UPC7073GT

DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC7073 µPC7073 ANALOG SUBSCRIBER LINE LSI (BS-SLIC) The µPC7073 is a BS-SLIC that can be used in analog subscriber circuits such as private branch exchangers (PBXs) and switching equipment for central offices. It features two of the functions required for analog subscriber circuits: subscriber line feed control and subscriber line supervision. Use of the µPC7073 in combination with a digital CODEC (µPD9903) can reduce the number of components required in analog subscriber circuits. FEATURES • Single-chip, monolithic LSI (bipolar) • Constant-resistance feed or semi constant-current feed Note • 200-Ω feed, 400-Ω feed, or Tip-to-Ring pin feedout status (HIGH and WET) • On-chip metering signal superposing circuit • On-hook sending and receiving • Loop detection Note • Ground detection and ground-fault/power contact protection Note • Three on-chip relay drivers (flyback prevention diode must be externally provided) • Two power supply voltages (–48 V and +5 V) • Low power consumption: 110 mW (TYP., when on hook) Note Requires µPD9903. ORDERING INFORMATION Part Number Package 48-pin plastic shrink SOP (375 mil) µPC7073GT The information in this document is subject to change without notice. Document No. S10896EJ2V0DS00 (2nd edition) (Previous No. ID-3576) Date Published June 1996 P Printed in Japan © 1996 µPC7073 PIN CONFIGURATION 48-pin plastic shrink SOP (375 mil) DCOUT3 DCOUT2 DCOUT1 DCIN1 DCIN2 BBOUT ASCN AGDT BIAS RX ACOM NC NC NC GND1 NC PD ALM BCUT RC1 RC2 RC3 VBB TEF 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VCC TTXIN CPSR RB RE NC RS NC TS NC TE TB CDC TX OPIN– OPIN+ REF GND2 NC RY3 NC RY2 NC RY1 µ PD7073GT ACOM AGDT ALM ASCN BBOUT BCUT BIAS CDC CPSR DC IN1, DC IN2 : : : : : : : : : : ANALOG COMMON VOLTAGE ANALOG GROUND DETECTION SIGNAL OUT ALARM IN ANALOG LOOP DETECTION SIGNAL OUT V BB V OLTAGE INFORMATION OUT BATTERY FEED CUT SIGNAL IN BIAS LEVEL DC FEEDBACK CAPACITOR POWER SUPPLY REJECTION CAPACITOR DC FEEDBACK CONTROL IN DC FEEDBACK CONTROL OUT GROUND NO CONNECTION TELETAX SIGNAL CANCEL IN (+) TELETAX SINGAL CANCEL IN (–) POWER DOWN CONTROL IN RB RE R EF RS RX TB TE T EF TS TTXIN TX VBB VCC : : : : : : : : : : : : : RING BASE RELAY CONTROL IN RING EMITTER RING EMITTER PROTECT FEED RING SENSE SIGNAL RECEPTION IN RELAY DRIVER OUT TIP BASE TIP EMITTER TIP EMITTER PROJECT FEED TIP SENSE TELETAX SIGNAL IN TRANSSMISSION OUTPUT NEGATIVE POWER SUPPLY (–48 V) POSITIVE POWER SUPPLY (+5 V) RC1 -RC3 : RY 1-RY 3 : DC OUT1-DC OUT3 : GND1, GND2 : NC OP IN+ OP IN– PD : : : : 2 µPC7073 BLOCK DIAGRAM GND1 VCC GND2 RY1 RY2 RY3 RC 1 T EF Relay drivers RC 2 RC 3 DC OUT2 TB TE Σ AGDT ASCN DC OUT3 DC OUT1 TX TS RS DC IN1 + + L.P.F + RE Bias circuit RB BB OUT V BB R EF Logic circuits VBB CPSR DC IN2 CDC RX BIAS ACOM Tip Ring V BB BCUT ALM PD OP IN– OP IN+ TTXIN 3 µPC7073 CONTENTS 1. PIN FUNCTIONS ............................................................................................................................. 