 200 V, TA = 150 °C Forward voltage IF = 100 mA IF = 200 mA AC Characteristics Diode capacitance VR = 0 V, f = 1 MHz Reverse recovery time IF = 30 mA, IR = 30 mA, measured at IR = 3mA, RL = 100 Ω Test circuit for reverse recovery time D.U.T. IR VF CT trr - µA - 0.1 100 V 1 1.25 5 50 pF ns Puls generator: tp = 1µs, D = 0.05 tr = 0.6ns, Ri = 50Ω Oscillograph ΙF Oscillograph: R = 50Ω , tr = 0.35ns, C ≤ 1pF EHN00018 1For calculation of RthJA please refer to Application Note Thermal Resistance 2 2007-04-19 BAS21... Reverse current IR = ƒ (TA) VR = 200V 10 2 µA BAS 19...21 EHB00027 Forward Voltage VF = ƒ (TA) IF = Parameter 1.5 V BAS 19...21 EHB00029 ΙR 10 1 5 max VF Ι F = 625 mA 1.0 typ. 250 mA 100 mA 10 mA 10 0 5 0.5 10 -1 5 10 -2 0 50 100 TA ˚C 150 0.0 0 50 100 TA ˚C 150 Forward current IF = ƒ (VF) Forward current IF = ƒ (T S) BAS21-03W ΙF 800 mA 700 600 BAS 19...21 EHB00028 300 mA 200 400 300 IF 150 100 50 0 0 500 200 100 0 0.0 0.5 1.0 V VF 1.5 15 30 45 60 75 90 105 120 °C 150 TS 3 2007-04-19 BAS21... Forward current IF = ƒ (T S) BAS21U Permissible Puls Load R thJS = ƒ (tp) BAS21 10 3 250 mA 10 2 150 RthJS 10 1 IF 100 10 0 50 D = 0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 0 0 15 30 45 60 75 90 105 120 °C 150 10 -1 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 TS tP Permissible Pulse Load IFmax / I FDC = ƒ (tp ) BAS21 10 2 Permissible Puls Load R thJS = ƒ (tp) BAS21-03W 10 3 K/W IFmax/IFDC 10 1 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 2 RthJS 10 1 10 0 D=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 10 -1 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 tP tP 4 2007-04-19 BAS21... Permissible Pulse Load IFmax / I FDC = ƒ (tp ) BAS21-03W 10 2 10 3 K/W Permissible Puls Load R thJS = ƒ (tp) BAS21U 10 1 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 I Fmax/IFDC 10 2 RthJS 10 1 10 0 D=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 10 -1 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 tP tP Permissible Pulse Load IFmax / I FDC = ƒ (tp ) BAS21U 10 2 IFmax/IFDC 10 1 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 tP 5 2007-04-19 Package SC74 BAS21... Package Outline 2.9 ±0.2 (2.25) B (0.35) 2.5 ±0.1 6 5 4 1.1 MAX. 0.15 +0.1 -0.06 0.25 ±0.1 1.6 ±0.1 10˚ MAX. 1 2 3 Pin 1 marking 1.9 0.35 +0.1 -0.05 0.95 10˚ MAX. 0.2 M B 6x 0.2 M A 0.1 MAX. A Foot Print 0.5 0.95 Marking Layout (Example) Small variations in positioning of Date code, Type code and Manufacture are possible. 1.9 2.9 Manufacturer 2005, June Date code (Year/Month) Pin 1 marking Laser marking BCW66H Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel For symmetric types no defined Pin 1 orientation in reel. 4 0.2 Pin 1 marking 3.15 2.7 8 1.15 6 2007-04-19 Package SOD323 BAS21... Package Outline 0.9 +0.2 -0.1 +0.2 1.25 -0.1 0 ±0.05 A 1.7 +0.2 -0.1 +0.05 0.3 -0.2 2 Cathode marking 1 0.3 +0.1 -0.05 0.25 M A 0.45 ±0.15 2.5 ±0.2 0.15 +0.1 -0.06 Foot Print 0.6 Marking Layout (Example) 0.8 1.7 0.8 BAR63-03W Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 2 2.9 8 Cathode marking 0.65 1.35 1 7 2007-04-19 Package SOT23 BAS21... Package Outline 0.15 MIN. 1 ±0.1 0.1 MAX. 1.3 ±0.1 2.9 ±0.1 3 B 2.4 ±0.15 10˚ MAX. 0.4 +0.1 -0.05 1) 1 2 10˚ MAX. C 0.95 1.9 0.08...0.1 A 5 0...8˚ 0.25 M B C 0.2 M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s Pin 1 0.9 1.3 2005, June Date code (YM) BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.9 2.13 2.65 0.2 8 Pin 1 3.15 1.15 8 2007-04-19 BAS21... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 9 2007-04-19