MT5470E-OR

3 Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : 0T(-25 5.2×4.6mm OVAL LED LAMP 5.2×4.6mm OVAL LED LAMP 0T7(-25 Description This amber lamp is made with AlGaInP/GaAs chip and white diffused epoxy resin. 5.2 24.0 MIN. 1.5 TYP. 7.8 0.5 MAX. 4.6 2.54±0.1 A K Notes: 1. All dimensions are in mm. 2. Tolerance is±0.25mm unless otherwise noted. Description LED Chip Part No. 07(25 Material Emitting Color AlGaInP/GaAs Amber VER.: 01 Lens Color White diffused Date: 201/2/ Page: 1/5 5.2×4.6mm OVAL LED LAMP 0T7(-25 Absolute Maximum Ratings at Ta=25℃ Parameter Symbol Rating Unit Power Dissipation PD 125 mW Reverse Voltage VR 5 V D.C. Forward Current If 50 mA Reverse (Leakage) Current Ir 100 μA If(Peak) 200 mA Operating Temperature Range Topr. -40 to +95 ℃ Storage Temperature Range Tstg. -40 to +100 ℃ Soldering Temperature(1.6mm from body) Tsol. Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Dip Soldering : 260℃ for 5 sec. Hand Soldering : 350℃ for 3 sec. Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Luminous Intensity IV If=20mA 2130 3000 Forward Voltage Vf If=20mA 2.1 Peak Wavelength λp If=20mA 610 Dominant Wavelength λd If=20mA Reverse (Leakage) Current Ir Vr=5V VERTICAL 2θ1/2 If=20mA HORIZONTAL 2θ1/2 If=20mA 60 ∆λ If=20mA 17 600 605 Max. Unit mcd 2.6 V nm 609 nm 100 µA 40 ViewingAngle deg Spectrum Line Halfwidth nm Notes: 1. The datas tested by IS tester. 2. Customer’s special requirements are also welcome. VER.: 01 Date: 201/2/ Page:/5 0T7(-25 5.2×4.6mm OVAL LED LAMP Specifications for Bin Grading: Iv(mcd) BIN MIN. MAX. V 2130 3000 W 3000 4180 X 4180 5860 Specifications for Vf Group: Vf(V) Group MIN. MAX. V1 1.6 1.8 V2 1.8 2.0 V3 2.0 2.2 V4 2.2 2.4 V5 2.4 2.6 *Majority VF bins are highlighted in Yellow. Specifications for Wavelength Group: λd(nm) Group MIN. MAX. X2 600 603 X3 603 606 X4 606 609 VER.: 01 Date: 201/2/ Page:/5 5.2×4.6mm OVAL LED LAMP 0T7(-25 Typical Electrical / Optical Characteristics Curves : 5000 Relative Luminous Intensity Forward Current IF(mA) 50 40 30 20 10 1.2 1.6 2.0 2.4 2.8 4000 3000 2000 1000 3.2 0.0 Applied Voltage (V) 20.0 10.0 30.0 Forward Current (mA) FORWARD CURRENT VS.APPLIED VOLTAGE FORWARD CURRENT VS. LUMINOUS INTENSITY 0° 100 20° 10° Forward Current IF(mA) 30° 80 HORIZONTAL VERTICAL R j-pin=220℃/W 40° 60 1.0 40 50° 0.9 60° 0.8 20 70° 80° 90° R j-a=450 ℃/W 0 20 40 60 Temperature (℃) 80 100 0.7 0.5 0.3 0.1 0.2 0.4 0.6 RADIATION DIAGRAM FORWARD CURRENT VS. AMBIENT TEMPERATURE VER.: 01 Date: 201/2/ Page:/5 5.2×4.6mm OVAL LED LAMP 0T7(-25 Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130℃. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip soldering : Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds. Solder bath: 260±5℃ (Solder temperature), Within 5 seconds. (3) Hand soldering: 350℃ max. (Temperature of soldering iron tip), Within 3 seconds. 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same. 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120℃ max. Baking time: Within 60 seconds. If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 01 Date: 201/2/ Page:/5