ISL32613E

±16.5kV ESD Protected, +125°C, 1.8V to 3.6V, Low Power, SOT-23, RS-485/RS-422 Transmitters ISL32613E, ISL32614E The Intersil ISL32613E and ISL32614E are ±16.5kV HBM ESD Protected (7kV IEC61000 contact), 1.8V powered, single transmitters for differential communication. These drivers have very low bus currents (±40µA), so they present less than a “1/8 unit load” to the bus. This allows more than 256 transmitters on the network, without violating the RS-485 specification’s 32 unit load maximum and without using repeaters. Hot Plug circuitry ensures that the Tx outputs remain in a high impedance state while the power supply stabilizes. Both ICs utilize slew rate limited drivers, which reduce EMI and minimize reflections from improperly terminated transmission lines or unterminated stubs in multidrop and multipoint applications. The ISL32613E is more slew rate limited for data rates up to 128kbps, while the less limited ISL32614E is useful for data rates up to 256kbps. For companion low power single RS-485 receivers, please see the ISL32610E data sheet. Features • Wide Supply Voltage Range . . . . . . . . . . . . . . . . . 1.8V to 3.6V • Low Quiescent Supply Current . . . . . . . . . . . . . . . 80µA (Max) - Very Low Shutdown Supply Current . . . . . . . . . . 2µA (Max) • High ESD Protection on RS-485 Outputs . . . . ±16.5kV HBM - Class 3 ESD Level on All Other Pins. . . . . . . . . . >8kV HBM • Specified for +125°C Operation • Hot Plug - Tx Outputs Remain Three-state During Power-up • Low Tx Leakage Allows >256 Devices on the Bus • Slew Rate Limited for Data Rates Up to 256kbps • Current Limiting and Thermal Shutdown for Driver Overload Protection • 5V Tolerant Logic Inputs • Pb-Free (RoHS Compliant) Applications • Industrial/Process Control Networks • Space-constrained Systems • Factory Automation • Building Environmental Control/Lighting Systems 10m RD = ∞, CD = 50pF Truth Table TRANSMITTING DYNAMIC (128kbps) INPUTS DE (Note 9) 1 DI 1 0 X Z 0 1 OUTPUTS Y 1 0 High-Z * 1m ICC (A) 100µ STATIC 1 0 NOTE: *Shutdown Mode High-Z * 10µ 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 VCC (V) FIGURE 1. VCC 1 .8V TO 3.6V ISL32613E with VCC = 1.8V Reduces Operating ICC by a Factor of 177 Compared with ICC at VCC = 3.6V August 30, 2011 FN7906.0 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2011. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISL32613E, ISL32614E Pin Configuration ISL32613E, ISL32614E (6 LD SOT-23) TOP VIEW DI 1 VCC 2 DE 3 D 6Y 5 GND 4Z Pin Descriptions SOT-23 1 SYMBOL DI FUNCTION Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. System power supply input (1.8V to 3.6V). Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the driver enable function is not needed, connect DE to VCC through a 1kΩ to 2kΩ resistor. ±16.5kV HBM, ±7kV IEC61000 (contact method) ESD Protected inverting differential transmitter output. Ground connection. ±16.5kV HBM, ±7kV IEC61000 (contact method) ESD Protected noninverting differential transmitter output. 2 3 VCC DE 4 Z 5 6 GND Y TABLE 1. SUMMARY OF FEATURES AT VCC = 1 .8V PART NUMBER ISL32613E ISL32614E FUNCTION 1 Tx 1 Tx DATA RATE (kbps) 128 256 SLEW-RATE LIMITED? Yes Yes HOT PLUG? Yes Yes TX ENABLE? (Note 9) Yes Yes MAXIMUM QUIESCENT ICC (µA) 80 80 LOW POWER SHUTDOWN? Yes Yes PIN COUNT 6 Ld SOT 6 Ld SOT Ordering Information PART NUMBER (Notes 1, 2) ISL32613EFHZ-T ISL32614EFHZ-T NOTES: 1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2. Please refer to TB347 for details on reel specifications. