NJL5901R-2

NJL5901R-2 COBP PHOTO REFLECTOR GENERAL DESCRIPTION The NJL5901R-2 is the compact surface mount type photo reflector, which is permitted the Lead(Pb)-free reflow soldering (260℃ , 2 Times). The NJL5901R-2 has realized the compact package compared with conventional product/NJL5901AR-1. FEATURES • Miniature, thin package : 1.0mm × 1.4mm × 0.6mm • Pb free solder re-flowing permitted : 260°C, 2times • Built-in visible light cut-off filter APPLICATIONS • Detecting the location of Lens unit for Cellular Phone’s camera module • Detecting the watch hand for radio controlled watch • Detecting the location of CD/DVD optical pickup head • Detecting the rotation of various motors • Paper edge detection and mechanism timing detection of facsimile, copy machine etc ABSOLUTE MAXIMUM RATINGS (Ta=25°C) PARAMETER Emitter Forward Current (Continuous) Reverse Voltage (Continuous) Power Dissipation Detector Collector-Emitter Voltage Emitter-Collector Voltage Collector Current Collector Power Dissipation Coupled Total Power Dissipation Operating Temperature Storage Temperature Reflow Soldering Temperature SYMBOL IF VR PD VCEO VECO IC PC Ptot Topr Tstg Tsol RATINGS 20 6 45 16 6 10 25 60 -30 to +85 -40 to +100 260 UNIT mA V mW V V mA mW mW °C °C °C ELECTRO-OPTICAL CHARACTERISTICS (Ta=25°C) PARAMETER Emitter Forward Voltage Reverse Current Capacitance Detector Dark Current Collector-Emitter Voltage Coupled Output Current*1 Operating Dark Current *2 Rise Time Fall Time SYMBOL VF IR Ct ICEO VCEO IO ICEOD tr tf TEST CONDITION IF=4mA VR=6V VR=0V,f=1MHz VCE=10V IC=100μA IF=4mA,VCE=2V,d=0.7mm IF=4mA,VCE=2V IO=100μA,VCE=2V,RL=1KΩ,d=0.7mm IO=100μA,VCE=2V,RL=1KΩ,d=0.7mm MIN TYP MAX 1.3 10 UNIT V μA pF μA V μA μA μs μs 0.9 — — — 16 — — 25 — 0.2 — — — — 20 20 — 412 5 165 — — — — — *1 Refer to OUTPUT CURRENT TEST CONDITION *2 Iceod may increase according to the periphery situation of the surface mounted product. 28.Jan.2010 Rev.1.2 -1– NJL5901R-2 OUTLINE (typ.) Unit : mm 1.4 (0.05) (0.6) (0.05) 0.45 0.45 0.15 (0.05) A (0.24) E (0.25) 1.0 0.3 (0.25) LED Center (0.34) PTx Center (0.05) K C 0.3 0.6 0.15 0.3 0.6 0.6 Ａ：Ａｎｏｄｅ Ｋ：Ｃａｔｈｏｄｅ Ｃ：Ｃｏｌｌｅｃｔｏｒ Ｅ：Ｅｍｉｔｔｅｒ 0.3 0.3 0.3 PCB Pattern OUTPUT CURRENT TEST CONDITION The infrared signal from LED is reflected at the aluminum surface DARK CURRENT TEST CONDITION Light Sealed Dark Box ( 0.6mm) Aluminum Evaporation Surface 1.3 mm IF IF Io Iceod VCE VCE 28.Jan.2010 Rev.1.2 -2– NJL5901R-2 RESPONSE TIME TEST CONDITION Al evaporation surface Vcc RD INPUT OUTPUT 90% INPUT 50% OUTPUT RL td tr ts tf 10% EDGE RESPONSE TEST CONDITION l=0mm l=0mm LED side LED side 0.7mm Aluminum Evaporation Surface Aluminum Evaporation Surface 0.7mm Direction-X Direction-Y 28.Jan.2010 Rev.1.2 -3– NJL5901R-2 ■ TYPICAL CHARACTERISTCS Power Dissipation vs. Temperature 100 90 80 Power Dissipation P(mW) 70 60 50 40 30 20 Forward Current IF(mA) 50 45 40 35 30 25 20 15 10 Forward Current vs. Temperature Total Power Dissipation Total Power Dissipation Collector Power 10 0 0 20 40 60 80 100 Ambient Temperature Ta(°C) Dissipation 5 0 0 20 40 60 80 100 Ambient Temperature Ta(°C) Forward Voltage vs. Forward Current 100 1.6 Forward Voltage vs. Temperature 1.4 Forward Current IF(mA) Forward Voltage VF(V) IF=20mA 1.2 10 IF=4mA 1 1 0.0 1.0 Forward Voltage VF(V) 2.0 0.8 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta(°C) Dark Current vs. Temperature 1000 10 Operating Dark Current vs. Temperature 