DLM0NSN900HY2D

Reference Only Spec No.JEFL243D-0009L-01 P1/11 Chip Common Mode Choke Coil DLM0NS□□□□HY2□ Reference Specification 1.Scope This reference specification applies to Chip Common Mode Choke Coil DLM0NS Series for differential signal interface in Electronics. 2. Part Numbering (ex.) DL M 0N S B 120 H Y 2 D (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) (1) Chip Common Mode Choke Coil (6) Impedance (Typ. at 100MHz) (2) Structure (M : Monolithic Type) (7) Circuit H : Characteristic Impedance 100Ω system (3) Dimension (L×W) (8) Features (4) Type S: Magnetically shielded one circuit type (9) Number of Line (5) Category (10) Packaging Code D : Taping / B : Bulk 3. Rating Customer Part Number Common Mode Impedance Rated Withstanding Rated (at 100MHz, Under Voltage Voltage Current Standard Testing Condition) Murata Part Number DLM0NSB120HY2D DLM0NSB120HY2B DLM0NSB280HY2D DLM0NSB280HY2B DLM0NSN500HY2D DLM0NSN500HY2B DLM0NSN900HY2D DLM0NSN900HY2B DLM0NSM900HY2D DLM0NSM900HY2B 12Ω±5Ω DC Resistance 160mA 1.2Ω±25% 130mA 1.9Ω±25% 5V(DC) 12.5V(DC) 28Ω±30% 50Ω±25% 2.7Ω±25% 5V(DC) 12.5V(DC) 100mA 90Ω±25% 90Ω±25% Operating Temperature : -40 to +85°C 4. Standard Testing Conditions Temperature : Ordinary Temperature 15 to 35°C Humidity : Ordinary Humidity 25 to 85%(RH) 4.0Ω±25% 5V(DC) 12.5V(DC) 100mA Storage Temperature 3.8Ω±25% Insulation Cut-off Resistance Frequency 10MΩ min. 10MΩ min. 10MΩ min. : -40 to +85°C Temperature : 20 ± 2°C Humidity : 60 to 70%(RH) Atmospheric Pressure : 86 to106kPa 5.Style and Dimensions ■ Equivalent Circuits (1) (2) (4) (3) Nopolarity polarity No ■ Unit Mass(Typical value) 0.9mg 0.20±0.10 MURATA MFG.CO., LTD 8GHz(Typ.) 5GHz(Typ.) 2GHz(Typ.) 5GHz(Typ.) Reference Only Spec No.JEFL243D-0009L-01 P2/11 6.Marking No Marking. 7. Electrical Performance No. 7.1 Item Common Mode Impedance Specification Meet item 3. 7.2 Withstanding Voltage Products shall not be damaged. 7.3 DC Resistance (Rdc) Meet item 3. 7.4 Insulation Resistance (I.R.) Test Method Measuring Frequency : 100±1MHz (ref.item 10.) Measuring Equipment : KEYSIGHT 4291A or the equivalents (In case of doubt in standard condition, the heat treatment(200°C, about 10 min) shall be applied. Test Voltage : 2.5 times for Rated Voltage Time : 1 to 5s Charge Current : 1 mA max.(ref.item 10.) Measuring current : 100mA max.(ref.item 10.) Measuring voltage : Rated Voltage Measuring time : 1 min max. (ref.item 10.) 8.Mechanical Performance No. 8.1 8.2 8.3 Item Appearance and Dimensions Solderability Specification Meet item 5. Test Method Visual Inspection and measured with Slide Calipers. The electrodes shall be at least 95% covered with new solder coating. Resistance to Soldering Heat Meet Table 1. Table 1 Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 150±10°C, 60～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 230±3°C Immersion Time : 3±0.5s Immersion and emersion rates : 25 mm / s Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 150±10°C, 60～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270±5°C Immersion Time : 5±1s Immersion and emersion rates : 25 mm / s Then measured arter exposure in the room condition for 4h to 48h. It shall be dropped on concrete or steel board. Method : free fall Height : 1m The Number of Times : 10 times It shall be soldered on the substrate. Oscillation Frequency : 10 to 2000 for 20 min Total amplitude : 3.0 mm or Acceleration amplitude 196 m/s2 whichever is smaller. Testing Time : A period of 4 hours in each of 3 mutually perpendicular directions. Substrate : (t =1.0 mm). Deflection : 2 mm Speed of Applying Force : 1.0 mm / s Keeping time : 60s 8.4 Drop 8.5 Vibration 8.6 Bending Strength Appearance Common Mode Impedance Change I.R. DC Resistance Change No damaged within ± 30% 10MΩ min. within ± 30% Meet Table 2. Table 2 Appearance No damaged DC Resistance within ± 30% Change Pressure jig R230 F Deflection 45 MURATA MFG.CO., LTD 45 Product Reference Only Spec No.JEFL243D-0009L-01 9.Environmental Performance (Products shall be soldered on the glass-epoxy substrate) No. 9.1 Item Temperature Cycle 9.2 Humidity 9.3 Heat life 9.4 Cold Resistance Specification Meet Table 1. P3/11 Test Method 1 Cycle Step 1 -40°C(+0°C,-3°C) / 30(+3,-0) min Step 2 Ordinary Temp. / within 3 min Step 3 +85(+2°C,-0°C) / 30(+3,-0) min Step 4 Ordinary Temp. / within 3 min Total of 100 cycles. Then measured after exposure in the room condition for 4h to 48h. Temperature : 40±2°C Humidity : 90 to 95 % (RH) Time : 1000h (+48h,-0h) Then measured after exposure in the room condition for 4h to 48h. Temperature : 85±2°C Test Voltage : 2 times for Rated Voltage Time : 1000h (+48h,-0h) Then measured after exposure in the room condition for 4h to 48h. (ref. Item 10.) Temperature : -40± 2°C Time : 1000h (+48h,-0h) Then measured after exposure in the room condition for 4h to 48h. 10. Terminal to be Tested. When measuring and supplying the voltage,the following terminal is applied. No. 10.1 10.2 10.3 Item Common Mode Impedance Withstanding Voltage Insulation Resistance Heat Life Terminal to be Tested Terminal Terminal Terminal Terminal DC Resistance Terminal Terminal Terminal Terminal 11. Measuring method for common mode impedance. Measured common mode impedance may be included measurement error due to stray capacitance, residual inductance of test fixture. To correct this error, the common mode impedance should be calculate as follows; (1) Measure admittance of the fixture(opened), Go Bo. (2) Measure impedance of the fixture(shorted), Rs Xs. (3) Measure admittance of the specimen, Gm Bm. (4) Calculate corrected impedance Z using the formula below. Z = (Rx2+Xx2) 1/2 Where Rx = Gm - Go － Rs (Gm-Go)２ + (Bm-Bo)２ - (Bm - Bo) － Xs (Gm-Go)２ + (Bm-Bo)２ 12. P.C.B., Flux, Solder and Soldering condition Xx = Test shall be done using P.C.B., Flux, Solder and Soldering condition which are specified in item 16 except the case of being specified special condition. MURATA MFG.CO., LTD Reference Only Spec No.JEFL243D-0009L-01 13.Impedance Frequency Characteristics(Typical) P4/11 DLM0NSB120HY2 Insertion Loss[dB] Impedance (Ω) Differential Mode Common Mode Frequency(MHz) Frequency(MHz) DLM0NSB280HY2 Impedance (Ω) Insertion Loss[dB] Differential Mode Common Mode Frequency(MHz) Frequency(MHz) DLM0NSN500HY2 Insertion Loss[dB] Impedance (Ω) Differential Mode Common Mode Frequency(MHz) Frequency(MHz) Impedance (Ω) Insertion Loss[dB] DLM0NSN900HY2 DLM0NSN900HY2 Differential Mode Common Mode DLM0NSM900HY2 Frequency(MHz) Frequency(MHz) MURATA MFG.CO., LTD Reference Only Spec No.JEFL243D-0009L-01 P5/11 DLM0NSM900HY2 Impedance (Ω) Insertion Loss[dB] Differential Mode Common Mode Frequency(MHz) Frequency(MHz) (2) (4) (3) 2.0 ±0.05 2.0 ±0.05 4.0 ±0.1 φ1.5 +0.1 -0 0.73 ±0.03 0.97±0.03 3.5 ±0.05 ＊(1)(2)(3)(4) indicates terminal number 8.0 ±0.2 (1) 1.75±0.1 14.Specification of Packaging Frequency 14.1 Appearance and Dimensions ( 8mm-wide, 2mm pitch Paper tape) 0.60±0.03 0.77±0.03 0.8 max. 0.55 以下 引 き 出 しof 方feed 向 Direction (in:mm) 14.2 Specification of Taping (1)Packing quantity(Standard quantity) 10,000 pcs. / reel (2)Packing Method Products shall be packed in the cavity of the base tape and sealed by Cover tape. (3)Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4)Spliced point The cover tape have no spliced point. (5)Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 14.3 Pull Strength of Paper Tape Paper Tape Cover Tape 5N min. 10N min. 14.4 Peeling off force of Cover Tape 0.1 to 0.6N(Minimum value is Typical) Speed of Peeling off : 300 mm/min. 165 to 180 degree Cover tape F Base tape MURATA MFG.CO., LTD Reference Only Spec No.JEFL243D-0009L-01 P6/11 14.5 Dimensions of Leader-tape, Trailer and Reel 14.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity, etc ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) RoHS regulation conformity parts. (2) MURATA classification number (1) (2) 14.7 Marking for Outside package Customer name Purchasing Order Number, Customer Part Number, MURATA part number, RoHS marking(∗2), Quantity, etc 14.8 Specification of Outer Case Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. Label H D W 15. ! △ Caution 15.1 Mounting Direction Mount products in right direction. Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also flames or other serious trouble. Ｚ right direction Ｚ wrong direction 15.2 Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (9) Data-processing equipment (10) Applications of similar complexity and / or reliability requirements to the applications listed in the above. MURATA MFG.CO., LTD Reference Only Spec No.JEFL243D-0009L-01 16. Notice P7/11 This product is designed for solder mounting. (reflow soldering only) Please consult us in advance for applying other mounting method such as conductive adhesive. 16.1 Flux and Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Use of Sn-Zn based solder will deteriorate performance of products. In case of using Sn-Zn based solder, please contact Murata in advance. 