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74AHCT3G14GD,125

74AHCT3G14GD,125

  • 厂商:

    NXP(恩智浦)

  • 封装:

    XFDFN8

  • 描述:

    INVERTER, AHCT/VHCT/VT SERIES, 3

  • 数据手册
  • 价格&库存
74AHCT3G14GD,125 数据手册
74AHC3G14; 74AHCT3G14 Triple inverting Schmitt trigger Rev. 8 — 13 May 2013 Product data sheet 1. General description 74AHC3G14 and 74AHCT3G14 are high-speed Si-gate CMOS devices. They provide three inverting buffers with Schmitt trigger action. These devices are capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V. The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V. 2. Features and benefits  Symmetrical output impedance  High noise immunity  ESD protection:  HBM JESD22-A114F exceeds 2000 V  MM JESD22-A115-A exceeds 200 V  CDM JESD22-C101D exceeds 1000 V  Low power dissipation  Balanced propagation delays  Multiple package options  Specified from 40 C to +85 C and 40 C to +125 C 3. Applications  Wave and pulse shaper for highly noisy environment  Astable multivibrator  Monostable multivibrator 74AHC3G14; 74AHCT3G14 NXP Semiconductors Triple inverting Schmitt trigger 4. Ordering information Table 1. Ordering information Type number Package 74AHC3G14DP Temperature range Name Description Version 40 C to +125 C TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 40 C to +125 C VSSOP8 plastic very thin shrink small outline package; 8 leads; SOT765-1 body width 2.3 mm 40 C to +125 C XSON8 plastic extremely thin small outline package; no leads; SOT833-1 8 terminals; body 1  1.95  0.5 mm 40 C to +125 C XSON8 plastic extremely thin small outline package; no leads; SOT996-2 8 terminals; body 3  2  0.5 mm 74AHCT3G14DP 74AHC3G14DC 74AHCT3G14DC 74AHC3G14GT 74AHCT3G14GT 74AHC3G14GD 74AHCT3G14GD 5. Marking Table 2. Marking codes Type number Marking code[1] 74AHC3G14DP A14 74AHCT3G14DP C14 74AHC3G14DC A14 74AHCT3G14DC C14 74AHC3G14GT A14 74AHCT3G14GT C14 74AHC3G14GD A14 74AHCT3G14GD C14 [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 6. Functional diagram 1A 1Y 3Y 3A 2A 2Y A mna025 001aah728 Fig 1. Logic symbol 74AHC_AHCT3G14 Product data sheet Y 001aah729 Fig 2. IEC logic symbol All information provided in this document is subject to legal disclaimers. Rev. 8 — 13 May 2013 Fig 3. Logic diagram (one Schmitt trigger) © NXP B.V. 2013. All rights reserved. 2 of 19 74AHC3G14; 74AHCT3G14 NXP Semiconductors Triple inverting Schmitt trigger 7. Pinning information 7.1 Pinning 74AHC3G14 74AHCT3G14 1A 1 8 VCC 3Y 2 7 1Y 2A 3 6 3A GND 4 5 2Y 74AHC3G14 74AHCT3G14 1A 1 8 VCC 3Y 2 7 1Y 2A 3 6 3A GND 4 5 2Y 001aai259 001aam630 Transparent top view Fig 4. Pin configuration SOT505-2 and SOT765-1 Fig 5. Pin configuration SOT833-1 74AHC3G14 74AHCT3G14 1A 1 8 VCC 3Y 2 7 1Y 2A 3 6 3A GND 4 5 2Y 001aai260 Transparent top view Fig 6. Pin configuration SOT996-2 7.2 Pin description Table 3. Pin description Symbol Pin Description 1A, 2A, 3A 1, 3, 6 data input GND 4 ground (0 V) 1Y, 2Y, 3Y 7, 5, 2 data output VCC 8 supply voltage 74AHC_AHCT3G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 13 May 2013 © NXP B.V. 2013. All rights reserved. 