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL32613E, ISL32614E. For more information on MSL please see techbrief TB363. 4. SOT-23 “PART MARKING” is branded on the bottom side. 613F 614F PART MARKING (Note 4) TEMP. RANGE (°C) -40 to +125 -40 to +125 PACKAGE (Tape and Reel) (Pb-Free) 6 Ld SOT-23 6 Ld SOT-23 PKG. DWG. # P6.064 P6.064 2 FN7906.0 August 30, 2011 ISL32613E, ISL32614E Typical Operating Circuits +1.8V + 1 VCC 3 RO 5 RE R B4 A6 ISL32611E GND 2 4Z 6Y ISL3261XE GND 5 0.1µF NETWORK WITH ENABLES 0.1µF + 2 VCC D DI 1 DE 3 +1.8V +1.8V + 1 VCC 3 RO R B4 A5 ISL32610E GND 2 0.1µF NETWORK WITHOUT ENABLES 0.1µF + +1.8V 1kΩ TO 2kΩ (Note 9) 2 VCC D 4Z 6Y ISL3261XE GND 5 3 DE DI 1 3 FN7906.0 August 30, 2011 ISL32613E, ISL32614E Absolute Maximum Ratings VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Input Voltages DI, DE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Output Voltages Y, Z (VCC = 0V or ≥ 2.7V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V Y, Z (VCC = 1.8V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +3V Short Circuit Duration Y, Z. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . see “Electrical Specifications” Latch-up (per JESD78, Level 2, Class A) . . . . . . . . . . . . . . . . . . . . . . +125°C Thermal Information Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 6 Ld SOT-23 Package (Notes 5, 6). . . . . . . . 177 95 Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to +150°C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Recommended Operating Conditions Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.8V to 3.3V Common Mode Range; VCC = 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2V VCC ≥ 2.7V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -7V to +12V Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +125°C RD; VCC = 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≥10kΩ VCC ≥ 2.7V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≥60Ω CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 5. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 6. For θJC, the “case temp” location is taken at the package top center. Electrical Specifications PARAMETER VCC = 1.8V; typicals are at TA = +25°C; unless otherwise specified. Boldface limits apply over the operating temperature range, -40°C to +125°C. (Note 7) SYMBOL TEST CONDITIONS TEMP MIN (°C) (Note 10) TYP MAX (Note 10) UNITS DC CHARACTERISTICS Driver Differential VOUT VOD RL = 100Ω (Figure 2) VCC = 1.8V VCC ≥ 3.15V RL = 54Ω (Figure 2), VCC ≥ 3V No Load ΔVOD Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States Logic Input High Voltage (DI, DE) V0C ΔVOC RL = 100Ω (Figure 2) Full Full Full Full Full 0.8 2 1.5 1.1 0.92 1.45 0.01 VCC 0.2 V V V V V RL = 100Ω (Figure 2) RL = 100Ω (Figure 2) Full Full - 1.1 0.01 1.4 0.2 V V VIH VCC = 1.8V 2.7V ≤ VCC ≤ 3.6V Full Full Full Full Full Full Full Full Full Full 1.26 2.2 -2 -40 - 0.1 0.1 -8 ±150 0.4 0.8 2 30 40 ±250 - V V V V µA µA µA µA mA mA Logic Input Low Voltage (DI, DE) VIL VCC = 1.8V 2.7V ≤ VCC ≤ 3.6V Logic Input Current Output Leakage Current (Y, Z, Note 9) IIN IOZ DI = DE = 0V or VCC (Note 9) DE = 0V, VCC = 0V or 1.8V, or 3.6V VO = 7V at VCC = 1.8V VO = 12V at VCC = 3.6V VO = -7V Driver Short-Circuit Current, VO = High or Low (Note 8) IOS VCC = 1.8V, DE = VCC, -2V ≤ VO ≤ 2V VCC ≥ 2.7V, DE = VCC, -7V ≤ VO ≤ 12V 4 FN7906.0 August 30, 2011 