74ALVC244PW,118

INTEGRATED CIRCUITS DATA SHEET 74ALVC244 Octal buffer/line driver; 3-state Product specification Supersedes data of 2003 Aug 11 2003 Sep 08 Philips Semiconductors Product specification Octal buffer/line driver; 3-state 74ALVC244 FEATURES DESCRIPTION • Wide supply voltage range from 1.65 to 3.6 V The 74ALVC244 is a high-performance, low-power, low-voltage, Si-gate CMOS device and superior to most advanced CMOS compatible TTL families. • 3.6 V tolerant inputs/outputs • CMOS low power consumption The 74ALVC244 is an octal non-inverting buffer/line driver with 3-state outputs. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH on nOE causes the outputs to assume a high-impedance OFF-state. Schmitt-trigger action at all inputs makes the circuit highly tolerant for slower input rise and fall times. • Direct interface with TTL levels (2.7 to 3.6 V) • Power-down mode • Latch-up performance exceeds 250 mA • Complies with JEDEC standard: JESD8-7 (1.65 to 1.95 V) JESD8-5 (2.3 to 2.7 V) JESD8B/JESD36 (2.7 to 3.6 V) • ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C. SYMBOL tPHL/tPLH PARAMETER propagation delay nAn to nYn CI input capacitance CPD power dissipation capacitance per buffer CONDITIONS VCC = 1.8 V; CL = 30 pF; RL = 1 kΩ UNIT 2.7 ns VCC = 2.5 V; CL = 30 pF; RL = 500 Ω 2.0 ns VCC = 2.7 V; CL = 50 pF; RL = 500 Ω 2.3 ns VCC = 3.3 V; CL = 50 pF; RL = 500 Ω 2.2 ns 3.5 pF 20 pF VCC = 3.3 V; notes 1 and 2 Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total load switching outputs; Σ(CL × VCC2 × fo) = sum of the outputs. 2. The condition is VI = GND to VCC. 2003 Sep 08 TYPICAL 2 Philips Semiconductors Product specification Octal buffer/line driver; 3-state 74ALVC244 FUNCTION TABLE See note 1. INPUT OUTPUT nOE nAn nYn L L L L H H H X Z Note 1. H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. ORDERING INFORMATION PACKAGE TYPE NUMBER TEMPERATURE RANGE PINS PACKAGE MATERIAL CODE 74ALVC244D −40 to +85 °C 20 SO20 plastic SOT163-1 74ALVC244PW −40 to +85 °C 20 TSSOP20 plastic SOT360-1 74ALVC244BQ −40 to +85 °C 20 DHVQFN20 plastic SOT764-1 PINNING PIN PIN SYMBOL DESCRIPTION SYMBOL DESCRIPTION 11 2A3 data input 1 1OE output enable input (active LOW) 12 1Y3 bus output 2 1A0 data input 13 2A2 data input 3 2Y0 bus output 14 1Y2 bus output 4 1A1 data input 15 2A1 data input 5 2Y1 bus output 16 1Y1 bus output 6 1A2 data input 17 2A0 data input 7 2Y2 bus output 18 1Y0 bus output 8 1A3 data input 19 2OE output enable input (active LOW) 9 2Y3 bus output 20 VCC supply voltage 10 GND ground (0 V) 2003 Sep 08 3 Philips Semiconductors Product specification Octal buffer/line driver; 3-state 74ALVC244 handbook, halfpage handbook, halfpage 1OE VCC 1 20 1A0 2 19 2OE 1OE 1 20 VCC 1A0 2 19 2OE 2Y0 3 18 1Y0 2Y0 3 18 1Y0 1A1 4 17 2A0 1A1 4 17 2A0 2Y1 5 16 1Y1 2Y1 5 16 1Y1 244 GND(1) 15 2A1 1A2 6 15 2A1 2Y2 7 14 1Y2 2Y2 7 14 1Y2 1A3 8 13 2A2 1A3 8 13 2A2 2Y3 9 12 1Y3 GND 10 11 2A3 2Y3 9 12 1Y3 1A2 6 10 11 GND 2A3 MNA162 Top view MNA981 (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input. Fig.1 Pin configuration. Fig.2 Logic symbol. handbook, halfpage handbook, halfpage 2 1A0 1Y0 18 17 2A0 2Y0 3 4 1A1 1Y1 15 2A1 2Y1 18 4 16 16 6 14 5 8 12 6 1A2 1Y2 14 2A2 2Y2 7 8 1A3 1Y3 12 11 2A3 2Y3 9 1OE 19 2OE EN 2 13 1 1 19 MNA168 EN 11 9 13 7 15 5 17 3 MNA169 Fig.3 Logic symbol. 2003 Sep 08 Fig.4 IEE/IEC logic symbol. 4 Philips Semiconductors Product specification Octal buffer/line driver; 3-state 74ALVC244 handbook, halfpage 1Y0 1A0 2 18 1A1 1Y1 4 6 8 1 16 1Y2 1A2 14 1Y3 1A3 12 1OE 2Y0 2A0 17 3 2A1 2Y1 15 13 11 19 5 2Y2 2A2 7 2Y3 2A3 9 2OE MNA170 Fig.5 Logic diagram. 2003 Sep 08 5 Philips Semiconductors Product specification Octal buffer/line driver; 3-state 74ALVC244 RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage 1.65 3.6 V VI input voltage 0 3.6 V VO output voltage VCC V Tamb operating ambient temperature tr, tf input rise and fall times VCC = 1.65 to 3.6 V; enable mode 0 VCC = 1.65 to 3.6 V; disable mode 0 3.6 V VCC = 0 V; Power-down mode 0 3.6 V −40 +85 °C VCC = 1.65 to 2.7 V 0 20 ns/V VCC = 2.7 to 3.6 V 0 10 ns/V LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER VCC supply voltage IIK input diode current VI input voltage IOK output diode current VO output voltage CONDITIONS MIN. MAX. UNIT −0.5 +4.6 V − −50 mA −0.5 +4.6 V VO > VCC or VO < 0 − ±50 mA enable mode; notes 1 and 2 −0.5 VCC + 0.5 V disable mode −0.5 +4.6 V Power-down mode; note 2 −0.5 +4.6 V VO = 0 to VCC − ±50 mA VI < 0 IO output source or sink current IGND, ICC VCC or GND current − ±100 mA Tstg storage temperature −65 +150 °C Ptot power dissipation − 500 mW Tamb = −40 to +85 °C; note 3 Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. When VCC = 0 V (Power-down mode), the output voltage can be 3.6 V in normal operation. 3. For SO20 packages: above 70 °C derate linearly with 8 mW/K. For TSSOP20 packages: above 60 °C derate linearly with 5.5 mW/K. For DHVQFN20 packages: above 60 °C derate linearly with 4.5 mW/K. 2003 Sep 08 6 Philips Semiconductors Product specification Octal buffer/line driver; 3-state 74ALVC244 DC CHARACTERISTICS At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER MIN. OTHER TYP.