10 Operating Dark Current Iceod(μA) 100 Dark Current Iceo(nA) 1 1 VCE=10V IF=4mA , VCE=2V 0.1 0.1 0.01 0.001 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta(°C) 0.01 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta(°C) 28.Jan.2010 Rev.1.2 -4– NJL5901R-2 Output Current vs. Forward Current (Ta=25°C) 1200 1100 1000 900 Output Current Io(μA) 800 700 600 500 400 300 200 100 0 0 2 4 6 8 10 Forward Current IF(mA) 0 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta(°C) Relative Output Current Io/Io(25°C)(%) 100 120 Output Current vs. Temperature 80 60 40 VCE=2V , d=0.7mm 20 IF=4mA , VCE=2V Output Characteristics (Ta=25°C) 1200 1100 1000 900 Output Current Io(μA) 800 700 600 500 400 300 200 100 0 0 1 2 3 4 5 Collector-Emitter Voltage Vce(V) 0.000 0.1 0.500 Vce Saturation (Ta=25°C) IF=10mA IF=8mA Collector-Emitter Voltage Vce(V) 0.400 0.300 Io=400μA Io=300μA Io=200μA IF=6mA 0.200 Io=100μA IF=4mA IF=2mA 0.100 1.0 Forward Current IF(mA) 10.0 Output Current vs. Distance (Ta=25°C) 120 Output Current vs. Edge Distance (Ta=25°C) 120 Relative Output Current Io/Io(max.)(%) 100 Relative Output Current Io/Io(max.)(%) IF=4mA , VCE=2V , d=0.7mm 100 IF=4mA , VCE=2V 80 80 Direction Y 60 60 Direction X 40 40 20 20 0 0 0.5 1 1.5 2 2.5 3 Reflector Distance d(mm) 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Edge Distance l(mm) 28.Jan.2010 Rev.1.2 -5– NJL5901R-2 Spectral Response (Ta=25°C) Emitter 120 120 Spectral Response (Ta=25°C) Detector 100 Relative Response (%) Relative Response (%) 100 IF=4mA 80 VCE=2V 80 tr 60 60 tf 40 40 td 20 20 0 700 800 900 Wavelength λ(nm) 1000 1100 0 500 600 700 900 VCE=2V 800 , Io=100μA Wavelength λ(nm) 1000 Switching Time vs. Load Resistance (Ta=25°C) 100 tf tr Switching Time t(μs) 10 td VCE=2V , Io=100μA 1 ts 0.1 0.1 1 Load Resistance RL(kΩ) 10 Attention: Please be aware that all data in the graph are just for reference and not for guarantee. 28.Jan.2010 Rev.1.2 -6– NJL5901R-2 ■ MOUNTING METHOD NOTE Mounting was evaluated with the following profiles in our company, so there was no problem. However, confirm mounting by the condition of your company beforehand. Mounting: Twice soldering is allowed. ■ INFRARED REFLOW SOLDERING METHOD Recommended reflow soldering procedure f 260°C 230°C 220°C 180°C 150°C e d a : Temperature ramping rate b : Pre-heating temperature time c : Temperature ramping rate d : 220°C or higher time e : 230°C or higher time f : Peak temperature g : Temperature ramping rate : 1 to 4°C/s : 150 to 180°C : 60 to 120s : 1 to 4°C /s : Shorter than 60s : Shorter than 40s : Lower than 260°C : 1 to 6°C /s The temperature of the surface of mold package Room Temp. a b c g (NOTE1) Using reflow furnace with short wave infrared radiation heater such as halogen lamp Regarding temperature profile, please refer to those fo reflow furnace. In this case the resin surface temperature may become higher than lead terminals due to endothermic ally of black colored mold resin. Therefore, please avoid from direct exposure to mold resin. (NOTE2) Other method Such other methods of soldering as dipping the device into melted solder and vapor phase method (VPS) are not appropriate because the body of device will be heated rapidly. Therefore, these are not recommended to apply. (NOTE3) The resin gets softened right after soldering, so, the following care has to be taken Not to contact the lens surface to anything. Not to dip the device into water or any solvents. ■ FLOE SOLDERING METHOD Flow soldering is not possible. ■ IRON SOLDERING METHOD Iron soldering is not possible. 