ZL40215
Precision 1:4 LVDS Fanout Buffer
with On-Chip Input Termination
Data Sheet
November 2012
Ordering Information
Features
ZL40215LDG1
ZL40215LDF1
Inputs/Outputs
•
Accepts differential or single-ended input
• LVPECL, LVDS, CML, HCSL LVCMOS
16 Pin QFN
16 Pin QFN
Matte Tin
Trays
Tape and Reel
Package size: 3 x 3 mm
•
On-chip input termination resistors and biasing for
AC coupled inputs
•
Four precision LVDS outputs
Applications
•
Operating frequency up to 750 MHz
•
General purpose clock distribution
Power
•
Low jitter clock trees
•
Options for 2.5 V or 3.3 V power supply
•
Logic translation
•
Current consumption of 62 mA
•
Clock and data signal restoration
•
On-chip Low Drop Out (LDO) Regulator for superior
power supply rejection
•
Wired communications: OTN, SONET/SDH, GE,
10 GE, FC and 10G FC
•
Wireless communications
•
High performance micro-processor clock
distribution
-40oC to +85oC
Performance
•
Ultra low additive jitter of 78 fs RMS
out0_p
out0_n
ctrl
vt
clk_p
clk_n
out1_p
out1_n
Termination
and Bias
Buffer
out2_p
out2_n
out3_p
out3_n
Figure 1 - Functional Block Diagram
1
Microsemi Corporation
Copyright 2012, Microsemi Corporation. All Rights Reserved.
ZL40215
Data Sheet
Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Inputs/Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.0 Package Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.0 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.0 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 Clock Inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2 Clock Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.3 Device Additive Jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.4 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.4.1 Sensitivity to power supply noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.4.2 Power supply filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.4.3 PCB layout considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.0 AC and DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.0 Performance Characterization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.0 Typical Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.0 Package Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8.0 Mechanical Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2
Microsemi Corporation
ZL40215
Data Sheet
List of Figures
Figure 1 - Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 2 - Pin Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 3 - Simplified Diagram of input stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 4 - Clock Input - LVPECL - DC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 5 - Clock Input - LVPECL - AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 6 - Clock Input - LVDS - DC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 7 - Clock Input - LVDS - AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 8 - Clock Input - CML- AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 9 - Clock Input - HCSL- AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 10 - Clock Input - AC-coupled Single-Ended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 11 - Clock Input - DC-coupled 3.3V CMOS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 12 - Simplified LVDS Output Driver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 13 - LVDS DC Coupled Termination (Internal Receiver Termination) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 14 - LVDS DC Coupled Termination (External Receiver Termination) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 15 - LVDS AC Coupled Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 16 - LVDS AC Output Termination for CML Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 17 - Additive Jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 18 - Decoupling Connections for Power Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 19 - Differential Voltage Parameter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 20 - Input To Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3
Microsemi Corporation
ZL40215
1.0
Data Sheet
Package Description
12
out2_n
out2_p
out1_n
out1_p
The device is packaged in a 16 pin QFN
10
8
vdd
out0_n
out3_p
14
6
out0_p
gnd
vdd
out3_n
gnd
16
4
clk_n
ctrl
vt
clk_p
2
Figure 2 - Pin Connections
2.0
Pin Description
Pin #
Name
1, 4
clk_p, clk_n,
15,14,
12, 11,
10, 9,
7, 6
Description
Differential Input (Analog Input). Differential (or singled ended) input signals. For all
input signal configuration see“Clock Inputs” on page 6
out0_p, out0_n Differential Output (Analog Output). Differential outputs.
out1_p, out1_n
out2_p, out2_n
out3_p, out3_n
8, 13
vdd
Positive Supply Voltage. 2.5 VDC or 3.3 VDC nominal.
5, 16
gnd
Ground. 0 V.
2
vt
On-Chip Input Termination Node (Analog). Center tap between internal 50 Ohm
termination resistors.
See “Clock Inputs” on page 6 for more information.
3
ctrl
Digital Control for On-Chip Input Termination (Input). Selects differential input mode;
0: DC coupled modes
1: AC coupled differential modes
These pins are internally pulled down to GND.
