LX13043
1.0A Low Dropout Regulator
®
TM
P RODUCTION D ATA S HEET
KEY FEATURES
DESCRIPTION
The LX13043 features on-chip
trimming of the internal voltage
enabling precise output voltages. The
BiPolar output transistor has a low
dropout voltage even at full output
current (VDO < 1.2V typical @ 1.0A).
Output voltage overshoot is minimized
for rapid supply rise times on VIN, such
as; 5V / µS ramp.
Thermal and Short Circuit Current
Protection are integrated on-chip.
Microsemi’s micro power package is
JEDEC compliant with MO-229 and
meets the full RoHS initiative for Pbfree content.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
Accurate Output Voltage
Typical Dropout of 1.2V at 1.0A
Independent Thermal and Current
Limit Protection
No Minimum Load Rqmt. for IOUT
Tight Load Regulation (0.4%)
Wide DC Supply: 4.5V to 10V
Loop Stability Independent of
Output Capacitor Type
1mm Height SMT Power
Package, 3x3mm Footprint
Package is Lead Free and RoHS
Compliant
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The LX13043 positive voltage linear
regulator is configured with a fixed
3.3V output, featuring low dropout,
tight line, load and thermal regulation.
VOUT is controlled and predictable
as UVLO and output slew rate govern
the start-up phase.
The LX13043 regulator is stable
with ceramic, tantalum or electrolytic
capacitors; typically 10μF is sufficient
in most applications. This provides
designers with a flexible power
management solution.
The regulator design is optimized
for system efficiency by consuming
minimal ground current and directing
quiescent current to the load.
APPLICATIONS
5V to 3.3V Regulator
Hard Disk Drives, CD-ROMs
ADSL and Cable Modems
Battery Charging Circuits
Instrumentation
PC Peripherals
PRODUCT HIGHLIGHT
VOUT 3.3V
@ 1.0A
LX13043
Part
VIN
COUT
10µF
CIN
10µF
PACKAGE ORDER INFO
OUTPUT V
LD
Plastic MO-229
6-PIN
Part Marking
LX13043
TJ (°C)
RoHS Compliant / Pb-free
0 to 125
3.3V
LX13043CLD
3043
Note: Available in Tape & Reel. Append the letters “TR” to the part number. (i.e. LX13043CLD-TR)
Copyright © 2005
Rev. 1.0, 2006-06-26
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1
LX13043
1.0A Low Dropout Regulator
®
TM
P RODUCTION D ATA S HEET
ABSOLUTE MAXIMUM RATINGS
PACKAGE PIN OUT
N.C.
1
6
GND
VOUT
2
5
N.C.
VIN
3
4
N.C.
LD PACKAGE
Note:
Exceeding these ratings could cause damage to the device. All voltages are with
respect to Ground. Currents are positive into, negative out of specified terminal.
(Top View)
RoHS / Pb-free 100% Matte Tin Lead Finish
*HS Must be connected to GND or left
floating (see pages 6 and 7 for details)
THERMAL DATA
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Input Voltage (VIN)....................................................................................................13.5V
Load Current ............................................................................................Internally Limited
Power Dissipation ....................................................................................Internally Limited
Short-Circuit Protection ........................................................................................ Indefinite
Operating Junction Temperature................................................................................ 150°C
Storage Temperature Range.........................................................................-65°C to 150°C
Peak Package Solder Reflow Temp. (40 seconds max. exposure) ................. 260°C (+0,-5)
N.C. – No Internal Connection
LD
Plastic MO-229 6-Pin
THERMAL RESISTANCE-JUNCTION TO TAB, θJT
6°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
(TYPICAL, DEPENDING ON MOUNTING / PCB LAYOUT)
25-50°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the
above assume no ambient airflow. ΘJA can vary significantly depending on mounting technique. (See
Application Notes Section: Thermal considerations)
FUNCTIONAL PIN DESCRIPTION
PIN NAME
VIN
GND
VOUT
DESCRIPTION
Positive unregulated supply input for the regulator. Bypass to GND with at least 10µF of low ESR and ESL
capacitance.
Common terminal for ground reference. The input and output bypass capacitors should be connected to this pin.
In addition the tab on the “LD” package is also used for heat sinking the device.
Regulator output. It is recommended to bypass to GND with at least 10µF. Size your output capacitor to meet
the transient loading requirement. If you have a very dynamic load, a lower ESR capacitor will improve the
response to these load steps.