28.Jan.2010 Rev.1.2 -7– NJL5901R-2 ■ CLEANING Avid washing the device after soldering by reflow method. ■ IC STORAGE CONDITIONS AND ITS DURATION (1) Temperature and humidity ranges Pack Sealing Temperature: Humidity: Pack Opening Temperature: Humidity: 5 to 40 [°C] 40 to 80 [%] 5 to 40 [°C] 40 to 60 [%] After opening the bag, solder products within 48h. Avoid a dry environment below 40% because the products are is easily damageable by the electrical discharge. Store the products in the place where it does not create dew with the products due to a sudden change in temperature. (2) When baking, place the reel vertically to avoid load to the side. (3) Do not store the devices in corrosive-gas atmosphere. (4) Do not store the devices in a dusty place. (5) Do not expose the devices to direct rays of the sun. (6) Do not allow external forces or loads to be applied to IC’s. (7) BE careful because affixed label on the reel might be peeled off when baking. ■ BAKING In case of keeping expect above condition be sure to apply baking. (Heat-resistant tape) Baking method: Ta=60°C, 48 to 72h, Three times baking is allowed Ta=100°C, 2 to 6h, Three times baking is allowed ■ STORAGE DURATION Within a year after delivering this device. For the products stored longer than a year, confirm their terminals and solderability before they are used. ■ APPLICATION NOTES (1) Attention in handling Treat not to touch the lens surface. Avoid dust and any other foreign materials on the lens surface such as point, bonding material, etc. Never to apply reverse voltage (VEC) of more than 6V on the photo transistor when measuring the characteristics or adjusting the system. If applied, it causes to lower the sensitivity. When mounting, special care has to be taken on the mounting position and tilting of the device because it is very important to place the device to the optimum position to the object. 28.Jan.2010 Rev.1.2 -8– NJL5901R-2 ■ PACKING SPECIFICATION PACKING DIMENTIONS UNIT : mm Drawing direction Insert direction P2 P0 φ D0 T SYMBOL A B D0 D1 DIMENSION 1.15 ±0.05 1.60 ±0.05 1.50 +0.10 0 REMARKS BOTTOM DIMENSION BOTTOM DIMENSION 0.60 ±0.05 1.75 ±0.10 3.50 ±0.05 4.00 ±0.10 4.00 ±0.10 2.00 ±0.05 0.20 ±0.05 0.76 ±0.05 8.00 ±0.10 5.40 ±0.10 THICKNESS 0.1MAX E E F P0 W1 (TE1) F W P1 P2 T0 T1 W0 W1 B P1 A φ D1 T1 * Carrier tape material : Polycarbonate(antistatic) Cover tape material : Polyester(antistatic) ■ Taping Strength Pull up the cover tape from the carrier tape, and when the opening angle comes around 10 to 15 , and the peeling-off strength is to be within the power of 20 to 70g. ■ Packaging 1) The taped products are to be rolled up on the taping reel as on the drawing. 2) Rolling up specification 2-1) Start rolling : Carrier tape open space more than 20 Pieces. 2-2) End of rolling : Carrier tape open space more than 20 Pieces, and 2 round of reel space at the cover tape only. 3) Taping quantity : 2,000 Pieces 4) Seal off after putting each reels in a damp proof bag with silica gel. SYMBOL DIMENSION φ180 ±1.0 φ60 ±1.0 φ13 ±0.2 φ21 ±0.8 2.0 ±0.5 9.5 ±0.5 14.5 ±0.5 D C E A B C D E W0 W1 [CAUTION] The specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. The application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights. 28.Jan.2010 Rev.1.2 -9–