ISL29001

® ISL29001 Data Sheet December 10, 2008 FN6166.6 Light-to-Digital Sensor The ISL29001 is an integrated ambient light sensor with ADC and I2C interface. With a spectral sensitivity curve matched to that of the human eye, the ISL29001 provides 15-bit effective resolution while rejecting 50Hz and 60Hz flicker caused by artificial light sources. In normal operation, the ISL29001 consumes less than 300µA of supply current. A software power-down mode controlled via the I2C interface disables all but the I2C interface. A power-down pin is also provided, which reduces power consumption to less than 1µA. The ISL29001 includes an internal oscillator, which provides 100ms automatic integration periods, or can be externally timed by I2C commands. Both the internal timing and the illuminance resolution can be adjusted with an external resistor. Designed to operate on supplies from 2.5V to 3.3V, the ISL29001 is specified for operation over the -40°C to +85°C ambient temperature range. It is packaged in a clear 6 Ld ODFN package. Features • Human Eye Response • Temperature Compensated • IR Rejection • 15-bit Effective Resolution • Adjustable Resolution: 3 Counts to 15 Counts per lux • Simple Output Code, Directly Proportional to lux • 0.3 lux to10,000 lux Range • 50Hz/60Hz Rejection • I2C Interface • 2.5V to 3.3V Supply • 6 Ld ODFN (2.1mmx2mm) • Pb-Free (RoHS compliant) Applications • Ambient Light Sensing • Ambient Backlight Control Ordering Information PART NUMBER (Note) ISL29001IROZ-T7* PACKAGE (Pb-Free) 6 Ld ODFN PKG. DWG. # L6.2x2.1 • Temperature Control Systems • Contrast Control • Camera Light Meters • Lighting Controls • HVAC *Please refer to TB347 for details on reel specifications. NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. Block Diagram VDD PD 1 4 PHOTODIODE 1 COMMAND REGISTER Pinout ISL29001 (6 LD ODFN) TOP VIEW VDD 1 GND 2 REXT 3 THERMAL PAD MUX INTEGRATING ADC DATA REGISTER I2C 5 SCL 6 SDA PHOTODIODE 2 6 SDA 5 SCL 4 PD 3 REXT 2 GND IREF FOSC 216 COUNTER 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2005-2008. All Rights Reserved. All other trademarks mentioned are the property of their respective owners. ISL29001 Absolute Maximum Ratings (TA = +25°C) Maximum Supply Voltage between VDD and GND . . . . . . . . . . 3.6V I2C Bus Pin Voltage (SCL, SDA) . . . . . . . . . . . . . . . . . -0.2V to 5.5V I2C Bus Pin Current (SCL, SDA) . . . . . . . . . . . . . . . . . . . . . . 1.5mm LIGHT PIPE t D2 DLENS L ISL29001 FIGURE 13. WINDOW WITH LIGHT GUIDE/PIPE 9 FN6166.6 December 10, 2008 ISL29001 Typical Circuit A typical application circuit is shown in Figure 14. ISL29002 2.5V TO 3.3V + 4.7µF 0.1µF VDD SDA SCL MICROCONTROLLER SDA SCL ISL29001 VSS PD REXT 100k FIGURE 14. TYPICAL CIRCUIT Suggested PCB Footprint Footprint pads should be a nominal 1-to-1 correspondence with package pads. The large, exposed central die-mounting paddle in the center of the package requires neither thermal nor electrical connection to the PCB, and such connection should be avoided. Soldering Considerations Convection heating is recommended for reflow soldering; direct-infrared heating is not recommended. The ISL29001’s plastic ODFN package does not require a custom reflow soldering profile, and is qualified to +260°C. A standard reflow soldering profile with a +260°C maximum is recommended. Layout Considerations The ISL29001 is relatively insensitive to layout. Like other I2C devices, it is intended to provide excellent performance even in significantly noisy environments. There are only a few considerations that will ensure best performance. Route the supply and I2C traces as far as possible from all sources of noise. Use two power-supply decoupling capacitors, 4.7µF and 0.1µF, placed close to the device. Special Handling ODFN6 is rated as JEDEC moisture level 4. Standard JEDEC Level 4 procedure should be followed: 72hr floor life at less than +30°C 60% RH. When baking the device, the temperature required is +110°C or less due to special molding compound. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 10 FN6166.6 December 10, 2008 ISL29001 Package Outline Drawing L6.2x2.1 6 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE (ODFN) Rev 0, 9/06 2.10 A 6 PIN 1 INDEX AREA B 1 6 PIN 1 INDEX AREA 0.65 2.00 1 . 35 1 . 30 REF (4X) 0.10 6X 0 . 30 ± 0 . 05 0 . 65 TOP VIEW 0.10 M C A B 6X 0 . 35 ± 0 . 05 BOTTOM VIEW (0 . 65) MAX 0.75 SEE DETAIL "X" 0.10 C (0 . 65) (1 . 35) BASE PLANE ( 6X 0 . 30 ) SIDE VIEW SEATING PLANE 0.08 C C ( 6X 0 . 55 ) C (1 . 95) 0 . 00 MIN. 0 . 05 MAX. DETAIL "X" 0 . 2 REF 5 TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 11 FN6166.6 December 10, 2008