16.2 Assembling Pre-heating should be in such a way that the temperature difference between solder and ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. 16.3 Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 16.4 Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be location the sideways Direction (Length : awarping direction 2. (2) Components location on P.C.B. separation It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C Perforation C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. MURATA MFG.CO., LTD D *1 Reference Only Spec No.JEFL243D-0009L-01 P8/11 (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 16.5 Attention Regarding P.C.B. Design < The Arrangement of Products > P.C.B. shall be designed so that products are far from the portion of perforation. Portion of Perforation × P.C.B. ○ ○ The portion of perforation shall be designed as narrow as possible, and shall be designed so as not to be applied the stress in the case of P.C.B. separation. Products shall not be arranged on the line of a series of holes when there are big holes in P.C.B. (Because the stress concentrate on the line of holes.) Portion of Perforation P.C.B. Product × ○ × Product Hole < Products Placing > Pick- up nozzle Support pins shall be set under P.C.B . Product to prevent causing a warp to P.C.B. during placing the products on the other side of P.C.B. P.C.B. < P.C.B. Separation > Support pin P.C.B. shall not be separated with hand. P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending. 16.6 Attention Regarding P.C.B. Mounting In case of mounting by use of mounting machine, please choose nozzle which can pick up components of 0603 size. MURATA MFG.CO., LTD Reference Only Spec No.JEFL243D-0009L-01 16.7 P9/11 Standard Land Dimensions (1) (2) (4) (3) 0.50 0.80 0.30 0.30 *(1)(2)(3)(4)Indicates terminal number Resist Copper foil pattern No pattern 0.90 (in : mm) 16.8 Soldering(Reflow soldering) Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times Limit Profile above 230°C、60s max. 260°C、10s 2 times (1) Standard printing pattern of solder paste • Standard thickness of the solder paste should be 100 to 150µm. • Use the solder paste printing pattern of the right pattern. • For the resist and copper foil pattern, use standard land dimensions. • Use Sn-3.0Ag-0.5Cu solder. 0.30 0.30 0.30 (2) Reworking with Soldering iron • The following conditions shall be strictly followed when using a soldering iron after being mounted by reflow soldering. · Pre-heating: 150°C, 1 min · Soldering iron output: 30W max. · Tip temperature: 380°C max. · Tip diameter:φ3mm max. · Soldering time : 3(+1,-0) seconds. · Times : 2times max. • Do not touch the products directly with the tip of the soldering iron. MURATA MFG.CO., LTD 0.50 Pre-heating Heating Peak temperature Cycle of reflow Time (s) 0.30 90s±30s (in:mm) (in mm) Reference Only Spec No.JEFL243D-0009L-01 P10/11 (3) Solder Volume Solder shall be used not to be exceeded the upper limits as shown below. Upper Limit Recommendable Upper Limit Recommendable t 1/3 T ≦ ｔ ≦ T （T : Chip thickness） Accordingly increasing the solder volume, the mechanical stress to product is also increased. Excessive solder volume may cause the failure of mechanical or electrical performance. 16.9 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.) (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B.. ・Power : 20W/ l max. ・Frequency : 28kHz to 40kHz ・Time : 5 min max. (3) Cleaner 1. Alternative cleaner • Isopropyl alcohol (IPA) 2. Aqueous agent • PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 16.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 16.11 Operating Environment Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. 16.12 Storage Conditions (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment condition • Products should be stored in the warehouse on the following conditions. Temperature : -10 to +40°C Humidity : 15 to 85% relative humidity No rapid change on temperature and humidity • Products should not be stored in corrosive gases, such as sulfureous, acid gases,alkaline gases,to prevent the following deterioration. Poor solderability due to the oxidized electrode. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Avoid storing the product by itself bare (i.e.exposed directly to air). (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. MURATA MFG.CO., LTD Reference Only Spec No.JEFL243D-0009L-01 17. P11/11 ! △ Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD