MOC2R6010

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MOC2R60–10/D Advance Information POWER OPTO™ Isolator 2 Amp Random Phase Triac Output This device consists of a gallium arsenide infrared emitting diode optically coupled to a random phase triac driver circuit and a power triac. It is capable of driving a load of up to 2 amps (rms) directly, on line voltages from 20 to 280 volts AC (rms). • Provides Normally Open Solid State AC Output with 2 Amp Rating • 70 Amp Single Cycle Surge Capability • Phase Controllable • High Input-Output Isolation of 3750 vac (rms) • Static dv/dt Rating of 400 Volts/µs Guaranteed • 2 Amp Pilot Duty Rating Per UL508 W117 (Overload Test) and W118 (Endurance Test) [File No. 129224] • CSA Approved [File No. CA77170-1]. VDE Approval in Process. • Exceeds NEMA 2-230 and IEEE472 Noise Immunity Test Requirements (See Figure 17) DEVICE RATINGS (TA = 25°C unless otherwise noted) Rating INPUT LED Forward Current — Maximum Continuous Forward Current — Maximum Peak (PW = 100µs, 120 pps) Reverse Voltage — Maximum OUTPUT TRIAC Output Terminal Voltage — Maximum Transient (1) Operating Voltage Range — Maximum Continuous (f = 47 – 63 Hz) On-State Current Range (Free Air, Power Factor ≥ 0.3) Non-Repetitive Single Cycle Surge Current — Maximum Peak (t = 16.7 ms) Main Terminal Fusing Current (t = 8.3 ms) Load Power Factor Range Junction Temperature Range TOTAL DEVICE Input-Output Isolation Voltage — Maximum (2) 47 – 63 Hz, 1 sec Duration Thermal Resistance — Power Triac Junction to Case (See Figure 18) Ambient Operating Temperature Range Storage Temperature Range Lead Soldering Temperature — Maximum (1/16″ From Case, 10 sec Duration) VISO RθJC Toper Tstg TL 3750 8.0 – 40 to +100 – 40 to +150 260 Vac(rms) °C/W °C °C °C VDRM VT IT(rms) ITSM I2T PF TJ 600 20 to 280 0.03 to 2.0 70 26 0.3 to 1.0 – 40 to 125 V(pk) Vac(rms) A A A2sec — °C IF IF(pk) VR 50 1.0 6.0 mA A V Symbol Value Unit MOC2R60-10 * MOC2R60-15 *Motorola Preferred Devices OPTOISOLATOR 2 AMPS RANDOM–PHASE TRIAC OUTPUT 600 VOLTS 7 23 9 CASE 417-02 Style 2 PLASTIC PACKAGE CASE 417A-02 Style 1 PLASTIC PACKAGE CASE 417B-01 Style 1 PLASTIC PACKAGE DEVICE SCHEMATIC 7 3 2 9 1, 4, 5, 6, 8. 2. 3. 7. 9. NO PIN LED CATHODE LED ANODE MAIN TERMINAL 2 MAIN TERMINAL 1 1. Test voltages must be applied within dv/dt rating. 2. Input-Output isolation voltage, VISO, is an internal device dielectric breakdown rating. (2)For this test, pins 2, 3 and the heat tab are common, and pins 7 and 9 are common. POWER OPTO is a trademark of Motorola, Inc. This document contains information on a new product. Specifications and information herein are subject to change without notice. Preferred devices are Motorola recommended choices for future use and best overall value. REV 1 Motorola Optoelectronics Device Data © Motorola, Inc. 1995 1 MOC2R60-10 MOC2R60-15 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic INPUT LED Forward Voltage (IF = 10 mA) Reverse Leakage Current (VR = 6.0 V) Capacitance OUTPUT TRIAC Off-State Leakage, Either Direction (IF = 0, VDRM = 400 V) Critical Rate of Rise of Off-State Voltage (Static) (Vin = 400 vac(pk)) (1) (2) Holding Current, Either Direction (IF = 0, VD = 12 V, IT = 200 mA) COUPLED LED Trigger Current Required to Latch Output MOC2R60-10 Either Direction (Main Terminal Voltage = 2.0 V) (3) (4) MOC2R60-15 On-State Voltage, Either Direction (IF = Rated IFT(on), ITM = 2.0 A) Commutating dv/dt (Rated VDRM, IT = 30 mA – 2.0 A(rms), TA = – 40 + 100°C, f = 60 Hz) (2) Common-mode Input-Output dv/dt (2) Input-Output Capacitance (V = 0, f = 1.0 MHz) Isolation Resistance (VI-O = 500 V) 1. 2. 3. 3. 