LQM18PH1R5MFRL

Spec No.: JELF243B_9126F-01 P1/9 CHIP COILS (CHIP INDUCTORS) LQM18PH□□□□FR□ Murata Standard Reference Specification [AEC-Q200] 1. Scope This reference specification applies to chip coils (chip inductors) LQM18PH_FR series for automotive electronics based on AEC-Q200. 2. Part Numbering (Ex.) LQ M 18 P H Product ID Structure Dimension Application and (L × W) characteristic Category R22 M F R Inductance Tolerance Dimension Other (T) L Packaging L: taping *B: bulk *B: Bulk packing is also available. 3. Part Number and Rating Operating temperature range -55°C to +150°C Storage temperature range -55°C to +150°C Rated current DC resistance (mA) ESD (Ω) Self-resonant Based on temperature rise*2 Rank frequency Nominal Based on 4: 6 kV Tolerance Ambient Ambient (MHz min.) inductance Ambient value to < 8 kV (%) Typ. Max. temperature temperature (μH) change*1 temperature 85°C*3 125°C*3 150°C*3 Inductance Customer Part number Murata Part number LQM18PHR22MFRL 0.22 ±20 0.11 0.138 100 1500 1250 850 10 4 LQM18PH1R0MFRL 1.0 ±20 0.20 0.250 100 360 950 630 10 4 LQM18PH1R5MFRL 1.5 ±20 0.23 0.288 100 240 800 570 10 4 LQM18PH2R2MFRL 2.2 ±20 0.30 0.375 70 150 750 500 10 4 LQM18PH3R3MFRL 3.3 ±20 0.35 0.438 60 80 700 470 10 4 LQM18PH4R7MFRL 4.7 ±20 0.44 0.550 40 70 620 420 10 4 *1 When rated current is applied to the products, inductance will be within ±30% of initial inductance value range. *2 When rated current is applied to the products, temperature rise caused by self-generated heat shall be limited to 40°C max. *3 As shown in the diagram below, derating is applied to the rated current based on the operating temperature. 4. Testing Conditions Unless otherwise specified Temperature: ordinary temperature (15°C to 35°C) Humidity: ordinary humidity [25% to 85% (RH)] In case of doubt Temperature: 20°C±2°C Humidity: 60% to 70% (RH) Atmospheric pressure: 86 kPa to 106 kPa MURATA MFG CO., LTD Spec No.: JELF243B_9126F-01 P2/9 5. Appearance and Dimensions Unit mass (typical value): 0.005 g 6. Marking No marking. 7. Electrical Performance No. Item 7.1 Inductance Specification Test method Meet chapter 3 ratings. Measuring equipment: Keysight 4294A or the equivalent (1 mA) Measuring frequency: 1 MHz 7.2 DC resistance Meet chapter 3 ratings. Measuring equipment: digital multimeter Measuring circuit: Measure with the product set to terminal 2 and the switch pressed (open between a and b). When setting or removing the product, press the switch to short between a and b. 7.3 Self-resonant frequency Meet chapter 3 ratings. Measuring equipment: Keysight 4294A or the equivalent 8. AEC-Q200 Requirement 8.1 Performance [based on table 5 for magnetics (inductors/transformer) AEC-Q200 Rev. D issued June 1, 2010] AEC-Q200 No. 3 Stress High temperature exposure Murata specification/deviation Test method 1000 h at 150°C Set for 24 h at room condition, then measured. Meet table A after testing. Table A Appearance Inductance change (at 1 MHz) MURATA MFG CO., LTD No damage Within ±50% Spec No.: JELF243B_9126F-01 P3/9 AEC-Q200 No. Stress Murata specification/deviation Test method 4 Temperature cycling 1000 cycles -55°C to +150°C Set for 24 h at room condition, then measured. Meet table A after testing. 7 Biased humidity 1000 h at 85°C, 85% (RH). Unpowered. Meet table A after testing. 8 Operational life Apply 150°C 1000 h Set for 24 h at room condition, then measured. Meet table A after testing. 9 External visual Visual inspection No abnormalities 10 Physical dimension Meet chapter 5, "Appearance and Dimensions". No defects 12 Resistance to solvents Per MIL-STD-202 Method 215 Not applicable 13 Mechanical shock Per MIL-STD-202 Method 213 100 g's/6 ms/half sine Meet table A after testing. 14 Vibration 5 g's for 20 min, 12 cycles each of 3 orientations Test from 10 Hz to 2000 Hz Meet table A after testing. 15 Resistance to soldering heat No-heating Solder temperature 260°C±5°C Immersion time 10 s Pre-heating: 150°C to 180°C/90 s±30 s Meet table A after testing. 17 ESD Per AEC-Q200-002 Meet chapter 3 ratings. No defects 18 Solderbility Per J-STD-002 Method b: not applicable 95% of the terminations is to be soldered. 19 Electrical Measured: inductance characterization No defects 20 Flammability Per UL-94 Not applicable 21 Board flex Epoxy-PCB (1.6 mm) Deflection 2 mm (min.) 60 s minimum holding time Murata deviation request: 30 s Meet table A after testing. 22 Terminal strength Per AEC-Q200-006 A force of 17.7 N for 60 s Murata deviation request: 10 N for 10 s No defects 9. Specification of Packaging 9.1 Appearance and dimensions of tape (8 mm width/plastic tape) A 1.0±0.1 B 1.8±0.1 t 1.0 max. t' 0.30±0.05 (in mm) * The dimensions of the cavity are measured at its bottom. MURATA MFG CO., LTD Spec No.: JELF243B_9126F-01 P4/9 9.2 Taping specifications Packing quantity (Standard quantity) 4000 pcs/reel Packing method The products are placed in embossed cavities of a plastic tape and sealed by a cover tape. Feed hole position The feed holes on the plastic tape are on the right side when the cover tape is pulled toward the user. Joint The plastic tape and the cover tape are seamless. Number of missing products Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 9.3 Break down force of tape Break down force of plastic tape 10 N min. Break down force of cover tape 5 N min. 9.4 Peeling off force of cover tape Speed of peeling off Peeling off force 165 to 180 degree 300 mm/min 0.1 N to 0.7 N (The lower limit is for typical value.) F Cover tape Plastic tape 9.5 Dimensions of leader section, trailer section and reel A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.) 