NSS60600MZ4
Low VCE(sat) Transistor,
PNP, 60 V, 6.0 A, SOT-223
Package
ON Semiconductor’s e 2PowerEdge family of low V CE(sat)
transistors are surface mount devices featuring ultra low saturation
voltage (VCE(sat)) and high current gain capability. These are designed
for use in low voltage, high speed switching applications where
affordable efficient energy control is important.
Typical applications are DC−DC converters and power management
in portable and battery powered products such as cellular and cordless
phones, PDAs, computers, printers, digital cameras and MP3 players.
Other applications are low voltage motor controls in mass storage
products such as disc drives and tape drives. In the automotive
industry they can be used in air bag deployment and in the instrument
cluster. The high current gain allows e2PowerEdge devices to be
driven directly from PMU’s control outputs, and the Linear Gain
(Beta) makes them ideal components in analog amplifiers.
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−60 VOLTS, 6.0 AMPS
2.0 WATTS
PNP LOW VCE(sat) TRANSISTOR
EQUIVALENT RDS(on) 50 mW
4
1
2
3
SOT−223
CASE 318E
STYLE 1
Features
• Complementary to NSS60601MZ4
• NSV Prefix for Automotive and Other Applications Requiring
•
C 2, 4
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS (TA = 25°C)
Max
Unit
Collector-Emitter Voltage
VCEO
−60
Vdc
Collector-Base Voltage
VCBO
−100
Vdc
Emitter-Base Voltage
VEBO
−6.0
Vdc
IC
−6.0
A
ICM
−12.0
A
Collector Current − Continuous
Collector Current − Peak
E3
MARKING DIAGRAM
Symbol
Rating
B1
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
AYW
60600G
1
A
Y
W
60600
G
= Assembly Location
= Year
= Work Week
= Specific Device Code
= Pb−Free Package
PIN ASSIGNMENT
4
C
B
C
E
1
2
3
Top View Pinout
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2016
June, 2016 − Rev. 5
1
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Publication Order Number:
NSS60600MZ4/D
NSS60600MZ4
THERMAL CHARACTERISTICS
Characteristic
Symbol
Total Device Dissipation
TA = 25°C
Derate above 25°C
PD (Note 1)
Thermal Resistance,
Junction−to−Ambient
RqJA (Note 1)
Total Device Dissipation
TA = 25°C
Derate above 25°C
PD (Note 2)
Thermal Resistance,
Junction−to−Ambient
RqJA (Note 2)
Max
Unit
800
6.5
mW
mW/°C
°C/W
155
2
15.6
W
mW/°C
°C/W
64
Total Device Dissipation
(Single Pulse < 10 sec.)
PDsingle
(Note 3)