See “Clock Inputs” on page 6 for more information.
4
Microsemi Corporation
ZL40215
3.0
Data Sheet
Functional Description
he ZL40215 is an LVDS clock fanout buffer with four identical output clock drivers capable of operating at
frequencies up to 750MHz.
The ZL40215 provides an internal input termination network for DC and AC coupled inputs; optional input biasing
for AC coupled inputs is also provided. The ZL40215 can accept DC or AC coupled LVPECL and LVDS input
signals, AC coupled CML or HCSL input signals, and single ended signals. A pin compatible device with external
termination is also available.
The ZL40215 is designed to fan out low-jitter reference clocks for wired or optical communications applications
while adding minimal jitter to the clock signal. An internal linear power supply regulator and bulk capacitors
minimize additive jitter due to power supply noise. The device operates from 2.5V+/-5% or 3.3V+/-5% supply. Its
operation is guaranteed over the industrial temperature range -40°C to +85°C.
The device block diagram is shown in Figure 1; its operation is described in the following sections.
3.1
Clock Inputs
The device has a differential input equipped with two on-chip 50 Ohm termination resistors arranged in series with a
center tap. The input can accept many differential and single-ended signals with AC or DC coupling as appropriate.
A control pin is available to enable internal biasing for AC coupled inputs. A block diagram of the input stage is in
Figure 3.
clk_p
50
Receiver
50
clk_n
Vt
Bias
ctrl
Figure 3 - Simplified Diagram of input stage
This following figures give the components values and configuration for the various circuits compatible with the
input stage and the use of the Vt and ctrl pins in each case.
In the following diagrams were the ctrl pin is "1" and the Vt pin is not connected, the Vt pin can be instead
connected to VDD with a capacitor.The same capacitor can also help in Figure 4 between Vt and VDD. This
capacitor will minimize the noise at the point between the two internal termination resistors and improve the overall
performance of the device.
5
Microsemi Corporation
ZL40215
Data Sheet
VDD_driver
VDD
22 Ohms
Zo = 50 Ohms
clk_p
clk_p
LVPECL
Driver
clk_n
clk_n
Zo = 50 Ohms
Vt
Vt
22 Ohms
R
“0”
Ctrl
Ctrl
For 3.3 V: R= 50 Ohms
For 2.5 V: R= 22 Ohms
Figure 4 - Clock Input - LVPECL - DC Coupled
VDD_driver
VDD
22 Ohms
LVPECL
Driver
Zo = 50 Ohms
clk_p
clk_n
22 Ohms
Zo = 50 Ohms
R
NC
R
“1”
For 3.3 V: R= 150 Ohms
For 2.5 V: R= 85 Ohms
Figure 5 - Clock Input - LVPECL - AC Coupled
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Microsemi Corporation
Vt
Ctrl
ZL40215
Data Sheet
VDD_driver
VDD
Zo = 50 Ohms
clk_p
LVDS
Driver
clk_n
Zo = 50 Ohms
NC
“0”
Vt
Ctrl
Figure 6 - Clock Input - LVDS - DC Coupled
VDD_driver
VDD
Zo = 50 Ohms
clk_p
LVDS
Driver
R
clk_n
Zo = 50 Ohms
NC
“1”
For VDD_driver = 3.3 V: R= 900 Ohms
For VDD_driver = 2.5 V: R = 680 Ohms
Figure 7 - Clock Input - LVDS - AC Coupled
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Microsemi Corporation
Vt
Ctrl
ZL40215
Data Sheet
VDD_driver
R
VDD
R
Zo = 50 Ohms
clk_p
CML
Driver
clk_n
Zo = 50 Ohms
NC
“1”
Vt
Ctrl
R= 50 Ohms
Figure 8 - Clock Input - CML- AC Coupled
VDD_driver
VDD
Zo = 50 Ohms
clk_p
HCSL
Driver
clk_n
Zo = 50 Ohms
R
NC
R
“1”
R= 50 Ohms
Figure 9 - Clock Input - HCSL- AC Coupled
8
Microsemi Corporation
Vt
Ctrl
ZL40215
Data Sheet
VDD_driver
VDD
CMOS
Driver
Zo = 50 Ohms
clk_p
clk_n
Vt
“1”
Ctrl
Figure 10 - Clock Input - AC-coupled Single-Ended
VDD_driver
VDD
CMOS
Driver
Zo = 50 Ohms
clk_p
clk_n
NC
“1”
Figure 11 - Clock Input - DC-coupled 3.3V CMOS
9
Microsemi Corporation
Vt
Ctrl
ZL40215
3.2
Data Sheet
Clock Outputs
LVDS has lower signal swing than LVPECL which results in a low power consumption. A simplified diagram for the
LVDS output stage is shown in Figure 12.