2. USE CAUTIONS .............................................................................................................................. 3. ELECTRICAL SPECIFICATIONS ................................................................................................... 3.1 3.2 Discrete unit ratings ............................................................................................................................... Combined specifications with µPD9903 .............................................................................................. 5 7 8 8 10 4. SYSTEM APPLICATION EXAMPLE USING µPC7073 AND µPD9903 .................................... 14 5. PACKAGE DRAWING ..................................................................................................................... 15 6. RECOMMENDED SOLDERING CONDITIONS ............................................................................ 16 4 µPC7073 1. PIN FUNCTIONS Number 1-3 4, 5 6 7 8 9 10 11 12-14, 16, 26, 28, 30, 39, 41, 43 15 17 Pin Name DCOUT1-DCOUT3 DCIN1, DCIN2 BBOUT ASCN AGDT BIAS RX ACOM NC I/O O I O O O I I I – DC feedback control output DC feedback control input VBB voltage information output Tip-Ring difference current detection signal output Tip-Ring sum current detection signal output Bias level input. Connect to µPD9903’s AIN pin Receiving input for 4W side Function [to the µPD9903’s pin 48-46] [to the µPD9903’s pin 45, 44] [to the µPD9903’s pin 43] [to the µPD9903’s pin 42] [to the µPD9903’s pin 41] [to the µPD9903’s pin 40] [to the µPD9903’s pin 39] Signal reference voltage (2.4 V TYP) input for 4W side [to the µPD9903’s pin 37, 38] No-connection pins. Leave these pins unconnected. GND1 PD – I Ground pin 1, for circuit grounding Power-down control  H: Power-up  TTL level L: Power-down  [to the µPD9903’s pin 32] 18 ALM I Ground-fault/power line contact protection mode select input H: Protect mode   TTL level L: Normal feed  [to the µPD9903’s pin 31] Feed-out select input H: Feed-out  TTL level  L: Normal feed  Relay control for ringer transmission, high active Relay control for line test, high active Relay control for network test, high active Negative power supply (–48 V) Feed resistor pin connection for Tip side during ground-fault/power line contact detection Relay control for ringer transmission, open collector Relay control for line testing, open collector Relay control for network testing, open collector Ground pin 2, relay driver Ring feed resistor pin connection for ground-fault/power line contact detection TTX (Teletax) signal cancel circuit input pin (+) TTX signal cancel circuit input pin (–) Transmission output for 4W side. Connect with BIAS pin via CAC capacitor. Connect to DC feedback capacitor Connect CDC capacitor to this pin Tip-side auxiliary power transistor base connection pin Tip-side feed amplifier output pin. Connect with TS pin via RFT resistor. Tip pin for 2W side Ring pin for 2W side 19 BCUT I [to the µPD9903’s pin 30] [to the µPD9903’s pin 29] [to the µPD9903’s pin 28] [to the µPD9903’s pin 27] 20 21 22 23 24 RC1 RC2 RC3 VBB TEF I I I – O 25 27 29 31 32 