LMC6008IMX

LMC6008 April 1996 LMC6008 8 Channel Buffer General Description The LMC6008 octal buffer is designed specifically to buffer the multi-level voltages going to the inputs of the integrated circuits The LMC6008 AC characteristics including settling time are specified for a capacitive load of 0 1 mF for this reason The LMC6008 contains 4 high-speed buffers and 4 lowpower buffers The high-speed buffers can provide an output current of at least 250 mA (minimum) and the low-power buffers can provide at least 150 mA (minimum) By including the 2 types of buffers the LMC6008 is able to provide this function while consuming a supply current of only 6 5 mA (maximum) The buffers are a rail-to-rail design which typically swing to within 30 mV of either supply The LMC6008 also contains a standby function which puts the buffer into a high-impedance mode The supply current in the standby mode is a low 500 mA max Also a thermal limit circuit is included to protect the device from overload conditions 8 Channel Buffer Features Y Y Y Y Y Y Y High Output Current High Speed Buffers Low Power Buffers Slew Rate High Speed Buffers Low Power Buffers Settling Time CL e 0 1 mF Wide Input Output Range Supply Voltage Range Supply Current Standby Mode Current 250 mA min 150 mA min 1 7 V ms 0 85V ms 16 ms max 0 1V to VCC b 0 1V min 5V to 16V 6 5 mA max 500 mA Applications Y Y AMLCD voltage buffering Multi-voltage buffering Connection Diagram 24-Pin SO Ordering Information Package Temperature Range NSC Transport b 40 C to a 85 C Drawing Media M24B Rail Reel 24-Pin LMC6008IM Surface Mount LMC6008IMX M24B Tape TL H 12321 – 1 Top View Note Buffers 1 3 5 and 7 are High Speed and Buffers 2 4 6 and 8 are Low Speed C1996 National Semiconductor Corporation TL H 12321 RRD-B30M56 Printed in U S A Absolute Maximum Ratings (Note 1) If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications ESD Tolerance (Note 2) Voltage at Input Pin Voltage at Output Pin Supply Voltage (V a b Vb) Lead Temperature (soldering 10 sec ) Storage Temperature Range Junction Temperature (Note 4) Power Dissipation (Note 4) 2000V Va a Va 0 4V 0 4V a 0 4V V b b 0 4V 16V 260 C b 55 C to a 150 C Operating Ratings (Note 1) Supply Voltage Temperature Range Thermal Resistance (iJA) M Package 24-Pin Surface Mount 4 5V s V a s 16V b 20 C to a 100 C 50 C W Vb b 150 C Internally Limited DC Electrical Characteristics Unless otherwise specified all limits guaranteed for TJ e 25 C VCC e 14 5V and RL e 0 Symbol VOS AV IB ILP Parameter Input Offset Voltage VO e 10 VPP Input Bias Current Peak Load Current Hi Speed Buffers VO e 13 VPP Lo Speed Buffers VO e 13 VPP 35 3 30 1 80 10 10 VSTD-BY e High VIL e Low VIN e 7 25V VSTD-BY e High 5V k VCC k 14 5V 5 65 500 55 01 VCC b 0 1 Conditions RS e 10 kX Typ (Note 5) LMC6008 Limit (Note 6) 25 0 985 300 b 250 a 250 b 150 a 150 Units mV max VV nA max mA max mA min mA max mA min mV max V min V max mA max mA max mA max mA max mA max dB min V min V max ILP Peak Load Current VERR VIH VIL IIH IIL IO (STD-BY) ICC ISTD-BY PSRR VO Output Voltage Difference (Note 9) Standby Logic HIgh Voltage ISTANDBY Logic Low Voltage Standby High Input Current Standby Low Input Current Output Leakage Current Supply Current Standby Current Power Supply Rejection Ratio Voltage Output Swing http www national com 2 AC Electrical Characteristics Unless otherwise specified all limits guaranteed for TJ e 25 C VCC e 14 5V and RL e 0X Symbol SR Parameter Slew Rate Conditions Buffers 1 3 5 7 (Note 3) Buffers 2 4 6 8 (Note 3) tS tON tOFF PBW Settling Time Standby Response Time ON Standby Response Time OFF Power Bandwidth VO e 10 VPP for Hi-Speed VO e 5 VPP for Lo-Speed (Note 3) (Notes 3 7) Typ (Note 5) LMC6008 Limit (Note 6) 1 70 0 85 16 10 10 45 01 Units V ms min V ms min ms max ms max ms max KHz min mF max CL Load Capacitance Note 1 Absolute Maximum Ratings indicate limits beyond which damage to the device may occur Operating ratings indicate conditions for which the device is intended to be functional but specific performance is not guaranteed For guaranteed specifications and the test conditions see the Electrical Characteristics Note 2 Human body model 1 5 kX in series with 100 pF Note 3 The Load is a series connection of a 0 1 mF capacitor and a 1X resistor Note 4 The maximum power dissipation is a function of TJ(max) iJA and TA The maximum allowable power dissipation at any ambient temperature is PD e (TJ(max) b TA) iJA where the junction-to-ambient thermal resistance iJA e 50 C W If the maximum allowable power dissipation is exceeded the thermal limit circuit will limit the die temperature to approximately 160 C All numbers apply for packages soldered directly into a PC board Note 5 Typical Values represent the most likely parametric norm Note 6 All limits are guaranteed by testing or statistical analysis Note 7 The settling time is measured from the input transition to a point 50 mV of the final value for both rising and falling transitions The input swing is 0 5V to 13 5V for buffers 1 3 5 7 and 3 75V to 10 25V for buffers 2 4 6 8 Input rise time should be less than 1 ms Note 8 High-Speed Buffers are 1 3 5 7 and Low-Speed Buffers are 2 4 6 8 Note 9 Output Voltage Difference is the difference between the highest and lowest buffer output voltage when all buffer inputs are at identical voltages 3 http www national com 8 Channel Buffer LMC6008 Physical Dimensions inches (millimeters) unless otherwise noted 24-Lead (3 00 Wide) Small Outline Molded Package (M) Order Number LMC6008IM or LMC6008IMX NS Package Number M24B LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user National Semiconductor Corporation 1111 West Bardin Road Arlington TX 76017 Tel 1(800) 272-9959 Fax 1(800) 737-7018 2 A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness http www national com National Semiconductor Europe Fax a49 (0) 180-530 85 86 Email europe support nsc com Deutsch Tel a49 (0) 180-530 85 85 English Tel a49 (0) 180-532 78 32 Fran ais Tel a49 (0) 180-532 93 58 Italiano Tel a49 (0) 180-534 16 80 National Semiconductor Hong Kong Ltd 13th Floor Straight Block Ocean Centre 5 Canton Rd Tsimshatsui Kowloon Hong Kong Tel (852) 2737-1600 Fax (852) 2736-9960 National Semiconductor Japan Ltd Tel 81-043-299-2308 Fax 81-043-299-2408 National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications