APED3528EC

3.5x2.8 mm SMD CHIP LED LAMP APED3528EC HIGH EFFICIENCY RED Features !SINGLE COLOR. ! SUITABLE Description The High Efficiency Red source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Orange Light Emitting Diode. FOR ALL SMT ASSEMBLY AND " SOLDER PROCESS. !IDEAL FOR BACKLIGHTING. ! AVAILABLE !PACKAGE ON TAPE AND REEL. : 500PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. S PEC NO: DSAD1054 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/18/2003 DRAWN: L.ZHANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e L en s Ty p e Iv (m c d ) @ 20 m A Min . A P E D 3528E C HIGH EFFICIENCY RED (GaAsP/ GaP ) WATER CLEAR 18 Ty p . 50 V i ew i n g An g l e 2θ1/2 40° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°C Sy m b o l λpeak λD ∆λ1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength D ev i c e High Efficiency Red High Efficiency Red Ty p . 6 27 6 25 45 15 2.0 2.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s I F =20mA I F =20mA I F =20mA VF=0V;f=1MHz I F =20mA V R = 5V Spectral Line Half-width High Efficiency Red Capacitance Forward Voltage Reverse Current High Efficiency Red High Efficiency Red High Efficiency Red Absolute Maximum Ratings at T)=25°C Par am et er Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. H i g h E f f i c i en c y R ed 105 30 16 0 5 -40°C To +85°C Un it s mW mA mA V S PEC NO: DSAD1054 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/18/2003 DRAWN: L.ZHANG PAGE: 2 OF 4 High Efficiency Red APED3528EC S PEC NO: DSAD1054 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/18/2003 DRAWN: L.ZHANG PAGE: 3 OF 4 APED3528EC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) S PEC NO: DSAD1054 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/18/2003 DRAWN: L.ZHANG PAGE: 4 OF 4