710
mW
Junction and Storage Temperature Range
TJ, Tstg
−55 to +150
°C
1. FR− 4 @ 7.6 mm2, 1 oz. copper traces.
2. FR− 4 @ 645 mm2, 1 oz. copper traces.
3. Thermal response.
ORDERING INFORMATION
Package
Shipping†
NSS60600MZ4T1G
SOT−223
(Pb−Free)
1,000 / Tape & Reel
NSV60600MZ4T1G
SOT−223
(Pb−Free)
1,000 / Tape & Reel
NSS60600MZ4T3G
SOT−223
(Pb−Free)
4,000 / Tape & Reel
NSV60600MZ4T3G
SOT−223
(Pb−Free)
4,000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
NSS60600MZ4
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Collector −Emitter Breakdown Voltage (IC = −10 mAdc, IB = 0)
V(BR)CEO
−60
−
−
Vdc
Collector −Base Breakdown Voltage (IC = −0.1 mAdc, IE = 0)
V(BR)CBO
−100
−
−
Vdc
Emitter −Base Breakdown Voltage (IE = −0.1 mAdc, IC = 0)
OFF CHARACTERISTICS
V(BR)EBO
−6.0
−
−
Vdc
Collector Cutoff Current (VCB = −100 Vdc, IE = 0)
ICBO
−
−
−0.1
mAdc
Emitter Cutoff Current (VEB = −6.0 Vdc)
IEBO
−
−
−0.1
mAdc
150
120
100
70
−
−
−
−
−
360
−
−
−
−
−
−
−
−
−0.050
−0.100
−
−
−0.050
−0.070
−0.120
−0.250
−0.350
−
−
−1.0
−
−
−0.900
100
−
−
ON CHARACTERISTICS
hFE
DC Current Gain (Note 4)
(IC = −500 mA, VCE = −2.0 V)
(IC = −1.0 A, VCE = −2.0 V)
(IC = −2.0 A, VCE = −2.0 V)
(IC = −6.0 A, VCE = −2.0 V)
−
Collector −Emitter Saturation Voltage (Note 4)
(IC = −0.1 A, IB = −2.0 mA)
(IC = −1.0 A, IB = −0.100 A)
(IC = −2.0 A, IB = −0.200 A)
(IC = −3.0 A, IB = −60 mA)
(IC = −6.0 A, IB = −0.6 A)
VCE(sat)
Base −Emitter Saturation Voltage (Note 4)
(IC = −1.0 A, IB = −0.1 A)
VBE(sat)
Base −Emitter Turn−on Voltage (Note 4)
(IC = −1.0 A, VCE = −2.0 V)
VBE(on)
V
V
V
Cutoff Frequency
(IC = −500 mA, VCE = −10 V, f = 1.0 MHz)
fT
MHz
Input Capacitance (VEB = 5.0 V, f = 1.0 MHz)
Cibo
−
360
−
pF
Output Capacitance (VCB = 10 V, f = 1.0 MHz)
Cobo
−
60
−
pF
Delay (VCC = −30 V, IC = 750 mA, IB1 = 15 mA)
td
−
100
−
ns
Rise (VCC = −30 V, IC = 750 mA, IB1 = 15 mA)
tr
−
180
−
ns
Storage (VCC = −30 V, IC = 750 mA, IB1 = 15 mA)
ts
−
540
−
ns
Fall (VCC = −30 V, IC = 750 mA, IB1 = 15 mA)
tf
−
145
−
ns
SWITCHING CHARACTERISTICS
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulsed Condition: Pulse Width = 300 msec, Duty Cycle ≤ 2%.
PD, POWER DISSIPATION (W)
2.5
2.0
TC
1.5
1.0
TA
0.5
0
25
50
75
100
TJ, TEMPERATURE (°C)
Figure 1. Power Derating
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3
125
150
NSS60600MZ4
TYPICAL CHARACTERISTICS
1000
1000
VCE = 4 V
150°C
hFE, DC CURRENT GAIN
hFE, DC CURRENT GAIN
VCE = 2 V
25°C
−40°C
100
10
0.001
150°C
25°C
10
0.01
0.1
1
10
0.001
0.1
1
IC, COLLECTOR CURRENT (A)
Figure 2. DC Current Gain
Figure 3. DC Current Gain
10
1
VCE(sat), COLLECTOR−EMITTER
SATURATION VOLTAGE (V)
IC/IB = 10
150°C
0.1
25°C
−40°C
0.01
IC/IB = 50
−40°C
25°C
0.1
150°C
0.01
0.001
0.001
0.01
0.1
1
0.001
10
IC, COLLECTOR CURRENT (A)
VBE(on), EMITTER−BASE VOLTAGE (V)
TJ = 25°C
IC = 6 A
3A
0.1
0.01
1.0E−04
2A
1A
0.1 A
1.0E−03
0.5 A
1.0E−02
1.0E−01
0.1
1
10
Figure 5. Collector−Emitter Saturation Voltage
10
1
0.01
IC, COLLECTOR CURRENT (A)
Figure 4. Collector−Emitter Saturation Voltage