VDD
3 mA
-
+
Output
+
-
Figure 12 - Simplified LVDS Output Driver
The methods to terminate the ZL40215 drivers are shown in the following figures.
VDD_Rx
VDD
ZL40215
clk_p
clk_n
Z o = 50 Ohms
LVDS
Receiver
Z o = 50 Ohms
Figure 13 - LVDS DC Coupled Termination (Internal Receiver Termination)
10
Microsemi Corporation
ZL40215
Data Sheet
VDD_Rx
VDD
ZL40215
clk_p
Zo = 50 Ohms
100 Ohms
clk_n
LVDS
Receiver
Zo = 50 Ohms
Figure 14 - LVDS DC Coupled Termination (External Receiver Termination)
VDD_Rx
VDD
R1
ZL40215
clk_p
R1
Zo = 50 Ohms
LVDS
Receiver
100 Ohms
clk_n
Zo = 50 Ohms
R2
R2
Note: R1 and R2 values and need for external termination
depend on the specification of the LVDS receiver
Figure 15 - LVDS AC Coupled Termination
11
Microsemi Corporation
VDD_Rx
ZL40215
Data Sheet
VDD_Rx
VDD
ZL40214
clk_p
clk_n
50 Ohms
Zo = 50 Ohms
50 Ohms
CML
Receiver
Zo = 50 Ohms
Figure 16 - LVDS AC Output Termination for CML Inputs
12
Microsemi Corporation
ZL40215
3.3
Data Sheet
Device Additive Jitter
The ZL40215 clock fanout buffer is not intended to filter clock jitter. The jitter performance of this type of device is
characterized by its additive jitter. Additive jitter is the jitter the device would add to a hypothetical jitter-free clock as
it passes through the device. The additive jitter of the ZL40215 is random and as such it is not correlated to the jitter
of the input clock signal.
The square of the resultant random RMS jitter at the output of the ZL40215 is equal to the sum of the squares of the
various random RMS jitter sources including: input clock jitter; additive jitter of the buffer; and additive jitter due to
power supply noise. There may be additional deterministic jitter sources, but they are not shown in Figure 17.
Jadd2
Jin2
Jps2
+
Jin
Jadd
Jps
Jout
+
= Random input clock jitter (RMS)
= Additive jitter due to the device (RMS)
= Additive jitter due to power supply noise (RMS)
= Resultant random output clock jitter (RMS)
Figure 17 - Additive Jitter
13
Microsemi Corporation
Jout2= Jin2+Jadd2+Jps2
ZL40215
3.4
Data Sheet
Power Supply
This device operates with either a 2.5V supply or 3.3V supply.
3.4.1
Sensitivity to power supply noise
Power supply noise from sources such as switching power supplies and high-power digital components such as
FPGAs can induce additive jitter on clock buffer outputs. The ZL40215 is equipped with an low drop out (LDO)
power regulator and on-chip bulk capacitors to minimize additive jitter due to power supply noise. The LDO
regulator on the ZL40215 allows this device to have superior performance even in the presence of external noise
sources. The on-chip measures in combination with the simple recommended power supply filtering and PCB
layout minimize the additive jitter from power supply noise.