3 of 19 74AHC3G14; 74AHCT3G14 NXP Semiconductors Triple inverting Schmitt trigger 8. Functional description Function table [1] Table 4. Input nA Output nY L H H L [1] H = HIGH voltage level; L = LOW voltage level 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Min Max Unit VCC supply voltage Conditions 0.5 +7.0 V VI input voltage 0.5 +7.0 V IIK input clamping current VI < 0.5 V 20 - mA IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V IO output current 0.5 V < VO < VCC + 0.5 V - 20 mA - 25 mA ICC supply current - 75 mA IGND ground current 75 - mA Tstg storage temperature 65 +150 C Ptot total power dissipation - 250 mW [1] [2] [1] Tamb = 40 C to +125 C [2] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For TSSOP8 package: above 55 C the value of Ptot derates linearly at 2.5 mW/K. For VSSOP8 package: above 110 C the value of Ptot derates linearly at 8 mW/K. For XSON8 packages: above 118 C the value of Ptot derates linearly with 7.8 mW/K. 10. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage VI input voltage VO output voltage Tamb ambient temperature 74AHC_AHCT3G14 Product data sheet Conditions 74AHC3G14 74AHCT3G14 Unit Min Typ Max Min Typ Max 2.0 5.0 5.5 4.5 5.0 5.5 V 0 - 5.5 0 - 5.5 V 0 - VCC 0 - VCC V 40 +25 +125 40 +25 +125 C All information provided in this document is subject to legal disclaimers. Rev. 8 — 13 May 2013 © NXP B.V. 2013. All rights reserved. 4 of 19 74AHC3G14; 74AHCT3G14 NXP Semiconductors Triple inverting Schmitt trigger 11. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 C Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max HIGH-level VI = VT+ or VT output voltage IO = 50 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = 50 A; VCC = 3.0 V 2.9 3.0 - 2.9 - 2.9 - V IO = 50 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = 4.0 mA; VCC = 3.0 V 2.58 - - 2.48 - 2.40 - V IO = 8.0 mA; VCC = 4.5 V 3.94 - - 3.8 - 3.70 - V LOW-level VI = VT+ or VT output voltage IO = 50 A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 A; VCC = 3.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 3.0 V - - 0.36 - 0.44 - 0.55 V IO = 8.0 mA; VCC = 4.5 V - - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 A 74AHC3G14 VOH VOL II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.0 - 10 - 40 A CI input capacitance - 1.5 10 - 10 - 10 pF 4.4 4.5 - 4.4 - 4.4 - V 3.94 - - 3.8 - 3.70 - V 74AHCT3G14 VOH HIGH-level VI = VT+ or VT; VCC = 4.5 V output voltage IO = 50 A IO = 8.0 mA VOL LOW-level VI = VT+ or VT; VCC = 4.5 V output voltage IO = 50 A IO = 8.0 mA 0 0.1 - 0.1 - 0.1 V - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 A II input leakage current ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.0 - 10 - 40 A ICC additional per input pin; VI = 3.4 V; supply current other inputs at VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.35 - 1.5 - 1.5 mA CI input capacitance - 1.5 10 - 10 - 10 pF 74AHC_AHCT3G14 Product data sheet VI = 5.5 V or GND; VCC = 0 V to 5.5 V - All information provided in this document is subject to legal disclaimers. Rev. 8 — 13 May 2013 © NXP B.V. 2013. All rights reserved. 5 of 19 74AHC3G14; 74AHCT3G14 NXP Semiconductors Triple inverting Schmitt trigger 11.1 Transfer characteristics Table 8. Transfer characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). See Figure 9 and Figure 10. Symbol Parameter 25 C Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max VCC = 3.0 V - - 2.2 - 2.2 - 2.2 V VCC = 4.5 V - - 3.15 - 3.15 - 3.15 V VCC = 5.5 V - - 3.85 - 3.85 - 3.85 V VCC = 3.0 V 0.9 - - 0.9 - 0.9 - V VCC = 4.5 V 1.35 - - 1.35 - 1.35 - V VCC = 5.5 V 1.65 - - 1.65 - 1.65 - V VCC = 3.0 V 0.3 - 1.2 0.3 1.2 0.25 1.2 V VCC = 4.5 V 0.4 - 1.4 0.4 1.4 0.35 1.4 V VCC = 5.5 V 0.5 - 1.6 0.5 1.6 0.45 1.6 V VCC = 4.5 V - - 2.0 - 2.0 - 2.0 V VCC = 5.5 V - - 2.0 - 2.0 - 2.0 V negative-going threshold voltage VCC = 4.5 V 0.5 - - 0.5 - 0.5 - V VCC = 5.5 V 0.6 - - 0.6 - 0.6 - V hysteresis voltage VCC = 4.5 V 0.4 - 1.4 0.4 1.4 0.35 1.4 V VCC = 5.5 V 0.4 - 1.6 0.4 1.6 0.35 1.6 V 74AHC3G14 VT+ VT VH positive-going threshold voltage negative-going threshold voltage hysteresis voltage 74AHCT3G14 VT+ VT VH positive-going threshold voltage 12. Dynamic characteristics Table 9. Dynamic characteristics GND = 0 V; tr = tf  3.0 ns; for test circuit see Figure 8. Symbol Parameter 25 C Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max CL = 15 pF - 4.2 12.8 1.0 15.0 1.0 16.5 ns CL = 50 pF - 6.0 16.3 1.0 18.5 1.0 20.5 ns - 3.2 8.6 1.0 10.0 1.0 11.0 ns - 4.6 10.6 1.0 12.0 1.0 13.5 ns - 10 - - - - - pF 74AHC3G14 tpd propagation delay nA to nY; see Figure 7 [1] VCC = 3.0 V to 3.6 V [2] VCC = 4.5 V to 5.5 V [3] CL = 15 pF CL = 50 pF CPD power dissipation capacitance 74AHC_AHCT3G14 Product data sheet per buffer; CL = 50 pF; fi = 1 MHz; VI = GND to VCC [4] All information provided in this document is subject to legal disclaimers. Rev. 8 — 13 May 2013 © NXP B.V. 2013. All rights reserved. 6 of 19 74AHC3G14; 74AHCT3G14 NXP Semiconductors Triple inverting Schmitt trigger Table 9. Dynamic characteristics …continued GND = 0 V; tr = tf  3.0 ns; for test circuit see Figure 8. Symbol Parameter 25 C Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max - 4.1 7.0 1.0 8.0 1.0 9.0 ns - 5.9 8.5 1.0 10.0 1.0 11.0 ns - 12 - - - - - pF 74AHCT3G14 propagation delay tpd [1] nA to nY; VCC = 4.5 V to 5.5 V [3] CL = 15 pF CL = 50 pF power dissipation capacitance CPD [4] per buffer; CL = 50 pF; fi = 1 MHz; VI = GND to VCC [1] tpd is the same as tPLH and tPHL. [2] Typical values are measured at VCC = 3.3 V. [3] Typical values are measured at VCC = 5.0 V. [4] CPD is used to determine the dynamic power dissipation PD (W). PD = CPD  VCC2  fi +  (CL  VCC2  fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; (CL  VCC2  fo) = sum of the outputs. 13. Waveforms A input VM VCC tPHL Y output tPLH PULSE GENERATOR VM VI VO DUT RT mna033 CL mna101 The test data is given in Table 10 Test data is given in Table 10. Definitions for test circuit: CL = Load capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. Fig 7. The input (nA) to output (nY) propagation delays Table 10. Fig 8. Test circuit for measuring switching times Test data Type number Input VI VM VM 74AHC3G14 GND to VCC 0.5  VCC 0.5  VCC 74AHCT3G14 GND to 3.0 V 1.5 V 0.5  VCC 74AHC_AHCT3G14 Product data sheet Output All information provided in this document is subject to legal disclaimers. Rev. 8 — 13 May 2013 © NXP B.V. 2013. All rights reserved. 7 of 19 74AHC3G14; 74AHCT3G14 NXP Semiconductors Triple inverting Schmitt trigger 13.1 Transfer characteristic waveforms VO VT+ VI VH VT− VH VT− Fig 9. VO VI VT+ mna027 mna026 Transfer characteristic Fig 10. The definitions of VT+, VT and VH mna401 1.5 mna402 5 ICC (mA) ICC (mA) 4 1 3 2 0.5 1 0 0 0 1 2 VI (V) 3 0 VCC = 3.0 V. Product data sheet 2 3 4 V (V) 5 I VCC = 4.5 V. Fig 11. Typical 74AHC3G14 transfer characteristics 74AHC_AHCT3G14 1 Fig 12. Typical 74AHC3G14 transfer characteristics All information provided in this document is subject to legal disclaimers. Rev. 8 — 13 May 2013 © NXP B.V. 2013. All rights reserved. 