74AHC1GU04

74AHC1GU04 Inverter Rev. 05 — 10 July 2007 Product data sheet 1. General description The 74AHC1GU04 is a high-speed Si-gate CMOS device. It provides an inverting single stage function. 2. Features I I I I I Symmetrical output impedance High noise immunity Low power dissipation Balanced propagation delays ESD protection: N HBM JESD22-A114E: exceeds 2000 V N MM JESD22-A115-A: exceeds 200 V N CDM JESD22-C101C: exceeds 1000 V I Specified from −40 °C to +125 °C 3. Ordering information Table 1. Ordering information Package Temperature range 74AHC1GU04GW 74AHC1GU04GV −40 °C to +125 °C −40 °C to +125 °C Name TSSOP5 SC-74A Description plastic thin shrink small outline package; 5 leads; body width 1.25 mm plastic surface-mounted package; 5 leads Version SOT353-1 SOT753 Type number 4. Marking Table 2. Marking codes Marking AD AU4 Type number 74AHC1GU04GW 74AHC1GU04GV NXP Semiconductors 74AHC1GU04 Inverter 5. Functional diagram 2 A Y 4 2 1 mna044 4 A Y mna045 mna043 Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram 6. Pinning information 6.1 Pinning 74AHC1GU04 n.c. A 1 2 5 VCC GND 3 001aaf099 4 Y Fig 4. Pin configuration 6.2 Pin description Table 3. Symbol n.c. A GND Y VCC Pin description Pin 1 2 3 4 5 Description not connected data input ground (0 V) data output supply voltage 7. Functional description Table 4. Function table H = HIGH voltage level; L = LOW voltage level Input A L H Output Y H L 74AHC1GU04_5 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 — 10 July 2007 2 of 12 NXP Semiconductors 74AHC1GU04 Inverter 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC IIK VI IOK IO ICC IGND Tstg Ptot [1] [2] Parameter supply voltage input clamping current input voltage output clamping current output current supply current ground current storage temperature total power dissipation Conditions VI < −0.5 V [1] Min −0.5 −20 −0.5 −75 −65 Max +7.0 +7.0 ±20 ±25 75 +150 250 Unit V mA V mA mA mA mA °C mW VO < −0.5 V or VO > VCC + 0.5 V −0.5 V < VO < VCC + 0.5 V Tamb = −40 °C to +125 °C [2] - The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For both TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K. 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC VI VO Tamb ∆t/∆V supply voltage input voltage output voltage ambient temperature input transition rise and fall rate VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V Conditions Min 2.0 0 0 −40 Typ 5.0 +25 Max 5.5 5.5 VCC +125 100 20 Unit V V V °C ns/V ns/V 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol VIH Parameter HIGH-level input voltage Conditions Min VCC = 2.0 V VCC = 3.0 V VCC = 5.5 V VIL LOW-level input voltage VCC = 2.0V VCC = 3.0 V VCC = 5.5 V 1.7 2.4 4.4 25 °C Typ Max 0.3 0.6 1.1 −40 °C to +85 °C −40 °C to +125 °C Unit Min 1.7 2.4 4.4 Max 0.3 0.6 1.1 Min 1.7 2.4 4.4 Max 0.3 0.6 1.1 V V V V V V 74AHC1GU04_5 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 — 10 July 2007 3 of 12 NXP Semiconductors 74AHC1GU04 Inverter Table 7. Static characteristics …continued Voltages are referenced to GND (ground = 0 V). Symbol VOH Parameter Conditions Min HIGH-level VI = VIH or VIL output voltage IO = −50 µA; VCC = 2.0 V IO = −50 µA; VCC = 3.0 V IO = −50 µA; VCC = 4.5 V IO = −4.0 mA; VCC = 3.0 V IO = −8.0 mA; VCC = 4.5 V VOL LOW-level VI = VIH or VIL output voltage IO = 50 µA; VCC = 2.0 V IO = 50 µA; VCC = 3.0 V IO = 50 µA; VCC = 4.5 V IO = 4.0 mA; VCC = 3.0 V IO = 8.0 mA; VCC = 4.5 V II ICC CI input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V 1.9 2.9 4.4 2.58 3.94 25 °C Typ 2.0 3.0 4.5 0 0 0 1.5 Max 0.1 0.1 0.1 0.36 0.36 0.1 1.0 10 −40 °C to +85 °C −40 °C to +125 °C Unit Min 1.9 2.9 4.4 