33 34 35 36 RY1 RY2 RY3 GND2 REF OPIN+ OPIN– TX CDC O O O – O I I O – 37 38 40 42 TB TE TS RS O O I/O I/O 5 µPC7073 Number 44 45 46 47 48 Pin Name RE RB CPSR TTXIN VCC I/O O O – I – Function Ring-side feed amplifier output pin. Connect with RS pin via RFR resistor. Ring-side auxiliary power transistor base connection pin Connect a capacitor for power supply noise eliminator TTX signal input pin Positive power supply (+5 V) 6 µPC7073 2. USE CAUTIONS (1) Combined characteristics of µPC7073 and µPD9903 • The µPC7073 is designed to be used in combination with the µPD9903. Therefore, first half of the electrical characteristics described below are ratings for the µPC7073 as a discrete unit while the second half are combined ratings that include the µPD9903. • Subscriber circuit constants that are determined by factors such as termination impedance are configured to enable setting by external order parameters. Consequently, input of an order that is not suitable for the target impedance may result in failure to obtain the required characteristics. (2) Absolute maximum ratings Application of voltage or current in excess of the absolute maximum ratings may result in damage. Be especially cautious about surges, etc. (3) Load of by-pass capacitor Because the µ PC7073 and µ PD9903 use several internal high-frequency operational amplifiers, high power supply impedance can cause instability (such as oscillation) in these internal operational amplifiers. To suppress such instability and eliminate power supply noise, connect by-pass capacitors (CACOM = a pprox. 0.1 µ F) having superior high frequency characteristics as close as possible to the µ PC7073’s power supply pins (V BB a nd V CC) and the µ PD9903’s power supply pins (AVDD a nd DV DD). (4) Addition of ACOM pin connection capacitor The voltage of the ACOM pin between the µ PC7073 and µ PD9903 is the signal source reference voltage for the µ PC7073. Superposition of noise on this pin may have adverse effects on transmission characteristics. Therefore, make the wires between the ACOM pin and the two LSIs as short as possible, and connect capacitors (C ACOM = a pprox. 0.1 µ F) having superior high frequency characteristics as close as possible to the pins. (5) Overcurrent prevention measures Due to its structure, power to the µ PC7073 must first be supplied to a low-voltage potential (VBB). Accordingly, if power is supplied first to a power supply pin other than VBB, an overcurrent will flow within the µ PC7073 (an overcurrent will not flow if power is input to all power supply pins). Therefore, if feeding to a power supply pin other than VBB f irst, connect an external diode and limiting resistor (rated at several Ω ) in the directions described below. • Reverse-bias direction between VBB pin and VCC pin. • Reverse-bias direction between VBB pin and GND. • Reverse-bias direction between VCC pin and GND. 7 µPC7073 3. 