4. IFT(on) VTM dv/dt (c) dv/dt(cm) CISO RISO — — 5.0 — — 1012 7.0 12 0.96 — 40,000 1.3 1014 10 15 1.3 — — — — mA V V/µS V/µS pF Ω IDRM(1) dv/dt(s) IH — 400 — 0.25 — 10 100 — — µA V/µs mA VF IR C 1.00 — — 1.17 1.0 18 1.50 100 — V µA pF Symbol Min Typ Max Unit Per EIA/NARM standard RS–443, with VP = 200 V, which is the instantaneous peak of the maximum operating voltage. Additional dv/dt information, including test methods, can be found in Motorola applications note AN1048/D. All devices are guaranteed to trigger at an IF value less than or equal to the max IFT. Therefore, the recommended operating IF lies between the device’s maximum IFT(on) limit and the Maximum Rating of 50 mA. Current–limiting resistor required in series with LED. TYPICAL CHARACTERISTICS 100 IF, FORWARD LED CURRENT (mA) 80 2.00 1.80 VF, FORWARD VOLTAGE (V) 1.60 1.40 1.20 1.00 0.80 Pulse Only Pulse or DC 60 40 TA = – 40°C 25°C 100°C 20 0 – 40 – 20 0 20 40 60 80 100 120 1 10 100 1000 TA, AMBIENT TEMPERATURE (°C) IF, FORWARD CURRENT (mA) Figure 1. Maximum Allowable Forward LED Current versus Ambient Temperature Figure 2. LED Forward Voltage versus LED Forward Current 2 Motorola Optoelectronics Device Data MOC2R60-10 MOC2R60-15 1.60 IIFT, FORWARD TRIGGER CURRENT 1.50 I T, TERMINAL CURRENT (A) 100 1.40 1.30 1.20 1.10 1.00 0.90 0.80 – 40 – 20 0 20 40 60 80 120 Worst Case Unit Normalized to TA = 25°C 2.4 2.0 1.6 1.2 0.8 0.4 0.0 – 40 – 20 0 20 40 60 80 100 120 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 3. Forward LED Trigger Current versus Ambient Temperature Figure 4. Maximum Allowable On-State RMS Output Current (Free Air) versus Ambient Temperature 2.20 VTM, MAIN TERMINAL VOLTAGE (V) PD, POWER DISSIPATION (WATTS) 2.00 1.80 1.60 1.40 1.20 1.00 0.80 0.60 0.03 0.1 TJ = 25°C 100°C 1.0 ITM, INSTANTANEOUS ON-STATE CURRENT (A) Pulse Pulse or DC Only 2.5 2.0 1.5 Maximum 1.0 Mean 0.5 0.0 0.01 0.1 1.0 10 IT, MAIN TERMINAL CURRENT (A) Figure 5. On-State Voltage Drop versus Output Terminal Current Figure 6. Power Dissipation versus Main Terminal Current TA = 25°C TJ , JUNCTION TEMPERATURE (°C) 100 80 60 40 20 0 0.01 IDRM , LEAKAGE CURRENT (NORMALIZED) 120 100 10 Normalized to TA = 25°C 1.0 0.1 0.1 1 10 0.01 – 40 – 20 0 20 40 60 80 100 120 IT, MAIN TERMINAL CURRENT (A) TA, AMBIENT TEMPERATURE (°C) Figure 7. Junction Temperature versus Main Terminal RMS Current (Free Air) Figure 8. Leakage with LED Off versus Ambient Temperature Motorola Optoelectronics Device Data 3 MOC2R60-10 MOC2R60-15 2.00 1.80 IH , HOLDING CURRENT (mA) 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00 – 40 – 20 0 + 25 + 40 + 60 + 80 + 100 0 – 40 IT = 30 mA – 2A(RMS) F = 60 Hz – 20 0 20 40 60 80 100 120 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Normalized at 25°C dv / dt (V/ µS) 1000 Static 100 10 Commutating Figure 9. Holding Current versus Ambient Temperature IFT, NORMALIZED LED TRIGGER CURRENT 25 NORMALIZED TO: PWin ≥ 100 µs Figure 10. dv/dt versus Ambient Temperature Phase Control Considerations LED Trigger Current versus PW (normalized) The Random Phase POWER OPTO Isolators are designed to be phase controllable. They may be triggered at any phase angle within the AC sine wave. Phase control may be accomplished by an AC line zero cross detector and a variable pulse delay generator which is synchronized to the zero cross detector. The same task can be accomplished by a microprocessor which is synchronized to the AC zero crossing. The phase controlled trigger current may be a very short pulse which saves energy delivered to the input LED. LED trigger pulse currents shorter than 100 µs must have an increased amplitude as shown on Figure 11. This graph shows the dependency of the trigger current IFT versus the pulse width t (PW). The reason for the IFT dependency on the pulse width