OPERATING RATING
Symbol
Input Voltage
VIN
Min
LX13043
Typ
4.5
Max
Units
10
V
Load Current (with adequate heat sinking)
IL
1000
mA
Operating Junction Temperature
TJ
140
°C
Operating Rating: Conditions for which the device is intended to be functional but does not guarantee electrical characteristics meet the
minimum / maximum limits. VOUT to remain within ±10% of nominal from 125 to 140°C TJ
Copyright © 2005
Rev. 1.0, 2006-06-26
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
PACKAGE DATA
Parameter
LX13043
®
TM
1.0A Low Dropout Regulator
P RODUCTION D ATA S HEET
ELECTRICAL CHARACTERISTICS
`
Fixed Output (3.3V)
Output Voltage
VOUT
Line Regulation
ΔVOUT(VIN)
Load Regulation
ΔVOUT(IOUT)
Dropout Voltage (PWR)
Current Limit
Regulator Stability
Quiescent Current
Ripple Rejection
RMS Output Noise (% of VOUT)
Thermal Shutdown
IL
COUT ESR
Transient Response:
Change of VOUT From Fast VIN
Transient Response:
Change of VOUT to Short Ckt
Transient Response:
Change of VOUT to Step Load
3.2175
3.300
3.3825
V
4.75V < VIN < 5.25V, IOUT = 10mA
6
15
mV
10mA < IOUT < 1.0A, VIN = 4.75V
8
12
mV
ILOAD = 1.0A, ΔVOUT = -1%
1.18
1.3
V
ILOAD = 0.5A, ΔVOUT = -1%
1.1
1.17
ΔV
IOUT (MAX)
Minimum Load Current
5mA < IOUT < 1.0A, 4.75V < VIN < 5.25V
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The following specifications apply over the operating ambient temperature 0°C ≤ TJ ≤ 125°C except where otherwise noted and with the
following test conditions: VIN = 5V, IOUT = 10mA, CIN= 10μF (Tantalum or Ceramic), COUT= 10μF (Tantalum or Ceramic) and TJ = TA
using low duty cycling methods.
LX13043
Parameter
Symbol
Test Conditions
Units
Min
Typ
Max
VOUT (MAX)
VOUT (MAX)
VOUT
VIN = 5.5V, VOUT @ -10% from nominal
1.0
A
Note 1
0
mA
ESR measured at 10KHz 2.2µF < COUT < 22µF
guaranteed stability for VOUT, Note 2
10
VINPUT rise time > 1µS, 10mA < IOUT 1µs, VIN = 5V. Note 2
IOUT sequenced from 10Ma to 1.0A, ILOAD rise time
of > 1µs, VIN = 5V, Note 2
mΩ
IQ
VIN < 7V, 2mA < IOUT < 1.0A
2.6
PSRR
F = 120Hz, VIN = 5V, Note 2
40
dB
0.003
%/V
150
°C
VOUT (RMS)
TJSD
10Hz < f < 10kHz
4.75V < VIN < 5.25V, Thermal shutdown is met
when IOUT to the load is reduced to < 5mA, Note 2
140
Note 1: Minimum load current is defined as the amount of output current required to maintain regulation.
Note 2: Performance is assured by design characterization and correlation with statistical process control.
ELECTRICALS
Copyright © 2005
Rev. 1.0, 2006-06-26
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 3
LX13043
®
TM
1.0A Low Dropout Regulator
P RODUCTION D ATA S HEET
BLOCK DIAGRAM
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VIN
C1
10μF
VOUT
BIAS
C2
10μF
+
VREF
GND
Note: Application circuit above using ceramic capacitors.
Figure 1 – Fixed Output
BLOCK DIAGRAMS
Copyright © 2005
Rev. 1.0, 2006-06-26
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 4
LX13043
1.0A Low Dropout Regulator
®
TM
P RODUCTION D ATA S HEET
CHARACTERISTIC CURVES
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STEP LOAD STABILITY 10MA TO 1.0A
SUPPLY VOLTAGE, FAST TURN ON (TRISE = 1µS)
CH1: VOUT, CH4: ISTEP, CIN = 10µF, COUT = 10µF Ceramic,
VDROOP = 50mV
CH1: VOUT, CH2: VIN, CIN = 10µF, COUT = 10µF Ceramic, Load
Current, DC = 10mA
SHORT CIRCUIT AND RECOVERY
VOLTAGE OVER TEMPERATURE
3.315
Voltage
3.310
3.305
3.300
3.295
3.290
3.285
3.280
3.275
-10°C
25°C
60°C
95°C
Tem perature
130°C
GRAPHS
CH1: VOUT, CH4: IOUT 1A/div, CIN = 10µF, COUT = 10µF Ceramic
Copyright © 2005
Rev. 1.0, 2006-06-26
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 5
LX13043
TM
1.0A Low Dropout Regulator
®
P RODUCTION D ATA S HEET
APPLICATION INFORMTION
PD = (VIN(MAX)-VOUT) * IOUT
(Note: power dissipation resulting from quiescent (ground) current is negligible)
For the 3 x 3mm, 6 lead MO-229 package, thermal resistance,
ΘJUNCTION-AMB is 25-45°C/W depending on component
placement and ground plane area that serves as the heatsink
(HS) when mounting on a FR4 copper clad PCB. Junction
temperature of the integrated circuit can be calculated using:
TJUNCTION = TJUNCTION-HS RISE _+ THS-AMB RISE + TAMB
THEATSINK = PD MAX * θJ-HS ;
TTB-AMB = PD REG * θPCB
An example: Given conditions:
TA = 50°C, VIN = 5.0V, VOUT= 3.3V, IOUT= 800mA.