3.1 ELECTRICAL SPECIFICATIONS Discrete unit ratings Absolute maximum ratings (TA = +25 °C) Parameter Power supply voltage Symbol VBB VCC VACOM Input voltage VIN0 VIN1 VIN2 Logic input voltage Relay driver output current Power consumption Ambient operating temperature Storage temperature VIN3 IOL PT TA Conditions Including spike voltage Including spike voltage ACOM pin RX pin TS, RS, TE, and RE pins TTXIN pin BCUT, ALM, PD, RC1, RC2, and RC3 pins RY1, RY2, and RY3 pins Thermal resistance: 160 °C/W, TA = 70 °C Rating –63 to +0.3 –0.3 to +7.0 –0.3 to VCC + 0.3 –0.3 to VCC + 0.3 VBB – 0.3 to VCC + 0.3 To be defined –0.3 to VCC + 0.3 40 1 0 to 70 mA W ˚C Units V Tstg –65 to +150 Caution If the absolute maximum rating for any of the above parameters is exceeded even momentarily, it may adversely affect the quality of this product. In other words, these absolute maximum ratings have been set to prevent physical damage to the product. Do not use the product in such a way as to exceed any of these ratings. Recommended operating conditions Parameter Power supply voltage Symbol VBB VCC VACOM Ambient operating temperature High level input voltage Low level input voltage Digital input rise and fall times TA VIH VIL tR tF RX drive impedance RX-ACOM offset voltage Loop resistance (line resistance + termination resistance) Terminal leakage current during on-hook transmission AC inductive current ION-LEAK f = 60 Hz, 2Pw-Tr Note During loop detection (one line), during ground detection (one line) RL VBB = –51 V 200 Ω × 2 feeding modes 400 Ω × 2 feeding modes 0 0 –0.1 BCUT, ALM, PD, RC1, RC2, and RC3 pins BCUT, ALM, PD, RC1, RC2, and RC3 pins ACOM pin Conditions MIN. –58 4.75 2.38 0 2.0 0 TYP. –48 5.0 2.4 25 MAX. –42 5.25 2.42 70 VCC 0.8 200 200 50 +0.1 1900 1500 8 mA Ω V Ω ns ˚C V Units V Ilong 5.0 mArms Note Pw-Tr is a power transistor for feeding. 8 µPC7073 DC Characteristics (V BB = – 42 to –58 V, VCC = 5 V ± 0 .25 V, T A = 0 t o 70 ˚C, combined characteristics with µ PD9903) Parameter On-hook supply current 1 Symbol IBB1 ICC1 Off-hook supply current 1 IBB2 ICC2 On-hook supply current 2 IBB3 ICC3 Off-hook supply current 2 IBB4 ICC4 Power current during on-hook transmission ICC6 ACOM input current IACOM IBB6 Conditions On-hook, including IPw-Tr Ilong = 0 mA, Note MIN. I L = 0 mA VBB = –48 V VCC = +5 V TYP. 1.9 1 4.3 2.0 2.3 1.3 4.4 2.2 3 2.1 MAX. Units mA Off-hook, not including IPw-Tr Note Ilong = 0 mA, IL = 20 mA VBB = –48 V VCC = +5 V On-hook, including IPw-Tr Note Ilong = 0 mA, IL = 0 m A VBB = –58 V VCC = +5.25 V 2.9 1.7 5.5 2.8 3.9 2.7 +100 +100 16 1.5 mA Off-hook, not including IPw-Tr Note Ilong = 0 mA, IL = 20 mA VBB = –58 V VCC = +5.25 V On-hook, including IPw-Tr Note Ilong = 0 mA, IL = 0 m A VBB = –58 V VCC = +5.25 V ACOM pin On-hook Off-hook –100 –100 8 –16 0 12 1.0 µA RX input current Relay driver input current Relay driver output voltage Digital pin high level input current Digital pin low level input current Control input voltage IRX IIH RX, VRX = 2.4 V VI = 5.0 V For each RC1, RC2, and RC3 pins IOL = 35 mA For each RY1, RY2, and RY3 pins VI = 2.0 V For each BCUT, ALM, PD, RC1, RC2, and RC3 pins VI = 0.0 V For each BCUT, ALM, PD, RC1, RC2, and RC3 pins BCUT : IL = 50 mA → | IL | ≤ 1 mA : IL = 50 mA → – IL × 90 % : IL = 50 mA → | IL | ≤ 20 mA BCUT, IL = 50 mA → – IL × 90 % VOL +1.1 V IIH 0.5 mA IIL 50 µA V 2.0 0.8 180 360 100 200 400 220 440 Ω kΩ DC feed resistance RBF 200 Ω feed 400 Ω feed RL = 1900 Ω AC/DC VBB = –48 V RTE5K/RRE5K = 3.6 kΩ High and wet impedance Ground-fault/power contact drooping current RH&W 12.1 13.1 14.1 mA Note IPw-Tr is the current to the power transistor for feeding. 