2.48 3.8 Max 0.1 0.1 0.1 0.44 0.44 1.0 10 10 Min 1.9 2.9 4.4 2.40 3.70 Max 0.1 0.1 0.1 0.55 0.55 2.0 40 10 V V V V V V V V V V µA µA pF supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V input capacitance 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 0 V; tr = tf = ≤ 3.0 ns. For test circuit see Figure 6. Symbol tpd Parameter propagation delay Conditions Min A to Y; see Figure 5 VCC = 3.0 V to 3.6 V CL = 15 pF CL = 50 pF VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF CPD power dissipation capacitance per buffer; VI = GND to VCC [4] [3] [1] [2] 25 °C Typ Max −40 °C to +85 °C −40 °C to +125 °C Unit Min Max Min Max - 3.4 4.9 2.6 3.6 14 7.1 10.6 5.5 7.0 - 1.0 1.0 1.0 1.0 - 8.5 12.0 6.0 8.0 - 1.0 1.0 1.0 1.0 - 10.0 13.5 7.0 9.0 - ns ns ns ns pF [1] [2] [3] [4] tpd is the same as tPLH and tPHL. Typical values are measured at VCC = 3.3 V. Typical values are measured at VCC = 5.0 V. CPD is used to determine the dynamic power dissipation PD (µW). PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where: fi = input frequency in MHz; © NXP B.V. 2007. All rights reserved. 74AHC1GU04_5 Product data sheet Rev. 05 — 10 July 2007 4 of 12 NXP Semiconductors 74AHC1GU04 Inverter fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts. 12. Waveforms A input VM(1) VI VCC tPHL tPLH PULSE GENERATOR VO DUT RT CL 50 pF Y output VM(1) mna046 mna034 VM = 0.5 × VCC; VI = GND to VCC. Test data is given in Table 8. Definitions for test circuit: CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. Fig 5. The input (A) to output (Y) propagation delay times Fig 6. Load circuitry for switching times 13. Typical transfer characteristics mna397 mna398 2.0 VO (V) 1.6 VO 1.0 ICC (mA) 0.8 3.0 VO (V) VO 10 ICC (mA) 8 1.2 0.6 1.5 6 0.8 0.4 4 ID (drain current) 0.4 ID (drain current) 0.2 2 0 0 0.4 0.8 1.2 1.6 VI (V) 0 2.0 0 0 1 2 3 0 VI (V) Fig 7. VCC = 2.0 V; IO = 0 A Fig 8. VCC = 3.0 V; IO = 0 A 74AHC1GU04_5 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 — 10 July 2007 5 of 12 NXP Semiconductors 74AHC1GU04 Inverter mna399 6 VO (V) VO 50 ICC (mA) 40 Rbias = 560 kΩ VCC 30 3 20 ID (drain current) 10 VI (f = 1 kHz) 0.47 µF input output 100 µF A IO GND mna050 0 0 2 4 VI (V) 6 0 Fig 9. VCC = 5.5 V; IO = 0 A Fig 10. Test set-up for measuring forward transconductance gfs = ∆IO/∆VI at VO is constant 40 gfs (mA/V) 30 mna400 20 10 0 0 2 4 VCC (V) 6 Fig 11. Typical forward transconductance gfs as a function of the supply voltage at Tamb = 25 °C 14. Application information Some applications are: • Linear amplifier (see Figure 12) • In crystal oscillator design (see Figure 13) Remark: All values given are typical unless otherwise specified. 74AHC1GU04_5 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 — 10 July 2007 6 of 12 NXP Semiconductors 74AHC1GU04 Inverter R2 R1 VCC 1 µF R1 R2 U04 ZL U04 C1 C2 out mna052 mna053 Maximum Vo(p-p) = VCC − 1.5 V centered at 0.5 × VCC. C1 = 47 pF (typ.) C2 = 22 pF (typ.) R1 = 1 MΩ to 10 MΩ (typ.) R2 optimum value depends on the frequency and required stability against changes in VCC or average minimum ICC (ICC is typically 2 mA at VCC = 3 V and f = 1 MHz). G ol G v = – --------------------------------------R1 1 + ------ ( 1 + G ol ) R2 Gol = open loop gain Gv = voltage gain R1 ≥ 3 kΩ, R2 ≤ 1 MΩ ZL > 10 kΩ; Gol = 20 (typ.) Typical unity gain bandwidth product is 5 MHz. Fig 12. Used as a linear amplifier Fig 13. Crystal oscillator configuration Table 9. External components for resonator (f < 1 MHz) All values given are typical and must be used as an initial set-up. Frequency 10 kHz to 15.9 kHz 16 kHz to 24.9 kHz 25 kHz to 54.9 kHz 55 kHz to 129.9 kHz 130 kHz