LX24232ILQ-TR

P R ODUC T BR IE F TM ® LX24232 - 32 Channel BackLight LED Driver DESCRIPTION KEY FEATURES W W W. Microsemi . CO M The LX24232 is a 32-channel display backlight LED controller. The device is part of a chipset consisting of the LX24232 and the LX23108A 8channel LED driver. Each controller is capable of controlling up to 32 LED channels, by controlling up to four LX23108A LED drivers. Each driver contains eight FETs and controls up to 4 x 8 LED channels, where each channel is capable of driving a current of up to 200mA. The LX24232 has 32 independent, frame-by-frame controlled PWM output channels; each output channel supports independent duty-cycle and phase delay control. It uses a Vsync input for flexible synchronization schemes, including synchronization to either rising or falling edges, optimal Vsync jitter support, as well as single or multiple PWM cycles per frame support, and loss of Vsync support. The LX24232 consists of an on-chip internal power supply control circuitry that can be used to adjust the voltage level of an external LED power source. This is done by regulating the LED supply voltage to the optimum level, and thus minimizing the system power loss. At the same time, accurate current regulation for each of the 32 LED strings is maintained. The LX24232 includes an on-chip analog to digital converter for drain voltage (VD) measurements, for power supply control, fault detection and protection. The device is configured through the SPI interface which speeds up communication and reduces the number of control signals between the LX24232 and the host system (FPGA, Video Processor, and CPU). The LX24232 supports a daisy chain connection in case more than 32 channels are required and can detect three types of system faults on each of its 32 channels (over-temperature, open LEDs and short LEDs). After detecting the faults the unit takes the required measures to protect the system. The LX24232 is capable of controlling up to 8 LX23108A drivers, in a special configuration where two consecutive channels are connected together for increased current support. Refer to the application note for more details. ♦ W hite LED or RGB BackLight driver for large size display panels Up to 32 LED strings with ±1.5% precision current matching ♦ ♦ W ide dimming ratio with PWM and LED current amplitude control 12-bit PWM duty-cycle resolution and 8-bit resolution for LED current setting ♦ ♦ ♦ ♦ LED power supply voltage control SPI communication interface Open string, short LED and over-temperature protection for each individual channel On-chip thermal monitoring ♦ LX24232 PACKAGE ORDER INFO Plastic 8x8mm QFN 56 pin RoHS Compliant/Pb free LX24232ILQ -40 to +85°C Note: Available in Tape & Reel. Append the letters ”TR” to the part number. (i.e. LX24232ILQ-TR) TA (°C) Copyright  2011 Rev. 0.1, April 2011 Microsemi C O M P ANY C O NF I DE NTI AL TM ® LX24232 - 32 Channel BackLight LED Driver Pin Configuration PSEL_SIG W W W. Microsemi . CO M PWM00 PWM01 PWM02 PWM03 PWM04 PWM05 PWM06 PWM07 PWM08 PWM09 PWM10 PWM11 PWM21 PS_CTRL 1 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 PWM13 SDI 2 41 PWM14 MOD0 3 40 PWM15 MOD1 4 CLK 5 SCAN0 6 SCAN1 7 VDD SCAN2 SCAN3 SCK CS_N SYNC_IN SYNC_OUT 8 9 10 11 12 13 39 FAULT_IN 38 VZAP PWM12 37 VREF 36 ATB_P 35 ATB_N 34 VDMEAS 33 VCC 32 PSEL_CLK 31 PWM16 30 PWM17 LX24232ILQ 32-CHANNEL LED DRIVER 14 29 PWM18 15 16 17 18 19 20 21 22 23 24 25 26 27 28 ABSOLUTE MAXIMUM RATINGS Supply Input Voltage (VCC, VDD) ….………………………………………..……………….… -0.5V to 4.5V All other pins…………………………………………………………….……. -0.5V to VCC+0.3 up to 4.5V Operating Ambient Temperature Range……………………………………….………………. -40 to 85°C Maximum Operating Junction Temperature………………………………………….……………….150°C ESD Protection at all I/O pins……………………………………………….………………… +/- 2KV HBM Storage Temperature Range………………………………………………………….……. -65°C to 150°C Package Peak Temperature for Solder Reflow (40 seconds maximum exposure)….… 260°C (+0/-5°C) Notes: Exceeding these ratings could result in damage to the device. All voltages are with respect to Ground. THERMAL DATA (POWER CONSUMPTION) 21°C/W – according to JESD51-7. THERMAL RESISTANCE-JUNCTION TO AMBIENT Junction Temperature Calculation: TJ = TA + (PD x θJA). For support contact: sales_AMSG@microsemi.com or visit our website at www.microsemi.com. SDO PWM30 PWM29 PWM31 PWM20 PWM19 PWM22 PWM24 PWM23 PWM25 PWM27 PWM26 PWM28 LX24232 Copyright  2011 Rev. 0.1, April 2011 Microsemi