MPIC2111D

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MPIC2111/D Power Products Division Advance Information HALF-BRIDGE DRIVER The MPIC2111 is a high voltage, high speed, power MOSFET and IGBT driver with dependent high and low side referenced output channels designed for half– bridge applications. Proprietary HVIC and latch immune CMOS technologies enable ruggedized monolithic construction. Logic input is compatible with standard CMOS outputs. The output drivers feature a high pulse current buffer stage designed for minimum driver cross–conduction. Internal deadtime is provided to avoid shoot–through in the output half–bridge. The floating channel can be used to drive an N–channel power MOSFET or IGBT in the high side configuration which operates from 10 to 600 volts. MPIC2111 HALF–BRIDGE DRIVER • • • • • • • • • • Floating Channel Designed for Bootstrap Operation Fully Operational to +600 V Tolerant to Negative Transient Voltage dV/dt Immune Gate Drive Supply Range from 10 to 20 V Undervoltage Lockout for Both Channels CMOS Schmitt–triggered Inputs with Pull–down Matched Propagation Delay for Both Channels Internally Set Deadtime High Side Output in Phase with Input 8 8 1 P SUFFIX PLASTIC PACKAGE CASE 626–05 1 PRODUCT SUMMARY VOFFSET IO+/– VOUT ton/off (typical) Deadtime (typical) 600 V MAX 200 mA/420 mA 10 – 20 V 130 & 90 ns 700 ns D SUFFIX PLASTIC PACKAGE CASE 751–05 (SO–8) ORDERING INFORMATION Device MPIC2111D MPIC2111P Package SOIC PDIP PIN CONNECTIONS (TOP VIEW) VCC 1 IN 2 COM 3 LO 4 8 LEADS DIP MPIC2111P 8 VB 7 HO 6 VS 5 VCC 1 IN 2 COM 3 LO 4 8 LEAD SOIC MPIC2111D 8 VB 7 HO 6 VS 5 This document contains information on a new product. Specifications and information herein are subject to change without notice. REV 1 © Motorola Power Motorola, Inc. 1996 Products Division Advanced Data 1 MPIC2111 SIMPLIFIED BLOCK DIAGRAM VB DEAD TIME HV LEVEL SHIFT PULSE GEN IN UV DETECT UV DETECT PULSE FILTER R R S Q HO VS VCC LO DEAD TIME COM ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM. The Thermal Resistance and Power Dissipation ratings are measured under board mounted and still air conditions. Rating High Side Floating Supply Absolute Voltage High Side Floating Supply Offset Voltage High Side Floating Output Voltage Low Side Fixed Supply Voltage Low Side Output Voltage Logic Input Voltage Allowable Offset Supply Voltage Transient *Package Power Dissipation @ TC ≤ +25°C Thermal Resistance, Junction to Ambient Operating and Storage Temperature Lead Temperature for Soldering Purposes, 10 seconds (8 Lead DIP) (8 Lead SOIC) (8 Lead DIP) (8 Lead SOIC) Symbol VB VS VHO VCC VLO VIN dVS/dt PD – RθJA Tj, Tstg TL Min –0.3 VB–25 VS–0.3 –0.3 –0.3 –0.3 – – – – – –55 – Max 625 VB+0.3 VB+0.3 25 VCC+0.3 VCC+0.3 50 1.0 0.625 125 200 150 260 Unit VDC V/ns Watt °C/W °C °C RECOMMENDED OPERATING CONDITIONS The Input/Output logic timing Diagram is shown in Figure 1. For proper operation the device should be used within the recommended conditions. The VS offset rating is tested with all supplies biased at 15 V differential. High Side Floating Supply Absolute Voltage High Side Floating Supply Offset Voltage High Side Floating Output Voltage Low Side Fixed Supply Voltage Low Side Output Voltage Logic Input Voltage Ambient Temperature VB VS VHO VCC VLO VIN VS+10 Note 1 VS 10 0 0 –40 VS+20 600 VB 20 VCC VCC 125 °C mA V TA Note 1: Logic operational for VS of –5 to +600 V. Logic state held for VS of –5 V to –VBS. 2 Motorola Power Products Division Advanced Data MPIC2111 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) Characteristic Symbol Min Typ Max Unit STATIC ELECTRICAL CHARACTERISTICS VBIAS (VCC, VBS) = 15 V unless otherwise specified. The VIN, VTH and IIN parameters are referenced to COM. The