to 199.9 kHz 200 kHz to 349.9 kHz 350 kHz to 600 kHz Table 10. Frequency 3 kHz 6 kHz 10 kHz 14 kHz >14 kHz Optimum value for R2 R2 2.0 kΩ 8.0 kΩ 1.0 kΩ 4.7 kΩ 0.5 kΩ 2.0 kΩ 0.5 kΩ 1.0 kΩ Optimum for minimum required ICC minimum influence due to change in VCC minimum required ICC minimum influence by VCC minimum required ICC minimum influence by VCC minimum required ICC minimum influence by VCC replace R2 by C3 with a typical value of 35 pF R1 22 MΩ 22 MΩ 22 MΩ 22 MΩ 22 MΩ 22 MΩ 22 MΩ R2 220 kΩ 220 kΩ 100 kΩ 100 kΩ 47 kΩ 47 kΩ 47 kΩ C1 56 pF 56 pF 56 pF 47 pF 47 pF 47 pF 47 pF C2 20 pF 10 pF 10 pF 5 pF 5 pF 5 pF 5 pF 74AHC1GU04_5 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 — 10 July 2007 7 of 12 NXP Semiconductors 74AHC1GU04 Inverter 15. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 D E A X c y HE vMA Z 5 4 A2 A1 (A3) θ A 1 e e1 bp 3 wM detail X Lp L 0 1.5 scale 3 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.1 0 A2 1.0 0.8 A3 0.15 bp 0.30 0.15 c 0.25 0.08 D(1) 2.25 1.85 E(1) 1.35 1.15 e 0.65 e1 1.3 HE 2.25 2.0 L 0.425 Lp 0.46 0.21 v 0.3 w 0.1 y 0.1 Z(1) 0.60 0.15 θ 7° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 REFERENCES IEC JEDEC MO-203 JEITA SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19 Fig 14. Package outline SOT353-1 (TSSOP5) 74AHC1GU04_5 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 — 10 July 2007 8 of 12 NXP Semiconductors 74AHC1GU04 Inverter Plastic surface-mounted package; 5 leads SOT753 D B E A X y HE vMA 5 4 Q A A1 c 1 2 3 detail X Lp e bp wM B 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 0.100 0.013 bp 0.40 0.25 c 0.26 0.10 D 3.1 2.7 E 1.7 1.3 e 0.95 HE 3.0 2.5 Lp 0.6 0.2 Q 0.33 0.23 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT753 REFERENCES IEC JEDEC JEITA SC-74A EUROPEAN PROJECTION ISSUE DATE 02-04-16 06-03-16 Fig 15. Package outline SOT753 (SC-74A) 74AHC1GU04_5 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 — 10 July 2007 9 of 12 NXP Semiconductors 74AHC1GU04 Inverter 16. Abbreviations Table 11. Acronym CDM DUT ESD HBM MM Abbreviations Description Charged Device Model Device Under Test ElectroStatic Discharge Human Body Model Machine Model 17. Revision history Table 12. Revision history Release date 20070710 Data sheet status Product data sheet Change notice Supersedes 74AHC1GU04_4 Document ID 74AHC1GU04_5 Modifications: • • • • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Package SOT353 changed to SOT353-1 in Section 3 and Section 15. Quick reference data and Soldering sections removed. Product specification Product specification Product specification Product specification 74AHC1GU04_3 74AHC1GU04_2 74AHC1GU04_1 - 74AHC1GU04_4 74AHC1GU04_3 74AHC1GU04_2 74AHC1GU04_1 20020528 20020215 20010427 19990519 74AHC1GU04_5 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 — 10 July 2007 10 of 12 NXP Semiconductors 74AHC1GU04 Inverter 18. Legal information 18.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 18.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com 74AHC1GU04_5 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 — 10 July 2007 11 of 12 NXP Semiconductors 74AHC1GU04 Inverter 20. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional description . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 3 Static characteristics. . . . . . . . . . . . . . . . . . . . . 3 Dynamic characteristics . . . . . . . . . . . . . . . . . . 4 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Typical transfer characteristics . . . . . . . . . . . . 5 Application information. . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 10 July 2007 Document identifier: 74AHC1GU04_5