ISL32613E, ISL32614E Electrical Specifications PARAMETER VCC = 1.8V; typicals are at TA = +25°C; unless otherwise specified. Boldface limits apply over the operating temperature range, -40°C to +125°C. (Note 7) (Continued) SYMBOL TEST CONDITIONS TEMP MIN (°C) (Note 10) TYP MAX (Note 10) UNITS SUPPLY CURRENT No-Load Supply Current ICC DE = VCC = 1.8V, DI = 0V or VCC DE = VCC, 2.7V ≤ VCC ≤ 3.6V, DI = 0V or VCC Shutdown Supply Current ISHDN 1.8V ≤ VCC ≤ 3.6V, DE = 0V, DI = 0V or VCC Full Full Full 20 100 0.01 80 150 2 µA µA µA ESD PERFORMANCE RS-485 Pins (Y, Z) Human Body Model, from bus pins to GND IEC61000 Contact, from bus pins to GND All Pins HBM, per MIL-STD-883 Method 3015 Machine Model 25 25 25 25 ±16.5 ±7 ±8 ±400 kV kV kV V DRIVER SWITCHING CHARACTERISTICS (ISL32613E, 128kbps Version) Maximum Data Rate fMAX VCC = 1.8V 3V ≤ VCC ≤ 3.6V Driver Differential Output Delay tDD CD = 50pF (Figure 3) VCC = 1.8V 3V ≤ VCC ≤ 3.6V Driver Differential Output Skew tDSK CD = 50pF (Figure 3) VCC = 1.8V 3V ≤ VCC ≤ 3.6V Driver Differential Rise or Fall Time tR, tF CD = 50pF (Figure 3) VCC = 1.8V 3V ≤ VCC ≤ 3.6V Driver Enable to Output High Driver Enable to Output Low Driver Disable from Output High Driver Disable from Output Low tZH tZL tHZ tLZ RL = 500Ω, CL = 50pF, SW = GND (Figure 4) RL = 500Ω, CL = 50pF, SW = VCC (Figure 4) RL = 500Ω, CL = 50pF, SW = GND (Figure 4) RL = 500Ω, CL = 50pF, SW = VCC (Figure 4) Full Full Full Full Full Full Full Full Full Full Full Full 128 256 400 1700 1100 30 2 1600 960 460 460 60 60 2600 1500 200 30 2600 1500 800 800 250 250 kbps kbps ns ns ns ns ns ns ns ns ns ns DRIVER SWITCHING CHARACTERISTICS (ISL32614E, 256kbps Version) Maximum Data Rate fMAX RD = ∞, CD = 50pF VCC = 1.8V 3V ≤ VCC ≤ 3.6V Driver Differential Output Delay tDD RD = ∞, CD = 50pF (Figure 3) RD = ∞, CD = 50pF (Figure 3) RD = ∞, CD = 50pF (Figure 3) VCC = 1.8V 3V ≤ VCC ≤ 3.6V VCC = 1.8V 3V ≤ VCC ≤ 3.6V VCC = 1.8V 3V ≤ VCC ≤ 3.6V Full Full Full Full Full Full Full Full Full Full Full Full 256 500 200 700 350 30 2 1700 350 460 460 60 60 2000 500 200 30 2600 800 800 800 250 250 kbps kbps ns ns ns ns ns ns ns ns ns ns Driver Differential Output Skew tDSK Driver Differential Rise or Fall Time tR, tF Driver Enable to Output High Driver Enable to Output Low Driver Disable from Output High Driver Disable from Output Low NOTES: tZH tZL tHZ tLZ RL = 500Ω, CL = 50pF, SW = GND (Figure 4) RL = 500Ω, CL = 50pF, SW = VCC (Figure 4) RL = 500Ω, CL = 50pF, SW = GND (Figure 4) RL = 500Ω, CL = 50pF, SW = VCC (Figure 4) 7. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 8. Applies to peak current. See “Typical Performance Curves” on page 8 for more information. 9. If the Driver Enable function is not needed, connect DE to VCC through a 1kΩ to 2kΩ resistor. 10. Compliance to data sheet limits is assured by one or more methods: production test, characterization and/or design. 5 FN7906.0 August 30, 2011 ISL32613E, ISL32614E Test Circuits and Waveforms RL/2 Z D Y RL/2 VOC VOD VCC DE DI FIGURE 2. DC DRIVER TEST CIRCUITS VCC DI 50% 50% 0V tSD1 Z D Y SIGNAL GENERATOR RD CD OUT (Z) 50% OUT (Y) tDDLH DIFF OUT (Y - Z) 90% 50% 10% tR tSSK = |tSD1(Y) - tSD2(Y)| OR |tSD1(Z) - tSD2(Z)| tDDHL 90% 50% 10% tF tDSK = |tDDLH - tDDHL| +VOD -VOD 50% VOL tSD2 VOH VCC DE DI FIGURE 3A. TEST CIRCUIT FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE DI SIGNAL GENERATOR Z D Y 50pF 500Ω SW VCC GND tZH OUTPUT HIGH OUT (Y, Z) 50% tHZ DE 50% 50% VCC 0V