9 µPC7073 3.2 Combined specifications with µPD9903 DC characteristics µ PC7073 (V BB = – 42 to –58 V, V CC = 5 V ± 0 .25 V, T A = 0 t o 70 ˚C, 18 ≤ I L ≤ I LMAX ( mA)) µ PD9903 (T A = 0 t o 70 ˚C, V DD = 5 V ± 0 .25 V, VDD = VAG = 0 V , f DCLK = 2 048 kHz) Parameter DC feed resistance Symbol RBF 200 Ω feed 400 Ω feed Minimum loop unit ILMIN VBB = –51 V RL = 1900 Ω Maximum current setting ILMAX ILMAX = 76 mA setting 200 Ω feed 400 Ω feed 200 Ω feed 400 Ω feed ILMAX = 45 mA setting ILMAX = 35 mA setting Pin voltage during on-hook VTS Normally on-hook, between Tip and GND, VBB = –48 V Normally on-hook, between Ring and VBB, VBB = –48 V On-hook transmission, between Tip and GND, VBB = –48 V On-hook transmission, between Ring and VBB, VBB = –48 V VBB = –48 V Conditions MIN. 180 360 21.7 18.2 70 50 40 31 2.25 TYP. 200 400 22.2 18.8 76 55 45 35 2.55 MAX. 220 440 22.6 19.3 82 60 50 39 2.85 V mA mA Units Ω VRS 3.05 3.35 3.65 VTS 2.25 2.55 2.85 VRS 3.05 3.35 3.65 Voltage between lines during on-hook Supervisory control – VBB fault voltage VTS VBB – 7.0 VBB – 5.9 VBB – 5.0 V VBBF 32 35 38 V 10 µPC7073 Parameter Loop detection operating resistance (during normal transmission) Loop detection non-operating resistance (during normal transmission) Loop detection operating resistance (during on-hook transmission) Loop detection non-operating resistance (during on-hook transmission) Loop release non-operating resistance Loop release operating resistance Ground detection 1 (C/O) operating resistance Ground detection 1 (C/O) non-operating resistance Ground-fault/power line contact detection operating resistance Ground-fault/power line contact detection nonoperating resistance Ground-fault/power line contact release nonoperating resistance Ground-fault/power line contact release operating resistance RON7 RON6 Includes termination resistance Off-hook stage Includes termination resistance ILMAX = 45/76 mA ILMAX = 35 mA ILMAX = 45/76 mA ILMAX = 35 mA Includes termination resistance 870 1130 1.4 kΩ RON4 RON3 Includes termination resistance RON2 Includes termination resistance Symbol RON1 Conditions Includes termination resistance 200 Ω feed 400 Ω feed 200 Ω feed 400 Ω feed 200 Ω feed 400 Ω feed 200 Ω feed 400 Ω feed 200 Ω feed 400 Ω feed 200 Ω feed 400 Ω feed Includes termination resistance 20 Ω 4540 4140 5.2 kΩ MIN. TYP. MAX. 2500 2100 Units Ω 3900 3500 Ω 1900 1500 2840 2440 Ω 2960 2560 340 480 Ω 10 Note The above values are resistance-converted values. 