BSC022N03

BSC022N03S OptiMOS®2 Power-Transistor Features • Fast switching MOSFET for SMPS • Optimized technology for notebook DC/DC converters • Qualified according to JEDEC for target applications • N-channel • Logic level • Excellent gate charge x R DS(on) product (FOM) • Very low on-resistance R DS(on) • Superior thermal resistance • Avalanche rated • dv /dt rated Type BSC022N03S Package P-TDSON-8 Ordering Code Q67042-S4218 1 Product Summary V DS R DS(on),max ID 30 2.2 50 V mΩ A P-TDSON-8 Marking 22N03S Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Continuous drain current Symbol Conditions ID T C=25 °C T C=100 °C T A=25 °C, R thJA=45 K/W 2) Pulsed drain current Avalanche energy, single pulse Reverse diode dv /dt Gate source voltage Power dissipation I D,pulse E AS dv /dt V GS P tot T C=25 °C T A=25 °C, R thJA=45 K/W 2) Operating and storage temperature IEC climatic category; DIN IEC 68-1 Rev. 1.2 page 1 T j, T stg T C=25 °C3) I D=50 A, R GS=25 Ω I D=50 A, V DS=24 V, di /dt =200 A/µs, T j,max=150 °C Value 50 50 28 200 800 6 ±20 104 2.8 -55 ... 150 55/150/56 2004-04-13 °C mJ kV/µs V W Unit A BSC022N03S Parameter Symbol Conditions min. Thermal characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient R thJC R thJA minimal footprint 6 cm2 cooling area2) 1.2 62 45 K/W Values typ. max. Unit Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D=1 mA V GS(th) I DSS V DS=V GS, I D=100 µA V DS=30 V, V GS=0 V, T j=25 °C V DS=30 V, V GS=0 V, T j=125 °C Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=20 V, V DS=0 V V GS=4.5 V, I D=50 A V GS=10 V, I D=50 A Gate resistance Transconductance RG g fs |V DS|>2|I D|R DS(on)max, I D=50 A 30 1.2 1.6 0.1 2 1 µA V 70 10 10 2.6 1.8 0.6 140 100 100 3.3 2.2 Ω S nA mΩ 1) 2) J-STD20 and JESD22 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 3) See figure 3 Rev. 1.2 page 2 2004-04-13 BSC022N03S Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics4) Gate to source charge Gate charge at threshold Gate to drain charge Switching charge Gate charge total Gate plateau voltage Gate charge total, sync. FET Output charge Reverse Diode Diode continous forward current Diode pulse current Diode forward voltage IS I S,pulse V SD T C=25 °C V GS=0 V, I F=50 A, T j=25 °C V R=15 V, I F=I S, di F/dt =400 A/µs 0.81 50 200 1 V A Q gs Q g(th) Q gd Q sw Qg V plateau Q g(sync) Q oss V DS=0.1 V, V GS=0 to 5 V V DD=15 V, V GS=0 V V DD=15 V, I D=25 A, V GS=0 to 5 V 16 9 11 17 43 2.8 38 48 21 12 16 25 58 51 63 V nC nC C iss C oss Crss t d(on) tr t d(off) tf V DD=15 V, V GS=10 V, I D=25 A, R G=2.7 Ω V GS=0 V, V DS=15 V, f =1 MHz 5630 2000 251 9.7 9 42 7 7490 2660 376 14 13 62 11 ns pF Values typ. max. Unit Reverse recovery charge Q rr - - 20 nC 4) See figure 16 for gate charge parameter definition Rev. 1.2 page 3 2004-04-13 BSC022N03S 1 Power dissipation P tot=f(T C) 2 Drain current I D=f(T C); V GS≥10 V 120 60 100 50 80 40 P tot [W] 60 I D [A] 0 40 80 120 160 30 40 20 20 10 0 0 0 40 80 120 160 T C [°C] T C [°C] 3 Safe operation area I D=f(V DS); T C=25 °C; D =0 parameter: t p 103 1000 4 Max. transient thermal impedance Z thJC=f(t p) parameter: D =t p/T 101 10 limited by on-state resistance 10 µs 100 102 100 1 0.5 100 µs Z thJC [K/W] 0.2 0.1 0.1 I D [A] 10-1 1 ms 0.05 0.02 101 10 10 ms 0.01 -2 10 DC 0.01 single pulse 100 1 0.1 1 10 100 10-3 2 0.001 0 0 0 0 0 0 10 -1 10 0 V DS [V] 10 1 10 10 -6 10 -5 10 -4 t p [s] 10 -3 10 -2 10-1 Rev. 1.2 page 4 2004-04-13 BSC022N03S 5 Typ. output characteristics I D=f(V DS); T j=25 °C parameter: V GS 160 140 120 3.4 V 4.5 V 4V 10 V 3.7 V 6 Typ. drain-source on resistance R DS(on)=f(I D); T j=25 °C parameter: V GS 14 3.2 V 3V 2.8 V 3.4 V 12 10 R DS(on) [mΩ ] 100 8 I D [A] 80 3.2 V 6 3.7 V 4V 4.5 V 60 40 20 0 0 1 2 3 3V 4 2.8 V 2 10 V 0 0 20 40 60 80 100 V DS [V] I D [A] 7 Typ. transfer characteristics I D=f(V GS); |V DS|>2|I D|R DS(on)max parameter: T j 160 140 120 100 80 60 8 Typ. forward transconductance g fs=f(I D); T j=25 °C 180 160 140 120 100 80 60 40 150 °C g fs [S] 25 °C I D [A] 40 20 0 0 1 2 3 4 5 0 10 20 30 40 50 60 20 0 V GS [V] I D [A] Rev. 1.2 page 5 2004-04-13 BSC022N03S 9 Drain-source on-state resistance R DS(on)=f(T j); I D=50 A; V GS=10 V 10 Typ. gate threshold voltage V GS(th)=f(T j); V GS=V DS parameter: I D 4 2.5 2 3 1000 µA R DS(on) [mΩ ] 98 % V GS(th) [V] 1.5 100 µA 2 typ 1 1 0.5 0 -60 -20 20 60 100 140 180 0 -60 -20 20 60 100 140 180 T j [°C] T j [°C] 11 Typ. capacitances C =f(V DS); V GS=0 V; f =1 MHz 12 Forward characteristics of reverse diode I F=f(V SD) parameter: T j 104 10000 103 150 °C Ciss 25 °C 150°C, 98% 102 Coss 25°C, 98% 101 C [pF] 103 1000 I F [A] 100 Crss 10-1 102 100 10-2 10 20 30 0.2 0.4 0.6 0.8 V SD [V] 1 1.2 1.4 0 V DS [V] Rev. 1.2 page 6 2004-04-13 BSC022N03S 13 Avalanche characteristics I AS=f(t AV); R GS=25 Ω parameter: T j(start) 100 14 Typ. gate charge V GS=f(Q gate); I D=25 A pulsed parameter: V DD 12 25 °C 100 °C 10 6V 15 V 24 V 125 °C 8 10 V GS [V] 1 10 100 1000 I AV [A] 6 4 2 1 0 0 20 40 60 80 100 t AV [µs] Q gate [nC] 15 Drain-source breakdown voltage V BR(DSS)=f(T j); I D=1 mA 16 Gate charge waveforms 36 V GS 34 32 30 Qg V BR(DSS) [V] 28 26 24 22 20 -60 -20 20 60 100 140 180 V g s(th) Q g (th) Q gs Q sw Q gd Q gate T j [°C] Rev. 1.2 page 7 2004-04-13 BSC022N03S Package Outline P-TDSON-8: Outline Footprint Dimensions in mm Rev. 1.2 page 8 2004-04-13 BSC022N03S Package Outline P-TDSON-8: Tape Dimensions in mm Rev. 1.2 page 9 2004-04-13 BSC022N03S Published by Infineon Technologies AG Bereich Kommunikation St.-Martin-Straße 53 D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices, please contact your nearest Infineon Technologies office in Germany or our Infineon Technologies representatives worldwide (see address list). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact your nearest Infineon Technologies office. Infineon Technologies' components may only be used in life-support devices or systems with the expressed written approval of Infineon Technologies if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.2 page 10 2004-04-13