8 of 19 74AHC3G14; 74AHCT3G14 NXP Semiconductors Triple inverting Schmitt trigger mna403 8 ICC (mA) 6 4 2 0 0 2 4 VI (V) 6 VCC = 5.5 V. Fig 13. Typical 74AHC3G14 transfer characteristics mna404 5 mna405 8 ICC (mA) ICC (mA) 4 6 3 4 2 2 1 0 0 0 1 2 3 4 V (V) 5 I 0 VCC = 4.5 V. Product data sheet 4 VI (V) 6 VCC = 5.5 V. Fig 14. Typical 74AHCT3G14 transfer characteristics 74AHC_AHCT3G14 2 Fig 15. Typical 74AHCT3G14 transfer characteristics All information provided in this document is subject to legal disclaimers. Rev. 8 — 13 May 2013 © NXP B.V. 2013. All rights reserved. 9 of 19 74AHC3G14; 74AHCT3G14 NXP Semiconductors Triple inverting Schmitt trigger 14. Application information The slow input rise and fall times cause additional power dissipation, which can be calculated using the following formula: Padd = fi  (tr  ICC(AV) + tf  ICC(AV))  VCC where: Padd = additional power dissipation (W); fi = input frequency (MHz); tr = input rise time (ns); 10 % to 90 %; tf = input fall time (ns); 90 % to 10 %; ICC(AV) = average additional supply current (A). ICC(AV) differs with positive or negative input transitions, as shown in Figure 16 and Figure 17. For 74AHC3G14 and 74AHCT3G14 used in relaxation oscillator circuit, see Figure 18. Note to the application information: 1. All values given are typical unless otherwise specified. mna036 200 mna058 200 ΔICC(AV) (μA) ΔICC(AV) (μA) 150 150 positive-going edge positive-going edge 100 100 50 50 negative-going edge negative-going edge 0 0 0 2.0 4.0 VCC (V) 0 6.0 Linear change of VI between 0.1VCC to 0.9VCC Fig 16. Average additional ICC for 74AHC3G14 Schmitt trigger devices 74AHC_AHCT3G14 Product data sheet 2 4 VCC (V) 6 Linear change of VI between 0.1VCC to 0.9VCC Fig 17. Average additional ICC for 74AHCT3G14 Schmitt trigger devices All information provided in this document is subject to legal disclaimers. Rev. 8 — 13 May 2013 © NXP B.V. 2013. All rights reserved. 10 of 19 74AHC3G14; 74AHCT3G14 NXP Semiconductors Triple inverting Schmitt trigger R C mna035 For 74AHC3G14: For 74AHCT3G14: 1 1 f = ---  -----------------------T 0.55  RC 1 1 f = ---  -----------------------T 0.60  RC Fig 18. Relaxation oscillator using the 74AHC3G14 and 74AHCT3G14 74AHC_AHCT3G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 13 May 2013 © NXP B.V. 2013. All rights reserved. 11 of 19 74AHC3G14; 74AHCT3G14 NXP Semiconductors Triple inverting Schmitt trigger 15. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm D E A SOT505-2 X c HE y v M A Z 5 8 A A2 (A3) A1 pin 1 index θ Lp L 1 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.00 0.95 0.75 0.25 0.38 0.22 0.18 0.08 3.1 2.9 3.1 2.9 0.65 4.1 3.9 0.5 0.47 0.33 0.2 0.13 0.1 0.70 0.35 8° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16 --- Fig 19. Package outline SOT505-2 (TSSOP8) 74AHC_AHCT3G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 13 May 2013 © NXP B.V. 2013. All rights reserved. 12 of 19 74AHC3G14; 74AHCT3G14 NXP Semiconductors Triple inverting Schmitt trigger VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index (A3) θ Lp 1 4 e L detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z(1) θ mm 1 0.15 0.00 0.85 0.60 0.12 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.40 0.15 0.21 0.19 0.2 0.13 0.1 0.4 0.1 8° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-06-07 MO-187 Fig 20. Package outline SOT765-1 (VSSOP8) 74AHC_AHCT3G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 13 May 2013 © NXP B.V. 2013. All rights reserved. 