0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
KK74HCT374AN

KK74HCT374AN

  • 厂商:

    KODENSHI(可天士)

  • 封装:

  • 描述:

    KK74HCT374AN - Octal 3-State Noninverting D Flip-Flop High-Performance Silicon-Gate CMOS - KODENSHI ...

  • 数据手册
  • 价格&库存
KK74HCT374AN 数据手册
TECHNICAL DATA KK74HCT374A Octal 3-State Noninverting D Flip-Flop High-Performance Silicon-Gate CMOS The KK74HCT374A is identical in pinout to the LS/ALS374. The KK74HCT374A may be used as a level converter for interfacing TTL or NMOS outputs to High-Speed CMOS inputs. Data meeting the setup and hold time is clocked to the outputs with the rising edge of the Clock. The Output Enable input does not affect the states of the flip-flops, but when Output Enable is high, the outputs are forced to the high-impedance state; thus, data may be stored even when the outputs are not enabled. • TTL/NMOS-Compatible Input Levels • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 4.5 to 5.5 V • Low Input Current: 1.0 µA ORDERING INFORMATION KK74HCT374AN Plastic KK74HCT374ADW SOIC TA = -55° to 125° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM FUNCTION TABLE PIN 20=VCC PIN 10 = GND Output Enable L L L H L,H, X Inputs Clock D H L X X Output Q H L no change Z X = don’t care Z = high impedance 1 KK74HCT374A MAXIMUM RATINGS* Symbol VCC VIN VOUT IIN IOUT ICC PD Tstg TL * Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) Value -0.5 to +7.0 -1.5 to VCC +1.5 -0.5 to VCC +0.5 ±20 ±35 ±75 750 500 -65 to +150 260 Unit V V V mA mA mA mW °C °C Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT TA tr, tf Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1) Min 4.5 0 -55 0 Max 5.5 VCC +125 500 Unit V V °C ns This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. 2 KK74HCT374A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Test Conditions V Guaranteed Limit 2 5 °C to -55°C 2.0 2.0 0.8 0.8 4.4 5.4 3.98 0.1 0.1 0.26 ±0.1 ±0.5 ≤85 °C 2.0 2.0 0.8 0.8 4.4 5.4 3.84 0.1 0.1 0.33 ±1.0 ±5.0 ≤125 °C 2.0 2.0 0.8 0.8 4.4 5.4 3.7 0.1 0.1 0.4 ±1.0 ±10 µA µA V Unit VIH VIL VOH Minimum HighLevel Input Voltage Maximum Low Level Input Voltage Minimum HighLevel Output Voltage VOUT=0.1 V or VCC-0.1 V ⎢IOUT⎢≤ 20 µA VOUT=0.1 V or VCC-0.1 V ⎢IOUT⎢ ≤ 20 µA VIN=VIH or VIL ⎢IOUT⎢ ≤ 20 µA VIN=VIH or VIL ⎢IOUT⎢ ≤ 6.0 mA 4.5 5.5 4.5 5.5 4.5 5.5 4.5 4.5 5.5 4.5 5.5 5.5 V V V VOL Maximum LowLevel Output Voltage VIN= VIL or VIH ⎢IOUT⎢ ≤ 20 µA VIN= VIL or VIH ⎢IOUT⎢ ≤ 6.0 mA IIN IOZ Maximum Input Leakage Current Maximum Three State Leakage Current Maximum Quiescent Supply Current (per Package) Additional Quiescent Supply Current VIN=VCC or GND Output in High-Impedance State VIN =VIH or VIL VOUT=VCC or GND VIN=VCC or GND IOUT=0µA VIN=2.4 V, Any One Input VIN=VCC or GND, Other Inputs IOUT=0µA ICC 5.5 4.0 40 160 µA ∆ICC ≥-55°C 25°C to 125°C 2.4 mA 5.5 2.9 3 KK74HCT374A AC ELECTRICAL CHARACTERISTICS (VCC =5.0 V ± 10%, CL=50pF,Input tr=tf=6.0 ns) Guaranteed Limit Symbol Parameter 2 5 °C to -55°C 30 31 30 30 12 10 15 ≤85°C ≤125°C Unit fmax tPLH, tPHL tPLZ, tPHZ tPZH, tPZL tTLH, tTHL CIN COUT Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4) Maximum Propagation Delay, Clock to Q (Figures 1 and 4) Maximum Propagation Delay, Output Enable to Q (Figures 2 and 5) Maximum Propagation Delay, Output Enable to Q (Figures 2 and 5) Maximum Output Transition Time, Any Output (Figures 1 and 4) Maximum Input Capacitance Maximum Three-State Output Capacitance (Output in High-Impedance State) Power Dissipation Capacitance (Per Flip-Flop) 24 39 38 38 15 10 15 20 47 45 45 18 10 15 MHz ns ns ns ns pF pF Typical @25°C,VCC=5.0 V 65 pF CPD Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC TIMING REQUIREMENTS (VCC =5.0 V ± 10%, CL=50pF,Input tr=tf=6.0 ns) Guaranteed Limit Symbol tSU th tw tr, tf Parameter Minimum Setup Time, Data to Clock (Figure 3) Minimum Hold Time, Clock to Data (Figure 3) Minimum Pulse Width, Clock (Figure 1) Maximum Input Rise and Fall Times (Figure 1) 25 °C to -55°C 12 5.0 12 500 ≤85°C 15 5.0 15 500 ≤125°C 18 5.0 18 500 Unit ns ns ns ns 4 KK74HCT374A Figure 1. Switching Waveforms Figure 2. Switching Waveforms Figure 3. Switching Waveforms Figure 4. Test Circuit Figure 5. Test Circuit EXPANDED LOGIC DIAGRAM 5 KK74HCT374A N S UFFIX PLAS TIC DIP (MS - 0 0 1 AD) A Dimens ion, mm 20 11 B 1 10 Symbol A B C MIN 24.89 6.1 MAX 26.92 7.11 5.33 F L D F 0.36 1.14 2.54 7.62 0° 2.92 7.62 0.2 0.38 0.56 1.78 C -T- SEATING PLAN E G H H J N G D 0.25 (0.010) M T K M J K L M N 10° 3.81 8.26 0.36 NOTES : 1. Dimen s io n s “A ”, “B” d o n o t in clu d e mo ld flas h o r p ro tru s io n s . Maximu m mo ld flas h o r p ro tru s io n s 0.25 mm (0.010) p er s id e. D S UFFIX S OIC (MS - 0 1 3 AC) A 20 11 Dimens ion, mm Symbol MIN 12.6 7.4 2.35 0.33 0.4 1.27 9.53 0° 0.1 0.23 10 0.25 8° 0.3 0.32 10.65 0.75 MAX 13 7.6 2.65 0.51 1.27 H B P A B 1 G 10 C R x 45 C D F -TD 0.25 (0.010) M T C M K SE AT IN G PL AN E J F M G H J K M P R NOTES : 1. Dimen s io ns A an d B d o n o t in clud e mo ld flas h o r p ro tru s ion . 2. M aximu m mo ld flas h o r p ro tru s io n 0.15 mm (0.006) p er s id e fo r A ; fo r B ‑ 0.25 mm (0.010) p er s id e. 6
KK74HCT374AN 价格&库存

很抱歉,暂时无法提供与“KK74HCT374AN”相匹配的价格&库存,您可以联系我们找货

免费人工找货