INCHANGE Semiconductor
isc Product Specification
isc N-Channel MOSFET Transistor
IRFZ44N
FEATURES ·Drain Current –ID=49A@ TC=25℃ ·Drain Source Voltage: VDSS= 55V(Min) ·Static Drain-Source On-Resistance : RDS(on) = 0.032Ω(Max) ·Fast Switching DESCRIPTION ·Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients. ABSOLUTE MAXIMUM RATINGS(Ta=25℃)
SYMBOL VDSS VGS ID IDM PD TJ Tstg PARAMETER Drain-Source Voltage Gate-Source Voltage-Continuous Drain Current-Continuous Drain Current-Single Pluse (tp≤10μs) Total Dissipation @TC=25℃ Max. Operating Junction Temperature Storage Temperature VALUE 55 ±20 49 160 94 175 -55~175 UNIT V V A A W ℃ ℃
THERMAL CHARACTERISTICS
SYMBOL Rth j-c Rth j-a PARAMETER Thermal Resistance, Junction to Case Thermal Resistance, Junction to Ambient MAX 1.5 62 UNIT ℃/W ℃/W
isc Website:www.iscsemi.cn
INCHANGE Semiconductor
isc Product Specification
isc N-Channel MOSFET Transistor
ELECTRICAL CHARACTERISTICS
TC=25℃ unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN
IRFZ44N
MAX
UNIT
V(BR)DSS
Drain-Source Breakdown Voltage
VGS= 0; ID= 0.25mA
55
V
VGS(th)
Gate Threshold Voltage
VDS= VGS; ID= 0.25mA
2
4
V Ω
RDS(on) IGSS
Drain-Source On-Resistance
VGS= 10V; ID= 25A VGS= ±20V;VDS= 0 VDS= 55V; VGS= 0 VDS= 55V; VGS= 0; Tj= 150℃ IS= 25A; VGS= 0
0.032 ±100 25 250 1.3
Gate-Body Leakage Current
nA μA
IDSS
Zero Gate Voltage Drain Current
VSD
Forward On-Voltage
V
·
isc Website:www.iscsemi.cn
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