VCE(sat), COLLECTOR−EMITTER
SATURATION VOLTAGE (V)
0.01
IC, COLLECTOR CURRENT (A)
1
VCE(sat), COLLECTOR−EMITTER
SATURATION VOLTAGE (V)
−40°C
100
1.0E+00
1.0E+01
1.2
1.1
VCE = 2 V
1.0
0.9
−40°C
0.8
0.7
0.6
25°C
0.5
0.4
0.3
0.2
0.1
0
0.001
IB, BASE CURRENT (A)
150°C
0.01
0.1
1
IC, COLLECTOR CURRENT (A)
Figure 6. Collector Saturation Region
Figure 7. VBE(on) Voltage
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4
10
NSS60600MZ4
TYPICAL CHARACTERISTICS
1.2
IC/IB = 10
1.0
0.9
0.8
VBE(sat), EMITTER−BASE
SATURATION VOLTAGE (V)
VBE(sat), EMITTER−BASE
SATURATION VOLTAGE (V)
1.2
1.1
−40°C
0.7
0.6
0.5
25°C
0.4
150°C
0.3
0.2
0.1
0
0.001
0.01
0.1
1
10
1.1
1.0
IC/IB = 50
0.9
−40°C
0.8
0.7
0.6
25°C
0.5
0.4
0.3
150°C
0.2
0.1
0
0.001
0.01
IC, COLLECTOR CURRENT (A)
180
TJ = 25°C
ftest = 1 MHz
800
Cobo, OUTPUT CAPACITANCE (pF)
Cibo, INPUT CAPACITANCE (pF)
10
Figure 9. Base−Emitter Saturation Voltage
900
700
600
500
400
300
200
100
160
TJ = 25°C
ftest = 1 MHz
140
120
100
80
60
40
20
0
0
1
2
3
4
5
7
6
8
0
10
20
30
40
50
60
Figure 10. Input Capacitance
Figure 11. Output Capacitance
IC, COLLECTOR CURRENT (A)
TJ = 25°C
ftest = 1 MHz
VCE = 10 V
100
80
60
40
20
0
0.001
90 100
VCB, COLLECTOR BASE VOLTAGE (V)
100
120
80
70
VEB, EMITTER BASE VOLTAGE (V)
140
fTau, CURRENT BANDWIDTH
PRODUCT (MHz)
1
IC, COLLECTOR CURRENT (A)
Figure 8. Base−Emitter Saturation Voltage
0
0.1
0.01
0.1
1
10
100 ms
10 ms
1 ms
10
1s
100 ms
1
10 ms
DC
1 ms
0.5 ms
0.1
0.01
0.1
IC, COLLECTOR CURRENT (A)
1
10
VCE, COLLECTOR−EMITTER VOLTAGE (V)
Figure 12. Current−Gain Bandwidth Product
Figure 13. Safe Operating Area
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5
100
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE R
DATE 02 OCT 2018
SCALE 1:1
q
q
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42680B
SOT−223 (TO−261)
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
SOT−223 (TO−261)
CASE 318E−04
ISSUE R
STYLE 1:
PIN 1.
2.
3.
4.
BASE
COLLECTOR
EMITTER
COLLECTOR
STYLE 2:
PIN 1.
2.
3.
4.
ANODE
CATHODE
NC
CATHODE
STYLE 6:
PIN 1.
2.
3.
4.
RETURN
INPUT
OUTPUT
INPUT
STYLE 7:
PIN 1.
2.
3.
4.
ANODE 1
CATHODE
ANODE 2
CATHODE
STYLE 11:
PIN 1. MT 1
2. MT 2
3. GATE
4. MT 2
STYLE 3:
PIN 1.
2.
3.
4.
GATE
DRAIN
SOURCE
DRAIN
STYLE 8:
STYLE 12:
PIN 1. INPUT
2. OUTPUT
3. NC
4. OUTPUT
CANCELLED
DATE 02 OCT 2018
STYLE 4:
PIN 1.
2.
3.
4.
SOURCE
DRAIN
GATE
DRAIN
STYLE 5:
PIN 1.
2.
3.
4.
STYLE 9:
PIN 1.
2.
3.
4.
INPUT
GROUND
LOGIC
GROUND
STYLE 10:
PIN 1. CATHODE
2. ANODE
3. GATE
4. ANODE
DRAIN
GATE
SOURCE
GATE
STYLE 13:
PIN 1. GATE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
GENERIC
MARKING DIAGRAM*
AYW
XXXXXG
G
1
A
= Assembly Location
Y
= Year
W
= Work Week
XXXXX = Specific Device Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42680B
SOT−223 (TO−261)
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
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information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
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