can be seen on the chart delay t(d) versus the LED trigger current. IFT in the graph IFT versus (PW) is normalized in respect to the minimum specified IFT for static condition, which is specified in the device characteristic. The normalized IFT has to be multiplied with the devices guaranteed static trigger current. Example: Guaranteed IFT = 10 mA, Trigger pulse width PW = 3 µs IFT (pulsed) = 10 mA x 5 = 50 mA 20 15 10 5 0 1 2 5 10 20 50 100 PWin, LED TRIGGER PULSE WIDTH (µs) Figure 11. LED Current Required to Trigger versus LED Pulse Width AC SINE 0° 180° Minimum LED Off Time in Phase Control Applications In phase control applications one intends to be able to control each AC sine half wave from 0 to 180 degrees. Turn on at zero degrees means full power, and turn on at 180 degrees means zero power. This is not quite possible in reality because triac driver and triac have a fixed turn on time when activated at zero degrees. At a phase control angle close to 180 degrees the turn on pulse at the trailing edge of the AC sine wave must be limited to end 200 µs before AC zero cross as shown in Figure 12. This assures that the device has time to switch off. Shorter times may cause loss off control at the following half cycle. LED PW LED CURRENT LED TURN OFF MIN 200 µs Figure 12. Minimum Time for LED Turn-Off to Zero Cross of AC Trailing Edge 4 Motorola Optoelectronics Device Data MOC2R60-10 MOC2R60-15 100 t(delay), t(f) versus IFT The POWER OPTO Isolators turn on switching speed consists of a turn on delay time t(d) and a fall time t(f). Figure 13 shows that the delay time depends on the LED trigger current, while the actual trigger transition time t(f) stays constant with about one micro second. The delay time is important in very short pulsed operation because it demands a higher trigger current at very short trigger pulses. This dependency is shown in the graph IFT versus LED PW. The turn on transition time t(f) combined with the power triacs turn on time is important to the power dissipation of this device. 60 t(delay) AND t(fall) ( µ s) 10 t(d) 1 t(f) 0.1 10 20 30 40 50 IFT, LED TRIGGER CURRENT (mA) Figure 13. Delay Time, t(d), and Fall Time, t(f), versus LED Trigger Current SCOPE IFT VTM EXT. SYNC t(d) t(f) FUNCTION GENERATOR Vout ISOL. TRANSF. 10 kΩ A C VTM DU T 100 Ω IFT PHASE CTRL. PW CTRL. PERIOD CTRL. Vo AMPL. CTRL. ZERO CROSS DETECTOR 115 VAC Figure 14. Switching Time Test Circuit MOC2R60 VCC R1 R2 C1 MOV Select the value of R1 according to the following formulas: (1) R1 = (VCC – VF) / Max. IFT (on) per spec. (2) R1 = (VCC – VF) / 0.050 Typical values for C1 and R2 are 0.01 µF and 39 Ω, respectively. You may adjust these values for specific applications. The maximum recommended value of C1 is 0.022 µF. See application note AN1048 for additional information on component values. The MOV may or may not be needed depending upon the characteristics of the applied AC line voltage. For applications where line spikes may exceed the 600 volts rating of the MOC2R60, an MOV is required. Load Figure 15. Typical Application Circuit Motorola Optoelectronics Device Data 5 MOC2R60-10 MOC2R60-15 Use care to maintain the minimum spacings as shown. Safety and regulatory requirements dictate a minimum of 8.0 mm between the closest points between input and output conducting paths, Pins 3 and 7. Also, 0.070 inches distance is required between the two output Pins, 7 and 9. Keep pad sizes on Pins 7 and 9 as large as possible for optimal performance. 