ENW-89837A5KF

  PAN1026A Bluetooth Basic Data Rate and Low Energy Module Product Specification Rev. 0.1 Wireless Modules  PAN1026A Bluetooth Module New Features Overview The PAN1026A is a Class 2 Bluetooth 4.2 Basic Data Rate and Low Energy module for easy implementation of Bluetooth functionality into various electronic devices. • • • Features • Bluetooth 4.2 Basic Data Rate (BR) and Low • • • • • • • • • Energy (LE) • • • • • • • Embedded SPP profile Embedded GATT profile High-level API commands Bluetooth 4.2 (LE) embedded GATT profile with high-level API commands, compatible with Toshiba reference BLE profiles Operational temperature range -40 to +85 °C Operational voltage 2.7 V to 3.6 V +/- 10 % Power consumption Tx: 46 mA Dimensions 15.6 x 8.7 x 1.9 mm Increased (2.5 x) BLE data transfer rates through extended MTU size (64 bytes to 160 bytes) More complex BLE profiles possible through extended GATT functionality Data base pool, number of services and characteristics, data flow control Fast SPP classic connection/disconnection times Interlaced inquiry/page scan & extended inquiry response Transmission (Tx) power control Improved PER (peak-error-rate) for BLE traffic Integration of BT 4.2 secure connecting feature implementing ECDH technology Bluetooth • • • • GAP support for SPP GAP Peripheral and Broadcast support for LE GATT server and client mode support for LE GAP Central and Observer not supported for LE Output power 4 dBm Interfaces -88 dBm sensitivity Integrated high speed crystal oscillator (26 MHz) • UART, GPIO (10 input/output pins), wake-up control pins Block Diagram PAN1026A Bluetooth 4.2 Module Vcc 3.3 V EEPROM 32 kbit UART Crystal 26 MHz GPIOs Chip antenna Host wake up Toshiba TC35661 Reset 32 kHz input Wake up Product Specification Rev. 0.1 LPF Page 2  PAN1026A Bluetooth Module By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. © Panasonic Industrial Devices Europe GmbH 2017. This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. Engineering Samples (ES) If Engineering Samples are delivered to the customer, these samples have the status “Engineering Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification. Engineering Samples are not qualified and they are not to be used for reliability testing or series production. Disclaimer The customer acknowledges that samples may deviate from the Product Specification and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by: The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer, Deviation or lapse in function of the Engineering Sample, Improper use of the Engineering Sample. Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager. Product Specification Rev. 0.1 Page 3  PAN1026A Bluetooth Module Table of Contents 1 2 3 4 5 6 7 About This Document......................................................................................................................... 5 1.1 Purpose and Audience .............................................................................................................. 5 1.2 Revision History ......................................................................................................................... 5 1.3 Use of Symbols ......................................................................................................................... 5 1.4 Related Documents ................................................................................................................... 5 Overview .............................................................................................................................................. 6 2.1 Block Diagram ........................................................................................................................... 7 2.2 Pin Configuration ....................................................................................................................... 8 2.3 UART Interface ........................................................................................................................ 10 2.4 Bluetooth Features .................................................................................................................. 10 Detailed Description ......................................................................................................................... 11 3.1 Dimensions .............................................................................................................................. 11 3.2 Footprint .................................................................................................................................. 