11 µPC7073 Transmission Characteristics µPC7073 (VBB = –42 to –58 V, VCC = 5 V ± 0.25 V, TA = 0 to 70 ˚C, 18 ≤ IL ≤ ILMAX (mA)) µPD9903 (TA = 0 to 70 ˚C, VDD = 5 V ± 0.25 V, VDG= VAG = 0 V, fDCLK = 2048 kHz) Parameter Insertion loss Symbol IL Conditions A-D input signal 0 dBm0 1 kHz D-A input signal 0 dBm0 1 kHz Transfer loss frequency characteristics FRX A-D Reference input signal 1015 Hz 0 dBm0 60 200 300 400 to 3000 3200 3400 60 200 300 400 to 3000 3200 3400 Hz Hz Hz Hz Hz Hz Hz Hz Hz Hz Hz Hz MIN. –0.45 TYP. 0.0 MAX. +0.45 Units dB –0.45 0.0 +0.45 24.0 0.6 –0.15 –0.15 –0.15 0.2 0.2 0.1 –0.15 –0.15 –0.15 0.2 –0.2 –0.5 –1.0 – 2.0 +0.21 +0.15 +0.65 0.8 4.0 1.0 +0.25 +0.15 +0.65 0.8 +0.2 +0.5 +1.0 dB FRR D-A Reference input signal 1015 Hz 0 dBm0 Gain tracking (tone method) GTX A-D Reference input signal –10 dBm0 f = 700 to 1100 Hz D-A Reference input signal –10 dBm0 f = 700 to 1100 Hz Input signal 0 dBm0 ZT = 600 Ω + 2.16 µF +3 to –40 dBm0 –50 dBm0 –55 dBm0 dB GTR +3 to –40 dBm0 –50 dBm0 –55 dBm0 –0.2 –0.4 –0.8 +0.2 +0.4 +0.8 Return loss RL 300 Hz 500 to 2000 Hz 2000 to 3400 Hz 300 Hz 500 to 2500 Hz 3400 Hz +3 to –30 dBm0 –40 dBm0 –45 dBm0 +3 to –30 dBm0 –40 dBm0 –45 dBm0 16 20 16 18 22 18 36 30 25 36 30 25 dB Echo attenuation TBRL Input signal 0 dBm0 ZT = 600 Ω + 2.16 µF dB Transmit channel total power distortion ratio (tone method) SDX A-D Input signal f = 700 to 1100 Hz D-A Input signal f = 700 to 1100 Hz dB SD R 12 µPC7073 Parameter Absolute delay characteristics Absolute delay distortion frequency characteristics Symbol DA Conditions A-A input signal 0 dBm0 MIN. TYP. MAX. 540 Units µs DO A-A 500 Hz 600 HZ 1000 to 2600 Hz 2800 Hz 44.0 1400 700 200 1400 dB Intermodulation (2 Tone) IMD A-D input signal f1, f2: 300 to 3400 Hz –4 to –21 dBm0 Measured signal: 2 × f1 – f2 level (2 × f1 – f2) vs level (f1, f2) D-A input signal f1, f2: 300 to 3400 Hz –4 to –21 dBm0 Measured signal: 2 × f1 – f2 level (2 × f1 – f2) vs level (f1, f2) 44.0 Single frequency noise NSF D-A PAD level set at 0 dB Measured signal up to f = 256 kHz Difference from A-D reference set value Setting value: +7.5 to +3.0 dB +3.0 to –3.5 dB –54 dBm0 Deviation in gain setting for transmit channel ∆DGSX dB –0.2 –0.1 +0.2 +0.1 Gain setting deviation for receive chanel ∆DGSR Difference from D-A reference set value Setting value: 0.0 to –5.0 dB –5.0 to –8.5 dB 2W-4W A-law Psophometric weighted –0.1 –0.2 +0.1 +0.2 –67 23 –76 14 dBm0p dBrnc0 dBm0p dBrnc0 dB Idle circuit noise ICN24 µ-law ICN42 4W-2W C message weighted A-law Psophometric weighted µ-law Line to ground balance attenuation VBB-PSRR (tone method) LB C message weighted 42 48 30 –5 25 5 f = 300 to 600 Hz RF = 50 Ω Relative accuracy = 0.5 % f = 600 to 3400 Hz IL = 20 mA f = 60 to 3400 Hz f = 100 kHz PSRRB dB VCC-PSRR (tone method) PSRRC IL = 20 mA f = 60 to 3400 Hz f = 100 kHz VIN = 6 Vrms VIN = 15 Vrms AC induction noise resistance LFI I L = 0 mA IL = 20 mA 43 20 dBrnc 13 V CC RY1 AVDD DVDD2 SUS T1 TS R R FT Z1(0.5 %, 1 W) D2 Z2 D3 R FR 50 Ω (0.5 %, 1 W) 50 Ω Q1 R TE D1 D4 Q4 3.6 kΩ (1 %, 1 W) 37 T B 38 24 40 42 32 44 45 R RE 3.6 kΩ (1 %, 1 W) RS VBB TTXIN GND2 GND1 CPSR C DC OP IN+ OP IN– AGND SUB DGND1 DGND2 TE T EF TS RS R EF RE RB µPC7073 (BS-LSI) TEST0 TEST1 TEST2 TEST3 T2 TX BIAS RX DC OUT3 