VOH - 0.25V VOH 0V PARAMETER tHZ tLZ tZH tZL OUTPUT Y/Z Y/Z Y/Z Y/Z DI 1/0 0/1 1/0 0/1 SW GND VCC GND VCC OUTPUT LOW OUT (Y, Z) tZL 50% tLZ VCC VOL + 0.25V V OL FIGURE 4A. TEST CIRCUIT FIGURE 4B. MEASUREMENT POINTS FIGURE 4. DRIVER ENABLE AND DISABLE TIMES 6 FN7906.0 August 30, 2011 ISL32613E, ISL32614E Application Information Driver Features These transmitters are differential output devices that operate with VCC as low as 1.8V, and up to 3.6V. Devices are RS-485 compliant with VCC ≥ 3V, but significant power savings are obtained by operating at VCC = 1.8V. The transmitter outputs are tri-statable via the active high DE input. If the Tx enable function is not needed, tie DE to VCC through a 1kΩ to 2kΩ resistor. Outputs are slew rate limited to minimize EMI, and to reduce reflections in unterminated or improperly terminated networks. ESD Protection All pins on these devices include class 3 (8kV) Human Body Model (HBM) ESD protection structures, but the driver outputs incorporate advanced structures that allow them to survive ESD events in excess of ±16.5kV HBM and ±7kV to the IEC61000 contact test method. The RS-485 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether it is powered up or not, and without degrading the common mode range. This built-in ESD protection eliminates the need for board-level protection structures (e.g., transient suppression diodes) and the associated, undesirable capacitive load they present. 1.8V Operation The ISL32613E and ISL32614E operate with VCC as low as 1.8V. When coupled with the ISL32610E or ISL32611E 1.8V receivers, they provide a differential communication link optimized for very low power, and for slow data rates. Figures 7 and 8 illustrate the static and dynamic power savings from using these transmitters at low supply voltages. With VCC = 1.8V rather than 3.3V, using the ISL32613E at 128kbps reduces the operating supply current from 9.9mA to 56µA (a factor of 177)! Driver Overload Protection The driver output stages incorporate short-circuit, current-limiting circuitry, which ensures that the output current never exceeds the RS-485 specification over a ±2V (-7V to +12V for VCC ≥ 2.7V) common mode voltage range. In the event of a major short-circuit condition, the device also includes a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates power dissipation, allowing the die to cool. The drivers automatically re-enable after the die temperature drops by about +20°C. If the condition persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. 5.5V Tolerant Logic Pins Logic input pins (DI, DE) contain no ESD or parasitic diodes to VCC, so they withstand input voltages exceeding 5.5V, regardless of the VCC voltage. Hot Plug Function When a piece of equipment powers up, there is a period of time during which the processor or ASIC driving the RS-485 control line (DE) is unable to ensure that the RS-485 Tx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power-up may crash the bus. To avoid this scenario, these transmitters incorporate a “Hot Plug” function. During power-up, circuitry monitoring VCC ensures that the Tx outputs remain disabled for a period of time, regardless of the state of DE. This gives the processor/ASIC a chance to stabilize and drive the control lines to the proper states. Low Power Shutdown Mode This BiCMOS transmitter uses a fraction of the power required by its bipolar counterparts, but it also includes a shutdown feature that reduces the already low quiescent ICC to a 10nA trickle. This device enters shutdown whenever the driver disables (DE = GND). 