12 3.3 Packaging ................................................................................................................................ 13 3.4 Case Marking .......................................................................................................................... 16 Specification ..................................................................................................................................... 17 4.1 Default Test Conditions ........................................................................................................... 17 4.2 Absolute Maximum Ratings ..................................................................................................... 17 4.3 Recommended Operating Conditions ...................................................................................... 18 4.4 Current Consumption............................................................................................................... 18 4.5 Bluetooth ................................................................................................................................. 19 4.6 Reliability Tests ....................................................................................................................... 19 4.7 Recommended Soldering Profile ............................................................................................. 20 Cautions ............................................................................................................................................ 21 5.1 Design Notes ........................................................................................................................... 21 5.2 Installation Notes ..................................................................................................................... 21 5.3 Usage Condition Notes ............................................................................................................ 22 5.4 Storage Notes .......................................................................................................................... 22 5.5 Safety Cautions ....................................................................................................................... 22 5.6 Other Cautions ........................................................................................................................ 23 5.7 Life Support Policy ................................................................................................................... 23 Regulatory and Certification Information ....................................................................................... 24 6.1 RoHS and REACH Declaration ............................................................................................... 24 6.2 Further Regulatory Information ................................................................................................ 24 Appendix ........................................................................................................................................... 25 7.1 Ordering Information ................................................................................................................ 25 7.2 Contact Details ........................................................................................................................ 26 Product Specification Rev. 0.1 Page 4  PAN1026A Bluetooth Module 1 About This Document 1 About This Document 1.1 Purpose and Audience This Product Specification provides details on the functional, operational, and electrical characteristics of the Panasonic PAN1026A module. It is intended for hardware design, application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to as “the PAN1026A” or “the module” within this document. 1.2 1.3 Revision History Revision Date Modifications/Remarks 0.1 23.03.2017 1st preliminary version. Use of Symbols Symbol Description Note Indicates important information for the proper use of the product. Non-observance can lead to errors. Attention Indicates important notes that, if not observed, can put the product’s functionality at risk.  [chapter number] [chapter title] Cross reference Indicates crossreferences within the document. Example: Description of the symbols used in this document  1.3 Use of Symbols. 