0.070” MIN 0.315” min [8 mm min] Figure 16. PC Board Layout Recommendations Each device, when installed in the circuit shown in Figure 17, shall be capable of passing the following conducted noise tests: Device Under Test 2 3 7 9 Noise Source AC Supply • • • • IEEE 472 (2.5 KV) Lamp Dimmer (NEMA Part DC33, w 3.4.2.1) NEMA ICS 2-230.45 Showering Arc MIL-STD-461A CS01, CS02 and CS06 10 Ω I F = Rated IF 0.022 µF MOV 150 V Z Load Figure 17. Test Circuit for Conducted Noise Tests No Additional Heatsink T J Junction Temperature of MOC2R60 . . . Output Chip { RθJC Heat Flow TC RθCA T A T J RθJC With Additional Heatsink TS TC RθCS RθSA } T A Ambient Air Temperature X Terms in the model signify: RθSA = Thermal resistance, heat sink to ambient TA = Ambient temperature RθCA = Thermal resistance, case to ambient TS = Optional additional RθCS = Thermal resistance, heat sink to case heat sink temperature RθJC = Thermal resistance, junction to case TC = Case temperature TJ = Junction temperature PD = Power dissipation Values for thermal resistance components are: RθCA = 36°C/W/in maximum RθJC = 8.0°C/W maximum The design of any additional heatsink will determine the values of RθSA and RθCS. TC – TA = PD (RθCA) = PD (RθJC) + RθSA), where PD = Power Dissipation in Watts. Thermal measurements of RθJC are referenced to the point on the heat tab indicated with an ‘X’. Measurements should be taken with device orientated along its vertical axis. Figure 18. Approximate Thermal Circuit Model 6 Motorola Optoelectronics Device Data MOC2R60-10 MOC2R60-15 PACKAGE DIMENSIONS C –A– E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.965 1.005 0.416 0.436 0.170 0.190 0.025 0.035 0.040 0.060 0.400 BSC 0.040 0.060 0.012 0.018 0.134 0.154 0.200 BSC 0.190 0.210 0.023 0.043 0.695 0.715 0.100 BSC STYLE 2: PIN 2. 3. 7. 9. MILLIMETERS MIN MAX 24.51 25.53 10.57 11.07 4.32 4.83 0.64 0.89 1.02 1.52 10.16 BSC 1.02 1.52 0.30 0.46 3.40 3.91 5.08 BSC 4.83 5.33 0.58 1.09 17.65 18.16 2.54 BSC S P –T– SEATING PLANE –B– 2 3 7 9 N K V G D 4 PL 0.13 (0.005) M L H TA M J DIM A B C D E G H J K L N P S V B M LED CATHODE LED ANODE TRIAC MT TRIAC MT CASE 417–02 PLASTIC STANDARD HEAT TAB ISSUE C ORDER “F” SUFFIX HEAT TAB OPTION (EX: MOC2R60–10F) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. –A– U Z RADIUS Y W Q C E X S R –B– P 2 3 7 9 N –T– SEATING PLANE K V G L H M J D 4 PL 0.13 (0.005) DIM A B C D E G H J K L N P Q R S U V W X Y Z INCHES MIN MAX 0.965 1.005 0.416 0.436 0.170 0.190 0.025 0.035 0.040 0.060 0.400 BSC 0.040 0.060 0.012 0.018 0.134 0.154 0.200 BSC 0.190 0.210 0.023 0.043 0.057 0.067 0.734 0.754 0.840 0.870 0.593 0.613 0.100 BSC 0.074 0.094 0.265 0.295 0.079 0.089 0.026 0.036 STYLE 1: PIN 2. 3. 7. 9. MILLIMETERS MIN MAX 24.51 25.53 10.57 11.07 4.32 4.83 0.64 0.89 1.02 1.52 10.16 BSC 1.02 1.52 0.30 0.46 3.40 3.91 5.08 BSC 4.83 5.33 0.58 1.09 1.45 1.70 18.64 19.15 21.34 22.10 15.06 15.57 2.54 BSC 1.88 2.39 6.73 7.49 2.01 2.26 0.66 0.91 TA M B M CASE 417A–02 PLASTIC FLUSH MOUNT HEAT TAB ISSUE A LED CATHODE LED ANODE TRIAC MT TRIAC MT Motorola Optoelectronics Device Data 7 MOC2R60-10 MOC2R60-15 PACKAGE DIMENSIONS — CONTINUED ORDER “C” SUFFIX HEAT TAB OPTION (EX: MOC2R60–10C) C –A– E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.965 1.005 0.416 0.436 0.170 0.190 0.025 0.035 0.040 0.060 0.400 BSC 0.040 0.060 0.012 0.060 0.134 0.154 0.200 BSC 0.190 0.210 0.023 0.043 0.439 0.529 0.100 BSC MILLIMETERS MIN MAX 24.51 25.53 10.57 11.07 4.32 4.83 0.64 0.89 1.02 1.52 10.16 BSC 1.02 1.52 0.30 0.46 3.40 3.91 5.08 BSC 4.83 5.33 0.58 1.09 11.15 13.44 2.54 BSC SP 2 3 7 9 –B– N –T– SEATING PLANE K V G D 4 PL 0.13 (0.005) M T A M L J H DIM A B C D E G H J K L N P S V B M STYLE 1: PIN 2. 3. 7. 9. LED CATHODE LED ANODE TRIAC MT TRIAC MT CASE 417B–01 PLASTIC CUT HEAT TAB ISSUE O Motorola reserves the right to make changes without further notice to any products herein. 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