VO and IO parameters are referenced to COM and are applicable to the respective output leads: HO or LO. Logic “1” Input Voltage for HO & Logic “0” Input Voltage for LO @ VCC = 10 V Logic “1” Input Voltage for HO & Logic “0” Input Voltage for LO @ VCC = 15 V Logic “1” Input Voltage for HO & Logic “0” Input Voltage for LO @ VCC = 20 V Logic “0” Input Voltage for HO & Logic “1” Input Voltage for LO @ VCC = 10 V Logic “0” Input Voltage for HO & Logic “1” Input Voltage for LO @ VCC = 15 V Logic “0” Input Voltage for HO & Logic “1” Input Voltage for LO @ VCC = 20 V High Level Output Voltage, VBIAS–VO @ IO = 0 A Low Level Output Voltage, VO @ IO = 0 A Offset Supply Leakage Current @ VB = VS = 600 V Quiescent VBS Supply Current @ VIN = 0 V or VCC Quiescent VCC Supply Current @ VIN = 0 V or VCC Logic “1” Input Bias Current @ VIN = 15 V Logic “0” Input Bias Current @ VIN = 0 V VBS Supply Undervoltage Positive Going Threshold VBS Supply Undervoltage Negative Going Threshold VCC Supply Undervoltage Positive Going Threshold VCC Supply Undervoltage Negative Going Threshold Output High Short Circuit Pulsed Current @ VOUT = 0 V, PW ≤ 10 µs Output Low Short Circuit Pulsed Current @ VOUT = 15 V, PW ≤ 10 µs DYNAMIC ELECTRICAL CHARACTERISTICS VBIAS (VCC, VBS) = 15 V unless otherwise specified Turn–On Propagation Delay @ VS = 0 V Turn–Off Propagation Delay @ VS = 600 V Turn–On Rise Time @ CL = 1000 pF Turn–Off Fall Time @ CL = 1000 pF Deadtime, LS Turn–Off to HS Turn–On & HS Turn–Off to LS Turn–On Delay Matching, HS & LS Turn–On/Off ton toff tr tf DT MT – – – – – – 850 150 80 40 700 30 – – – – – – ns VIH VIH VIH VIL VIL VIL VOH VOL ILK IQBS IQCC IIN+ IIN– VBSUV+ VBSUV– VCCUV+ VCCUV– IO+ IO– 6.4 9.5 12.6 – – – – – – – – – – – – – – 200 420 – – – – – – – – – 50 70 20 – 8.5 8.2 8.6 8.2 250 500 – – – 3.8 6.0 8.3 100 100 50 – – 40 1.0 – – – – – – mA V µA mV VDC TYPICAL CONNECTION VCC 10 TO 600 V VCC IN IN COM LO VB HO VS TO LOAD Motorola Power Products Division Advanced Data 3 MPIC2111 LEAD DEFINITIONS Symbol IN VB HO VS VCC LO COM Lead Description Logic Input for High Side and Low Side Gate Driver Outputs (HO & LO), In Phase with HO High Side Floating Supply High Side Gate Drive Output High Side Floating Supply Return Low Side Supply Low Side Gate Drive Output Logic and Low Side Return IN IN (LO) 50% IN (HO) 50% HO tr ton 90% LO HO toff 90% tf LO 10% 10% Figure 1. Input / Output Timing Diagram Figure 2. Switching Time Waveform Definitions 50% IN 50% 90% HO LO 90% 10% 10% DT Figure 3. Deadtime Waveform Definitions 4 Motorola Power Products Division Advanced Data MPIC2111 PACKAGE DIMENSIONS NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. DIM A B C D F G H J K L M N MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC ––– 10_ 0.76 1.01 INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC ––– 10_ 0.030 0.040 8 5 –B– 1 4 F NOTE 2 –A– L C –T– SEATING PLANE J N D K M M H G 0.13 (0.005) TA M B M CASE 626–05 ISSUE K STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. AC IN DC + IN DC – IN AC IN GROUND OUTPUT AUXILIARY VCC –A– B M 8 5 X 45 _ J 1 4 4X –B– M_ G F NOTES: 1. DIMENSIONS A AND B ARE DATUMS AND T IS A DATUM SURFACE. 2. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 3. DIMENSIONS ARE IN MILLIMETER. 4. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 6. DIMENSION D DOES NOT INCLUDE MOLD PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.18 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 P 0.25 (0.010) M –T– 8X C SEATING PLANE D 0.25 (0.010) M K TB S A S R CASE 751–05 ISSUE P Motorola Power Products Division Advanced Data 5 MPIC2111 Motorola reserves the right to make changes without further notice to any products herein. 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