MT5470A-LWT

3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MT5470A-LWT 5.2x4.6mm OVAL LED LAMP ATTENTION OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES 5.2×4.6mm OVAL LED LAMP MT5470A-LWT Description This white lamp is made with InGaN/Sapphire chip and water clear epoxy resin. 5.2 24.0 MIN. 1.5 TYP. 7.8 4.6 2.54±0.1 A K Notes: 1. All dimensions are in mm. 2. Tolerance is± 0.25mm unless otherwise noted. Description Part No. MT5470A-LWT LED Chip Material InGaN/Sapphire Emitting Color White VER.: 01 Lens Color Water clear Date: 2008/03/12 Page: 1/5 5.2×4.6mm OVAL LED LAMP MT5470A-LWT Absolute Maximum Ratings at Ta=25℃ Parameter Symbol Rating Unit Power Dissipation PD 108 mW Reverse Voltage VR 5 V D.C. Forward Current If 30 mA Reverse (Leakage) Current Ir 50 μA If(Peak) 100 mA Operating Temperature Range Topr. -25 to +85 ℃ Storage Temperature Range Tstg. -40 to +100 ℃ Soldering Temperature(1.6mm from body) Tsol. Electrostatic discharge ESD. Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Dip Soldering : 260℃ for 5 sec. Hand Soldering : 350℃ for 3 sec. 6000 V Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Max. Unit Luminous Intensity IV = If 20mA 2130 5860 mcd Forward Voltage Vf = If 20mA 3.0 3.6 V CCT = If 20mA 4500 5500 o Correlated Colour Temperature Reverse (Leakage) Current VERTICAL Ir Vr=5V 2θ1/2 = If 20mA 50 K µA 40 Viewing Angle deg HORIZONTAL 2θ1/2 = If 20mA 70 Notes: 1. The datas tested by IS tester. 2. Customer’s special requirements are also welcome. VER.: 01 Date: 2008/03/12 Page: 2/5 5.2×4.6mm OVAL LED LAMP MT5470A-LWT Relative Response Typical Electrical / Optical Characteristics Curves : Wavelength(nm) WHITE LED SPECTRUM VS. WAVELENGTH 5000 40 Relative Luminous Intensity Forward Current IF(mA) 50 30 20 10 2.0 2.6 3.0 3.4 3.8 3000 2000 1000 0 4.2 Applied Voltage (V) FORWARD CURRENT VS.APPLIED VOLTAGE 4000 20.0 10.0 0.0 30.0 Forward Current (mA) FORWARD CURRENT VS. LUMINOUS INTENSITY 0° 50 20° 10° Forward Current IF(mA) 30° 40 HORIZONTAL VERTICAL 40° 30 1.0 20 60° 0.8 10 0 50° 0.9 20 40 60 Temperature(。C) 80 100 70° 80° 90° 0.7 0.5 0.3 0.1 0.2 0.4 0.6 RADIATION DIAGRAM FORWARD CURRENT VS. AMBIENT TEMPERATURE VER.: 01 Date: 2008/03/12 Page: 3/5 MT5470A-LWT 5.2×4.6mm OVAL LED LAMP Specifications for Bin Grading: Iv(mcd) BIN MIN. MAX. V 2130 3000 W 3000 4180 X 4180 5860 Specifications for Vf Group: Vf(V) Group MIN. MAX. V8 3.0 3.2 V9 3.2 3.4 V10 3.4 3.6 Specifications for Colour Temperature Group: CCT (oK) @20mA MIN. MAX. 4500 4750 4750 5000 5000 5250 5250 5500 VER.: 01 Date: 2008/03/12 Page: 4/5 MT5470A-LWT 5.2×4.6mm OVAL LED LAMP Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at h igh temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130℃. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip soldering : Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds. Solder bath: 260± 5℃ (Solder temperature), Within 5 seconds. (3) H and soldering: 350℃ max. (Temperature of soldering iron tip), Within 3 seconds. 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same. 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make s ure not to apply external force, stress, and excessive vibration to the LED and follow the con ditions below. Ba king temperature: 120℃ max. Bak ing time: Within 60 seconds. If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 01 Date: 2008/03/12 Page: 5/5