DC OUT2 DC OUT1 DC IN1 DC IN2 BCUT ALM PD RC 1 RC 2 RC 3 BB OUT ASCN AGDT DVDD1 BSY RY2 RY3 23 47 31 15 46 36 33 34 – + + C DC – 0.68 µF (10 V) CVBB – C PSR 0.68 µF (50 V) VBB (–48 V) 0.1 µF + (100 V) GG Ring-Trip detector CR RTIN0 RTIN1 14 VCC (+5 V) C VCC 1 µF + (6 V) – R T1 27 4. SYSTEM APPLICATION EXAMPLE USING µPC7073 AND µPD9903 VDD (+5 V) T2 29 48 25 ACOM CVDD –+ C COM RSUS RBSY 0.1 µF 0.1 µF 1 kΩ 1 kΩ (5 V) (6 V) 11 12 13 16 15 37 11 CAC 38 ACOM IN 350.68 µ F (50 V)40 ACOM OUT AIN 9– 39 10 HW X A OUT 1 48 CD IN3 TYPE 2 47 CD IN2 FS 3 46 CD IN1 4 45 DCLK DC OUT1 µPC9903 5 44 DC OUT2 HW R 19 30 (HCS-LSI) BCUT EXD 18 31 ALM 17 32 EXS PD 20 29 RC 1 RST 21 28 RC 2 AUX/MODE 22 27 RC 3 6 43 BB IN 7 42 ASCN 8 41 AGDT CGDT + 36 35 34 33 26 25 – 0.68 µ F (10 V) + 2 kΩ RPULL 23 24 22 21 20 19 18 17 14 HW X TYPE FS DCLK HW R EXD EXS RST AUX/MODE µPC7073 µPC7073 5. PACKAGE DRAWING 48 PIN PLASTIC SHRINK SOP (375 mil) 48 25 detail of lead end 1 A 24 H G 3°+7° –3° I J F C D MM N B E K L P48GT-65-375B-1 NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition. ITEM A B C D E F G H I J K L M N MILLIMETERS 16.21 MAX. 0.63 MAX. 0.65 (T.P.) 0.30 ± 0.10 0.125 ± 0.075 2.0 MAX. 1.7 ± 0.1 10.0 ± 0.3 8.0 ± 0.2 1.0 ± 0.2 0.15+0.10 –0.05 0.5 ± 0.2 0.10 0.10 INCHES 0.639 MAX. 0.025 MAX. 0.026 (T.P.) 0.012+0.004 –0.005 0.005 ± 0.003 0.079 MAX. 0.067 ± 0.004 0.394 +0.012 –0.013 0.315 ± 0.008 0.039+0.009 –0.008 0.006+0.004 –0.002 0.020+0.008 –0.009 0.004 0.004 15 µPC7073 6. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the conditions recommended below. For details of recommended soldering conditions, refer to the information document S emiconductor Device Mounting Technology Manual (C10535E) . For soldering methods and conditions other than those recommended, please contact your NEC sales representative. SURFACE MOUNT TYPE µPC7073GT: 48-pin plastic shrink SOP (375 mil) Recommended Condition Symbol IR35-00-1 Soldering Method Infrared reflow Soldering Conditions Package peak temperature: 235 ˚C Duration: 30 sec. max. (210 ˚C or above) Number of times: 1 Pin temperature: 300 ˚C max. Duration: 3 sec. max. (per side of device) Pin heating – Note For the storage period after unpacking from the dry-pack, storage conditions are max. 25 ˚C, 65 % RH. 16 µPC7073 Notes on Handling Devices against Electrostatic Discharge Caution When handling this device, special care against electrostatic discharge (ESD) must be taken. If a strong ESD is applied to this device, the junction parts of the internal transistors may be destroyed. Therefore, when transporting or storing this device, be sure to use the conductive tray or magazine case in the packing provided by NEC, or use a conductive buffer material or metal case. Also be sure to ground the operator's body and any tools that may enter in contact with the device during assembly processes. Never put or leave the device on a plastic board or table, and do not touch the device pins directly by hand. 17 µPC7073 [MEMO] 18 µPC7073 [MEMO] 19 µPC7073 [MEMO] The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5