9.6 Marking for reel Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc. *1 Expression of inspection No.: (1) Factory code  □□ ○○○○ (2) Date First digit: year/last digit of year (1) (2) (3) Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D Third, Fourth digit: day (3) Serial No. *2 Expression of RoHS marking: (1) RoHS regulation conformity ROHSY () (2) Murata classification number (1) (2) 9.7 Marking on outer box (corrugated box) Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc. MURATA MFG CO., LTD Spec No.: JELF243B_9126F-01 P5/9 9.8 Specification of outer box Label H D W 10. Dimensions of outer box (mm) W D H 186 186 93 Standard reel quantity in outer box (reel) 5 * Above outer box size is typical. It depends on a quantity of an order. Caution 10.1 Restricted applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Disaster/crime prevention equipment (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Transportation equipment (trains, ships, etc.) (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and/or reliability requirements to the applications listed in the above 10.2 Precautions on rating Do not use the products in excess of their rated current. Doing so may cause the product to generate heat, resulting in short circuit between inner electrodes, wire breakage, or melted solder, which may cause dropping of parts. 10.3 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 11. Precautions for Use This product is designed to be mounted by soldering. If you want to use other mounting method, for example, using a conductive adhesive, please consult us beforehand. Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack. The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed. 11.1 Land dimensions The following diagram shows the recommended land dimensions for flow and reflow soldering. a 0.7 b 2.0 c 0.7 (in mm) MURATA MFG CO., LTD Spec No.: JELF243B_9126F-01 P6/9 11.2 Flux and solder used Flux • Use a rosin-based flux. • Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value). • Do not use a water-soluble flux. Solder • Use Sn-3.0Ag-0.5Cu solder. • Standard thickness of solder paste: 100 μm to 150 μm If you want to use a flux other than the above, please consult our technical department. 11.3 Soldering conditions (flow, reflow) • Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. (1) Flow Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Standard Profile Time. (s) Standard profile Limit profile Pre-heating 150°C/60 s min. 150°C/60 s min. Heating 250°C/4 s to 6 s 265°C±3°C/5 s 2 times 2 times Number of flow cycles MURATA MFG CO., LTD Spec No.: JELF243B_9126F-01 P7/9 (2) Reflow Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Time. (s) Standard profile Limit profile Pre-heating 150°C to 180°C/90 s±30 s 150°C to 180°C/90 s±30 s Heating Above 220°C/30 s to 60 s Above 230°C/60 s max. 245°C±3°C 260°C/10 s 2 times 2 times Peak temperature Number of reflow cycles 11.4 Reworking with soldering iron The following requirements must be met to rework a soldered product using a soldering iron. Item Requirement Pre-heating Tip temperature of soldering iron Power consumption of soldering iron Tip diameter of soldering iron Soldering time Number of reworking operations 150°C/approx. 1 min 350°C max. 80 W max. ø3 mm max. 3 s (+1 s, -0 s) 2 times max. * Avoid a direct contact of the tip of the soldering iron with the product. Such a direction contact may cause cracks in the ceramic body due to thermal shock. 11.5 Solder volume Solder shall be used not to be exceeded the upper limits as shown below. An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of mechanical or electrical performance. MURATA MFG CO., LTD Spec No.: JELF243B_9126F-01 P8/9 11.6 Product's location The following shall be considered when designing and laying out PCBs. (1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board. [Products direction] Products shall be located in the sideways direction (length: a < b) to the mechanical stress. a b 〈 Poor example〉 〈 Good example〉 (2) Components location on PCB separation It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of measures Stress level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D*1 (2) Add slits in the board separation part. A>B (3) Keep the mounting position of the component away from the board separation surface. A>C *1 A > D is valid when stress is added vertically to the perforation as with hand separation. If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting components near screw holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 11.7 Handling of substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG CO., LTD Spec No.: JELF243B_9126F-01 P9/9 11.8 Cleaning The product shall be cleaned under the following conditions. (1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C max. (2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in mounted products and the PCB. Item Requirement Power Time 20 W/L max. 5 min max. Frequency 28 kHz to 40 kHz (3) Cleaner Alcohol-based cleaner: IPA Aqueous agent: PINE ALPHA ST-100S (4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no cleaner is left. * For other cleaning, consult our technical department. 11.9 Storage and transportation Storage period Use the product within 6 months after delivery. If you do not use the product for more than 6 months, check solderability before using it. Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity. The recommended temperature range is -10°C to +40°C. The recommended relative humidity range is 15% to 85%. Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor solderability. • Do not place the products directly on the floor; they should be placed on a palette so that they are not affected by humidity or dust. • Avoid keeping the products in a place exposed to direct sunlight, heat or vibration. • Avoid storing the product by itself bare (i.e. exposed directly to air). Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when handling the products. 11.10 Resin coating The inductance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating/molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 11.11 Handling of product Inductance could change due to the effect of magnetism. Do not use magnetized tweezers, magnets, or other similar tools when handling the product (instead, use tweezers with resin or ceramic tips). 11.12 Magnetic saturation A current exceeding the rated current could cause the inductance value to drop due to magnetic saturation. 12. Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before order MURATA MFG CO., LTD