The performance of these clock buffers in the presence of power supply noise is detailed in ZLAN-403, “Power
Supply Rejection in Clock Buffers” which is available from Applications Engineering.
3.4.2
Power supply filtering
For optimal jitter performance, the device should be isolated from the power planes connected to its power supply
pins as shown in Figure 18.
•
•
•
•
10 µF capacitors should be size 0603 or size 0805 X5R or X7R ceramic, 6.3 V minimum rating
0.1 µF capacitors should be size 0402 X5R ceramic, 6.3 V minimum rating
Capacitors should be placed next to the connected device power pins
a 0.3 ohm resistor is recommended for the filter shown in Figure 18
VDD
0.3 Ohm s
0.1 µF
8
ZL40215
10 µF
13
Figure 18 - Decoupling Connections for Power Pins
3.4.3
PCB layout considerations
The power nets in Figure 18 can be implemented either as a plane island or routed power topology without
changing the overall jitter performance of the device.
14
Microsemi Corporation
ZL40215
4.0
Data Sheet
AC and DC Electrical Characteristics
Absolute Maximum Ratings*
Parameter
Sym.
Min.
Max.
Units
VDD_R
-0.5
4.6
V
VPIN
-0.5
VDD
V
260
°C
125
°C
1
Supply voltage
2
Voltage on any digital pin
3
Soldering temperature
4
Storage temperature
TST
5
Junction temperature
Tj
125
°C
6
Voltage on input pin
Vinput
VDD
V
7
Input capacitance each pin
Cp
500
* Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied.
* Voltages are with respect to ground (GND) unless otherwise stated
fF
T
-55
Recommended Operating Conditions*
Characteristics
Sym.
Min.
Typ.
Max.
Units
1
Supply voltage 2.5 V mode
VDD25
2.375
2.5
2.625
V
2
Supply voltage 3.3 V mode
VDD33
3.135
3.3
3.465
V
3
Operating temperature
TA
-40
25
85
°C
* Voltages are with respect to ground (GND) unless otherwise stated
DC Electrical Characteristics - Current Consumption
Characteristics
1
Supply current LVDS drivers
loaded (all outputs are active)
Sym.
-
Min.
Typ.
Idd_load
Max.
62
Units
Notes
mA
DC Electrical Characteristics - Inputs and outputs - for 2.5/3.3 V supply
Characteristics
Sym.
Min.
1
CMOS control logic high-level input
voltage
VCIH
0.7*VDD
2
CMOS control logic low-level input
voltage
VCIL
3
CMOS control logic Input leakage
current
IIL
4
Differential input common mode supply voltage
VICM
1.1
5
Differential input common mode supply voltage
VICM
6
Differential input voltage difference
VID
Typ.
Max.
Units
Notes
V
0.3*VDD
1
V
µA
VI = VDD or 0 V
1.6
V
For VDD = 2.5V
1.1
2.0
V
For VDD = 3.3 V
0.25
1
V
15
Microsemi Corporation
ZL40215
Data Sheet
DC Electrical Characteristics - Inputs and outputs - for 2.5/3.3 V supply
Characteristics
Sym.
Min.
Typ.
Max.
Units
7
Differential input resistance
VIR
80
100
120
ohm
8
LVDS output differential voltage*
VOD
0.25
0.30
0.40
V
9
LVDS output common mode voltage
VCM
1.1
1.25
1.375
V
Notes
* The VOD parameter was measured from 125 MHz to 750 MHz.
VOD
2*VOD
Figure 19 - Differential Voltage Parameter
AC Electrical Characteristics* - Inputs and Outputs (see Figure 20) - for 2.5/3.3 V supply.
Characteristics
Sym.
Min.
Typ.
Max.
Units
750
MHz
1
2
ns
1
Maximum Operating Frequency
1/tp
2
input to output clock propagation delay
tpd
3
output to output skew
tout2out
50
100
ps
4
part to part output skew
tpart2part
80
300
ps
5
Output clock Duty Cycle degradation
0
5
%
6
LVDS Output slew rate
0
tPWH/ tPWL
-5
rsl
0.55
* Supply voltage and operating temperature are as per Recommended Operating Conditions
tP
tREFW
tREFW
Input
tpd
Output
Figure 20 - Input To Output Timing
16
Microsemi Corporation
V/ns
Notes
ZL40215
5.0
Data Sheet
Performance Characterization
Additive Jitter at 2.5 V*
Output Frequency (MHz)
Jitter
Measurement
Filter
Typical
(fs)
1
125
12 kHz - 20 MHz
120
2
212.5
12 kHz - 20 MHz
102
3
311.04
12 kHz - 20 MHz
88
4
425
12 kHz - 20 MHz
91
5
500
12 kHz - 20 MHz
77
6
622.08
12 kHz - 20 MHz
78
7
750
12 kHz - 20 MHz
78
Notes
* For an input slew rate of approximately 0.8 V/ns.
Additive Jitter at 3.3 V*
Output Frequency (MHz)
Jitter
Measurement
Filter
Typical
(fs)
1
125
12 kHz - 20 MHz
123
2
212.5
12 kHz - 20 MHz
104
3
311.04
12 kHz - 20 MHz
92
4
425
12 kHz - 20 MHz
94
5
500
12 kHz - 20 MHz
78
6
622.08
12 kHz - 20 MHz
79
7
750
12 kHz - 20 MHz
80
Notes
* For an input slew rate of approximately 0.8 V/ns.
Additive jitter in the presence of power supply noise*
Carrier
frequency
Parameter
Typical
Units
125
25 mV
at 100 kHz
38
fs RMS
750
25 mV
at 100 kHz
50
fs RMS
Notes
* The values in this table are the additive periodic jitter caused by an interfering tone typically caused by a switching power supply. For this test,
measurements were taken over the full temperature and voltage range for VDD = 3.3 V. The magnitude of the interfering tone is measured at the
DUT.
17
Microsemi Corporation
ZL40215
6.0
Data Sheet
Typical Behavior
0.33
0.2
0.15
0.325
0.1
Voltage
Voltage
0.05
0
-0.05
0.32
0.315
-0.1
0.31
-0.15
-0.2
0
5
10
15
0.305
20
0
100
200
Time (ns)
400
500
600
700
800
Frequency (MHz)
Typical Waveform at 155.52 MHz
VOD versus Frequency
-60
125 MHz
-55
212.5 MHz
425 MHz
-65
-60
750 MHz
-65
PSRR (dBc)
-70
PSRR (dBc)
300
-75
-80
-70
-75
-80
-85
125 MHz
212.5 MHz
-85
425 MHz
750 MHz
-90
-90
100
150
200
250
300
350
400
450
20
500
Power Supply Tone Frequency versus PSRR
Propagation Delay (ns)
0.55
0.5
0.45
0.4
0.35
-40
-20
0
20
40
60
40
50
60
70
80
90
Power Supply Tone Magnitude versus PSRR
0.6
0.3
30
Power Supply Tone magnitude (mV) at 100 kHz
Power Supply Tone Frequency with 25 mV (kHz)
80
100
Temperature (°C)
Propagation Delay versus Temperature
Note: This is for a single device. For more details see the
characterization section.
18
Microsemi Corporation
100
ZL40215
7.0
Data Sheet
Package Thermal Characteristics
Thermal Data
Parameter
Symbol
Test Condition
Value
Junction to Ambient Thermal Resistance
ΘJA
Still Air
1 m/s
2 m/s
67.9
61.6
58.1
o
C/W
Junction to Case Thermal Resistance
ΘJC
Still Air
44.1
o
C/W
23.2
o
C/W
Junction to Board Thermal Resistance
Maximum Junction Temperature*
ΘJB
Still Air
Tjmax
Maximum Ambient Temperature
TA
* Proper thermal management must be practiced to ensure that Tjmax is not exceeded.
19
Microsemi Corporation
Unit
125
o
C
85
o
C
ZL40215
8.0
Mechanical Drawing
20
Microsemi Corporation
Data Sheet
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