13 of 19 74AHC3G14; 74AHCT3G14 NXP Semiconductors Triple inverting Schmitt trigger XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm 1 2 SOT833-1 b 4 3 4× (2) L L1 e 8 7 6 e1 5 e1 e1 8× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 2.0 1.9 1.05 0.95 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT833-1 --- MO-252 --- EUROPEAN PROJECTION ISSUE DATE 07-11-14 07-12-07 Fig 21. Package outline SOT833-1 (XSON8) 74AHC_AHCT3G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 13 May 2013 © NXP B.V. 2013. All rights reserved. 14 of 19 74AHC3G14; 74AHCT3G14 NXP Semiconductors Triple inverting Schmitt trigger XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 3 x 2 x 0.5 mm B D SOT996-2 A E A A1 detail X terminal 1 index area e1 1 4 8 5 C C A B C v w b e L1 y y1 C L2 L X 0 1 2 mm scale Dimensions (mm are the original dimensions) Unit(1) mm max nom min A A1 b 0.05 0.35 D E 2.1 3.1 0.5 0.00 0.15 1.9 e e1 0.5 1.5 2.9 L L1 L2 0.5 0.15 0.6 0.3 0.05 0.4 v 0.1 w y 0.05 0.05 y1 0.1 sot996-2_po Outline version References IEC JEDEC JEITA European projection Issue date 07-12-21 12-11-20 SOT996-2 Fig 22. Package outline SOT996-2 (XSON8) 74AHC_AHCT3G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 13 May 2013 © NXP B.V. 2013. All rights reserved. 15 of 19 74AHC3G14; 74AHCT3G14 NXP Semiconductors Triple inverting Schmitt trigger 16. Abbreviations Table 11. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 17. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74AHC_AHCT3G14 v.8 20130513 Product data sheet - 74AHC_AHCT3G14 v.7 Modifications: 74AHC_AHCT3G14 v.7 Modifications: • For type number 74AHC3G14GD and 74AHCT3G14GD XSON8U has changed to XSON8. 20111108 • Product data sheet - 74AHC_AHCT3G14 v.6 Legal pages updated. 74AHC_AHCT3G14 v.6 20101118 Product data sheet - 74AHC_AHCT3G14 v.5 74AHC_AHCT3G14 v.5 20100923 Product data sheet - 74AHC_AHCT3G14 v.4 74AHC_AHCT3G14 v.4 20090505 Product data sheet - 74AHC_AHCT3G14 v.3 74AHC_AHCT3G14 v.3 20080617 Product data sheet - 74AHC_AHCT3G14 v.2 74AHC_AHCT3G14 v.2 20041018 Product specification - 74AHC_AHCT3G14 v.1 74AHC_AHCT3G14 v.1 20031127 Product specification - - 74AHC_AHCT3G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 13 May 2013 © NXP B.V. 2013. All rights reserved. 16 of 19 74AHC3G14; 74AHCT3G14 NXP Semiconductors Triple inverting Schmitt trigger 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 18.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 74AHC_AHCT3G14 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 8 — 13 May 2013 © NXP B.V. 2013. All rights reserved. 17 of 19 74AHC3G14; 74AHCT3G14 NXP Semiconductors Triple inverting Schmitt trigger Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 74AHC_AHCT3G14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 13 May 2013 © NXP B.V. 2013. All rights reserved. 18 of 19 NXP Semiconductors 74AHC3G14; 74AHCT3G14 Triple inverting Schmitt trigger 20. Contents 1 2 3 4 5 6 7 7.1 7.2 8 9 10 11 11.1 12 13 13.1 14 15 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Transfer characteristics . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Transfer characteristic waveforms . . . . . . . . . . 8 Application information. . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Contact information. . . . . . . . . . . . . . . . . . . . . 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 13 May 2013 Document identifier: 74AHC_AHCT3G14
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