1.4 Related Documents Please refer to the Panasonic website for related documents  7.2.2 Product Information. Product Specification Rev. 0.1 Page 5  PAN1026A Bluetooth Module 2 Overview 2 Overview The PAN1026A is based on Toshiba´s single-chip TC35661 Bluetooth semiconductor device with an embedded Toshiba Bluetooth SIG certified stack. The PAN1026A is a highly integrated Dual Mode Bluetooth controller that delivers high-speed operation at ultra-low power consumption. An embedded SPP (Serial Port Profile of Bluetooth Classic) and a GATT (Generic Attribute Profile of Bluetooth LE) stack are integrated. The module significantly reduces external component count and power consumption in applications requiring support of Bluetooth 4.2 standards. EDR (Enhanced Data Rate) or Central Mode are not supported. Details about iAP integration can be provided on request. The integrated EEPROM has a Panasonic MAC address and it can be used to store link keys. The module allows for serving both legacy Bluetooth Classic and Bluetooth Low Energy connections with rapid connection and disconnection, needed by a wide range of applications, all at a small form factor. Compared to the PAN1026, the PAN1026A has additional features for secure connections via Bluetooth LE and it is fully backwards compatible. Next to increased low energy transfer speed, transmission power can also be controlled. The PAN1026A module is manufactured in a small 15.6 x 8.7 x 1.9 mm SMD package with a shielded case and it is qualified according to the Bluetooth 2.1 and 4.2 standards. Please refer to the Panasonic website for related documents  7.2.2 Product Information. Further information on the variants and versions  7.1 Ordering Information. Product Specification Rev. 0.1 Page 6  PAN1026A Bluetooth Module 2 Overview 2.1 Block Diagram PAN1026A Bluetooth 4.2 Module Vcc 3.3 V EEPROM 32 kbit UART Crystal 26 MHz GPIOs Chip antenna Host wake up Toshiba TC35661 Reset 32 kHz input LPF Wake up Total capacitor value: 6.7 µF +/-10 % Total inductance: 2 NH +/-10 % Total resistance: 220 KΩ +/-10 % Product Specification Rev. 0.1 Page 7  PAN1026A Bluetooth Module 2 Overview 2.2 Pin Configuration Pin Assignment Top View 15.6 mm 5.0 1.2 2.4 F2 F3 F4 F5 F6 F7 F8 F9 E1 E2 E3 E4 E5 E6 E7 E8 E9 D1 D2 D3 D4 D5 D6 D7 D8 D9 C1 C2 C3 C4 C5 C6 C7 C8 C9 B1 B2 B3 B4 B5 B6 B7 B8 B9 A1 A2 A3 A4 A5 A6 A7 A8 A9 F11 F12 A11 A12 1.35 1.2 F1 8.70 mm 0.6 1.35 1.0 0.6 Pin Functions No Pin Name Pin Type Description A1 GND Ground Pin Connect to ground A2 NC NC Not connected, leave open A3 Reset Digital Input Reset, active low A4 VCC Power analog/digital power supply connection A5 VCC Power analog/digital power supply connection A6 VCC Power analog/digital power supply connection A7 GND Ground Pin Connect to ground A8 NC NC Not connected A9 GND Ground Pin Connect to ground A11 GND Ground Pin Connect to ground A12 GND Ground Pin Connect to ground Product Specification Rev. 0.1 GPIO No Page 8  PAN1026A Bluetooth Module 2 Overview No Pin Name GPIO No Pin Type Description NC Not connected, leave open B4 NC NC Not connected, leave open B5 NC NC Not connected, leave open B6 NC NC Not connected, leave open B7 NC NC Not connected, leave open B8 NC NC Not connected, leave open B9 NC NC Not connected, leave open C4 NC NC Not connected, leave open C5 NC NC Not connected, leave open B1 NC B2 BTS GPIO 11 B3 BTA GPIO 10 C1 CS0X GPIO 17 C2 BTI GPIO 13 C3 WIA GPIO 12 C6 PCMCLK GPIO 04 Digital I/O PCM clock C7 FSYNC GPIO 05 Digital I/O PCM synchronization C8 GND Ground Pin Connect to ground C9 GND Ground Pin Connect to ground D1 CS1X GPIO 18 D2 DIN GPIO 16 D3 GPIO1 GPIO 01 Digital I/O D4 GPIO0 Digital I/O D5 NC NC Not connected, leave open Digital Input PCM In: Not supported D7 GND Ground Pin Connect to ground D8 GND Ground Pin Connect to ground D9 ANT RF-Signal Antenna pin (not connected for standard version) D6 PCMIN GPIO 03 E1 SDA GPIO 15 Digital I/O I2C interface (only internal), connect to test pin E2 SCL GPIO 14 Digital I/O I2C interface (only internal), connect to test pin Ground Pin Connect to ground E3 GND E4 USB USB direct is not supported by the IC. Leave this pin open. E5 CLKREQ Digital Output Active high once crystal frequency is stable E6 UART RXD Digital Input UART RXD Product Specification Rev. 0.1 Page 9  PAN1026A Bluetooth Module 2 Overview No Pin Name GPIO No Pin Type Description GPIO 02 Digital Output PCM Output: not supported E8 GND Ground Pin Connect to ground E9 GND Ground Pin Connect to ground F1 GND Ground Pin Connect to ground F2 EEPROM_WP Digital Input Internal EEPROM Write Protect (active high) F3 GND Ground Pin Connect to ground F4 GND Ground Pin Connect to ground F5 UART CTS Digital Input UART CTS F6 SLEEPCLK Digital Input Input clock for 32.768 KHz F7 UARTTXD Digital Output UART TX F8 UARTRTS Digital Output UART RTS F9 GND Ground Pin Connect to ground F11 GND Ground Pin Connect to ground F12 GND Ground Pin Connect to ground E7 PCMOUT 2.3 UART Interface • • • • • 2.4 