7 FN7906.0 August 30, 2011 ISL32613E, ISL32614E Typical Performance Curves 18 DRIVER OUTPUT CURRENT (mA) 16 14 12 10 8 6 4 2 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 DIFFERENTIAL OUTPUT VOLTAGE (V) +25°C +125°C RD = 1 k Ω +85°C RD = 120Ω +25°C VCC = 1 .8V, TA = +25°C; Unless Otherwise Specified. 60 DE = VCC 50 40 ICC (µA) 30 20 10 0 -40 -15 10 35 60 85 110 125 TEMPERATURE (°C) FIGURE 5. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE FIGURE 6. STATIC SUPPLY CURRENT vs TEMPERATURE 10m RD = ∞, CD = 50pF 128kbps 10m RD = ∞, CD = 50pF 256kbps 1m ICC (A) 56kbps ICC (A) 1m 128kbps 56kbps 9.6kbps 100µ 9.6kbps 100µ 10µ 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 10µ 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 VCC (V) VCC (V) FIGURE 7. ISL32613E DYNAMIC SUPPLY CURRENT vs SUPPLY VOLTAGE AT DIFFERENT DATA RATES 100 FIGURE 8. ISL32614E DYNAMIC SUPPLY CURRENT vs SUPPLY VOLTAGE AT DIFFERENT DATA RATES -40°C 80 OUTPUT CURRENT (mA) +25°C 60 +125°C 40 20 Y OR Z = LOW Y OR Z = HIGH -20 -2.0 -1.5 -1.0 -0.5 0 0.5 OUTPUT VOLTAGE (V) +125°C 1.0 0 -40°C 1.5 2.0 FIGURE 9. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE 8 FN7906.0 August 30, 2011 ISL32613E, ISL32614E Typical Performance Curves RD = 10kΩ, CD = 50pF DI VCC = 1 .8V, TA = +25°C; Unless Otherwise Specified. (Continued) DRIVER INPUT (V) RD = 10kΩ, CD = 50pF DI DRIVER INPUT (V) DRIVER INPUT (V) 2 0 2 0 1.5 DRIVER OUTPUT (V) DRIVER OUTPUT (V) 1 0.5 Y-Z 0 -0.5 -1 -1.5 TIME (1µs/DIV) 1.5 1 0.5 Y-Z 0 -0.5 -1 -1.5 TIME (1µs/DIV) FIGURE 10. ISL32613E DRIVER WAVEFORMS, LOW TO HIGH FIGURE 11. ISL32614E DRIVER WAVEFORMS, HIGH TO LOW RD = 10kΩ, CD = 50pF DI DRIVER INPUT (V) 2 0 RD = 10kΩ, CD = 50pF DI 2 0 1.5 DRIVER OUTPUT (V) DRIVER OUTPUT (V) 1 0.5 Y-Z 0 -0.5 -1 -1.5 TIME (400ns/DIV) 1.5 1 0.5 Y-Z 0 -0.5 -1 -1.5 TIME (400ns/DIV) FIGURE 12. ISL32614E DRIVER WAVEFORMS, LOW TO HIGH FIGURE 13. ISL32614E DRIVER WAVEFORMS, HIGH TO LOW Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): GND PROCESS: Si Gate BiCMOS 9 FN7906.0 August 30, 2011 ISL32613E, ISL32614E Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest revision. DATE August 30, 2011 REVISION FN7906.0 Initial Release CHANGE Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ISL32613E, ISL32614E To report errors or suggestions for this datasheet, please go to: ww‘‘‘‘w.intersil.com/askourstaff FITs are available from our website at: http://rel.intersil.com/reports/search.php For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 10 FN7906.0 August 30, 2011 ISL32613E, ISL32614E Package Outline Drawing P6.064 6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE Rev 4, 2/10 1.90 0.95 D A 6 5 4 0-8° 0.08-0.22 2.80 3 1.60 +0.15/-0.10 3 (0.60) PIN 1 INDEX AREA 1 2 3 0.20 C 2x 0.40 ±0.10 3 SEE DETAIL X END VIEW B 0.20 M C A-B D TOP VIEW 10° TYP (2 PLCS) 2.90 ±0.10 3 1.15 +0.15/-0.25 C 1.45 MAX (0.25) GAUGE PLANE 0.10 C 0.00-0.15 SIDE VIEW SEATING PLANE DETAIL "X" 0.45±0.1 4 (0.95) (0.60) (1.20) NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. Dimensioning and tolerancing conform to ASME Y14.5M-1994. Dimension is exclusive of mold flash, protrusions or gate burrs. Foot length is measured at reference to gauge plane. Package conforms to JEDEC MO-178AB. (2.40) 2. 3. 4. 5. TYPICAL RECOMMENDED LAND PATTERN 11 FN7906.0 August 30, 2011