Calculated values:
TJ-HS RISE
= (5V-3.3V) * (0.8A) * 6°C/W = (1.36W) * 6°C/W = 8.2°C
THS-AMB RISE = ( 1.36W ) * 32°C/W = 43.5°C
TJUNCTION = 8.2°C + 43.5°C + 50°C = 101.7°C
It is important to note although the output rating of the
regulator is 1.0A, heat generated from power dissipation may
limit the useful current draw. The junction temperature should
be calculated for actual operating conditions (VIN, TAMB, IOUT,
θPCB) to insure the maximum junction temperature is not
exceeded.
SOLDER REFLOW
The LX13043 package design has been engineered to meet the
Lead Free Reflow Profile (260°C) for a JEDEC J-STD 020B
MSL1 rating and does not contain Pb.
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 6
APPLICATIONS
Copyright © 2005
Rev. 1.0, 2006-06-26
THERMAL CONSIDERATIONS
Thermal shutdown protects the integrated circuit from thermal
overload caused from a rise in junction temperature during
power dissipation. This means of protection is intended for fault
protection only and not as a means of current or power limiting
during normal application usage. Proper thermal evaluation
should be done to ensure that the junction temperature does not
exceed its maximum rating. Operating beyond the maximum TJ
of 150°C can impact reliability. Due to variation in individual
device electrical characteristics and thermal resistance, the built
in thermal overload protection may be activated at power levels
slightly above or below the rated dissipation. Also peak output
power should be considered for each individual output.
Power dissipation for regulator can be calculated using the
following equation:
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DESCRIPTION
The LX13043 is part of a family of LDO (Low Drop-Out)
linear regulators in the JEDEC MO-229 package which
offers maximum power dissipation in a low profile surface
mount technology. The family includes either fixed or
adjustable output versions. The output can supply up to 1.0A
with a regulator design optimized for system efficiency by
consuming minimal ground current and directing quiescent
current to the load.
INPUT CAPACITOR
To improve load transient response and noise rejection an
input bypass capacitor of at least 10µF is required.
Generally we recommend a 10µF ceramic or tantalum or
22µF electrolytic capacitor.
OUTPUT CAPACITOR
The regulator requires an output capacitor connected
between VOUT to GND to stabilize the internal control loop.
Many types of capacitors are available, with different
capacitance values tolerances, temperature coefficients and
equivalent series resistance. We recommend a minimum of
10µF to ensure good transient response from the power
supply system under rapidly changing current load
conditions.
Designers generally use additional output
capacitors connected in parallel. Such an arrangement serves
to minimize the effects of the parasitic resistance (ESR) and
inductance (ESL) that are present in all capacitors. The
regulator has been tested stable with capacitor ESR’s in the
range of 0.03 to 3 ohms. We have found it best to use the
same type of capacitor for both input and output bypass.
MINIMUM LOAD REQUIREMENT
The LX13043 does not have a minimum load requirement
for proper output regulation.
TEMPERATURE PROTECTION
The thermal protection shuts the LX13043 down when the
junction temperature exceeds 160°C. Exposure to absolute
maximum rated conditions for extended periods may affect
device reliability (see Thermal Considerations below).
CURRENT LIMIT PROTECTION
The LX13043 includes over current protection. When the
output load current exceeds the internal threshold, the circuit
forces the regulator output voltage to decrease.
LX13043
1.0A Low Dropout Regulator
®
TM
P RODUCTION D ATA S HEET
MECHANICAL DRAWINGS
MO-229 6 Pin Plastic 3 x 3 x .9 mm
D
L1
D2
Pin 1 ID
E
E2
L
K
b
A1
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LD
e
A
Dim
A
A1
K
e
L
b
D2
E2
D
E
L1
MILLIMETERS
MIN MAX
0.80 1.00
0.00 0.05
0.20 MIN
0.95 BSC
0.30 0.50
0.30 0.45
1.90 2.40
1.15 1.65
3.00 BSC
3.00 BSC
0.00 0.15
INCHES
MIN
MAX
0.031
0.039
0.000
0.002
0.008 MIN
0.037 BSC
0.012
0.02
0.012
0.018
0.75
0.094
0.045
0.065
0.118 BSC
0.118 BSC
0.000
0.006
Note:
1. Dimensions do not include mold flash or
protrusions;
these
shall
not
exceed
0.155mm(.006”) on any side. Lead dimension
shall not include solder coverage.
MECHANICALS
Copyright © 2005
Rev. 1.0, 2006-06-26
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 7
LX13043
TM
1.0A Low Dropout Regulator
®
P RODUCTION D ATA S HEET
NOTES
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NOTES
PRODUCTION DATA – Information contained in this document is proprietary to
Microsemi and is current as of publication date. This document may not be modified in
any way without the express written consent of Microsemi. Product processing does not
necessarily include testing of all parameters. Microsemi reserves the right to change the
configuration and performance of the product and to discontinue product at any time.
Copyright © 2005
Rev. 1.0, 2006-06-26
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 8
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