Full-duplex 4-wire data transfer: RX, TX, RTS, CTS Programmable baud rate: 2 400 bps to 4.33 Mbps Default baud rate: 115 200 bps Data format: 8N1, LSB first Error detection: Character timeout, Overrun error, Framing error Bluetooth Features • • • • • • Bluetooth 4.0 with SPP & GATT GAP support for SPP GATT server and client mode supported for LE Class 2 TX power w/o external PA (improved link robustness) Excellent link budget (up to 91 dB), enabling long-range applications GAP peripheral support for LE Product Specification Rev. 0.1 Page 10  PAN1026A Bluetooth Module 3 Detailed Description 3 Detailed Description 3.1 Dimensions All dimensions are in millimeters. No. Item Dimension Tolerance Remark 1 Width 8.70 ± 0.20 2 Length 15.60 ± 0.20 3 Height 1.80 Product Specification Rev. 0.1 ± 0.20 With case Page 11  PAN1026A Bluetooth Module 3 Detailed Description 3.2 Footprint The outer dimensions have a tolerance of 0.3 mm. Top View 15.6 mm 5.0 1.2 2.4 F2 F3 F4 F5 F6 F7 F8 F9 E1 E2 E3 E4 E5 E6 E7 E8 E9 D1 D2 D3 D4 D5 D6 D7 D8 D9 C1 C2 C3 C4 C5 C6 C7 C8 C9 B1 B2 B3 B4 B5 B6 B7 B8 B9 A1 A2 A3 A4 A5 A6 A7 A8 A9 F11 F12 A11 A12 1.35 1.2 F1 8.70 mm 0.6 1.35 1.0 0.6 Product Specification Rev. 0.1 Page 12  PAN1026A Bluetooth Module 3 Detailed Description 3.3 Packaging The product is a mass production status product and will be delivered in the package described below. 3.3.1 Tape Dimensions 3.3.2 Packing in Tape Direction of unreeling (for customer) trailer (empty) 1 x circumference / hub (min 160mm) component packed area standard 1500pcs leader (empty) minimum 10 pitch Top cover tape more than 1 x circumference plus 100mm to avoid fixing of tape end on sealed modules. Empty spaces in the component packed area shall be less than two per reel and those spaces shall not be consecutive. 100730-PAN1720.vsd The top cover tape shall not be found on reel holes and it shall not stick out from the reel. Product Specification Rev. 0.1 Page 13  PAN1026A Bluetooth Module 3 Detailed Description 3.3.3 Component Direction 3.3.4 Reel Dimension Product Specification Rev. 0.1 Page 14  PAN1026A Bluetooth Module 3 Detailed Description 3.3.5 Package Label Example (1T) (1P) (2P) (9D) (Q) (HW/SW) 3.3.6 Lot code Customer order number, if applicable Order number Date code Quantity Hardware/software version Total Package Product Specification Rev. 0.1 Page 15  PAN1026A Bluetooth Module 3 Detailed Description 3.4 Case Marking Example 1 2 3 4 5 6 7 8 9 Product Specification Rev. 0.1 MIC ID Brand name Hardware/software version Order number FCC ID Lot code Engineering Sample marking, if applicable Marking for Pin 1 2D barcode, for internal usage only Page 16  PAN1026A Bluetooth Module 4 Specification 4 Specification All specifications are over temperature and process, unless indicated otherwise. 4.1 Default Test Conditions Temperature: Humidity: Supply Voltage: 4.2 25 ± 10 °C 40 to 85 % RH 3.3 V Absolute Maximum Ratings The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter TSTOR Storage temperature VESD ESD robustness Condition Min. Typ. -40 All pads, according to human body model (HBM), JEDEC STD 22, method A114 According to charged device model (CDM), JEDEC STD 22, method C101 PRF RF input level VDIG Voltage on any digital pins Product Specification Rev. 0.1 -0.3 Max. Units +125 °C 1 000 V 500 V +10 dBm VDD + 0.3 V Page 17  PAN1026A Bluetooth Module 4 Specification 4.3 Recommended Operating Conditions The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. 4.4 Symbol Parameter Condition Min. Typ. TA Ambient operating temperature range -40 VDD 3V3 Supply voltage 2.7 Max. Units +85 °C 3.6 V 3.3 Current Consumption The current consumption depends on the user scenario and on the setup and timing in the power modes. Assume VDD = 3.3 V, Tamb = 25 °C, if nothing else stated. Parameter Condition Idle Current After reset was pulled down. Connected Peak Power Sending DH5 packets. Max. output power. 62 mA Connected Peak Power Sending DH3 packets. Max. output power. 61 mA Connected Peak Power Sending DH1 packets. Max. output power. 55 mA Sleep mode activated Sniff mode/not connected/BLE Advertising Product Specification Rev. 0.1 Min. Typ. Max. Units mA 7.8 2 mA Page 18  PAN1026A Bluetooth Module 4 Specification 4.5 Bluetooth Parameter Condition Min. Operation frequency range Channel spacing Typ. 2 402 2 480 BT-Classic/BLE Output Power Maximum setting, measured at dual ended 50 ohm. Sensitivity 4.6 Max. Symbol Parameter Condition 1 Spurious emissions Conducted measurement with a 50 Ω dual-ended load. Complies with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STDT-66. Min. Units MHz 1/2 MHz 4 dBm -88 dBm Typ. Max.