(1) MAX. UNIT VCC (V) Tamb = −40 to +85 °C VIH VIL VOL VOH HIGH-level input voltage HIGH-level output voltage − V 1.7 − − V 2 − − V 2.7 to 3.6 1.65 to 1.95 − − 0.35 × VCC V 2.3 to 2.7 − − 0.7 V 2.7 to 3.6 − − 0.8 V IO = 100 µA 1.65 to 3.6 − − 0.2 V IO = 6 mA 1.65 − − 0.3 V IO = 12 mA 2.3 − − 0.4 V IO = 18 mA 2.3 − − 0.6 V IO = 12 mA 2.7 − − 0.4 V IO = 18 mA 3.0 − − 0.4 V IO = 24 mA 3.0 − − 0.55 V IO = −100 µA 1.65 to 3.6 VCC − 0.2 − − V IO = −6 mA 1.65 1.25 − − V IO = −12 mA 2.3 1.8 − − V IO = −18 mA 2.3 1.7 − − V IO = −12 mA 2.7 2.2 − − V IO = −18 mA 3.0 2.4 − − V IO = −24 mA 3.0 2.2 − − V LOW-level input voltage LOW-level output voltage 1.65 to 1.95 0.65 × VCC − 2.3 to 2.7 VI = VIH or VIL VI = VIH or VIL ILI input leakage current VI = 3.6 V or GND 3.6 − ±0.1 ±5 µA IOZ 3-state output OFF-state current VI = VIH or VIL; VO = 3.6 V or GND; note 2 3.6 − 0.1 ±10 µA Ioff power OFF leakage VI or VO = 3.6 V current 0.0 − ±0.1 ±10 µA ICC quiescent supply current VI = VCC or GND; IO = 0 3.6 − 0.2 20 µA ∆ICC additional quiescent supply current per input pin VI = VCC − 0.6 V; IO = 0 3.0 to 3.6 − 5 750 µA Notes 1. All typical values are measured at Tamb = 25 °C. 2. For transceivers, the parameters IOZ includes the input leakage current. 2003 Sep 08 7 Philips Semiconductors Product specification Octal buffer/line driver; 3-state 74ALVC244 AC CHARACTERISTICS TEST CONDITIONS SYMBOL PARAMETER MIN. WAVEFORMS TYP.(1) MAX. UNIT VCC (V) Tamb = −40 to +85 °C tPHL/tPLH tPZH/tPZL tPHZ/tPLZ propagation delay nAn to nYn see Figs 6 and 8 1.65 to 1.95 3-state output enable time nOE to nYn 1.0 2.7 4.4 ns 2.3 to 2.7 1.0 2.0 3.1 ns 2.7 1.0 2.3 3.1 ns 3.0 to 3.6 1.0 2.2 2.8 ns see Figs 7 and 8 1.65 to 1.95 3-state output disable time nOE to nYn 1.0 3.4 6.9 ns 2.3 to 2.7 1.0 2.6 5.4 ns 2.7 1.0 3.2 5.3 ns 3.0 to 3.6 1.0 2.5 4.5 ns 1.0 3.8 5.9 ns 2.3 to 2.7 1.0 2.2 4.1 ns 2.7 1.0 3.0 4.4 ns 3.0 to 3.6 1.0 2.9 4.2 ns see Figs 7 and 8 1.65 to 1.95 Note 1. All typical values are measured at Tamb = 25 °C. AC WAVEFORMS handbook, halfpage VI nAn input VM VM GND tPLH tPHL VOH VM nYn output VOL VM MNA171 INPUT VCC VM VI tr = tf 0.5 × VCC VCC ≤ 2.0 ns 2.3 to 2.7 V 0.5 × VCC VCC ≤ 2.0 ns 2.7 V 1.5 V 2.7 V ≤ 2.5 ns 3.0 to 3.6 V 1.5 V 2.7 V ≤ 2.5 ns 1.65 to 1.95 V Fig.6 Input nAn to output nYn propagation delay times. 2003 Sep 08 8 Philips Semiconductors Product specification Octal buffer/line driver; 3-state 74ALVC244 VI handbook, full pagewidth VM nOE input GND tPLZ output LOW-to-OFF OFF-to-LOW tPZL VCC VM Vx VOL tPHZ tPZH VOH Vy output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs disabled outputs enabled MNA654 INPUT VCC VM VI tr = tf 1.65 to 1.95 V 0.5 × VCC VCC ≤ 2.0 ns 2.3 to 2.7 V 0.5 × VCC VCC ≤ 2.0 ns 2.7 V 1.5 V 2.7 V ≤ 2.5 ns VX = VOL + 0.3 V at VCC ≥ 2.7 V; VX = VOL + 0.15 V at VCC < 2.7 V; VY = VOH − 0.3 V at VCC ≥ 2.7 V; VY = VOH − 0.15 V at VCC < 2.7 V. 3.0 to 3.6 V 1.5 V 2.7 V ≤ 2.5 ns VOL and VOH are typical output voltage drop that occur with the output load. Fig.7 3-state enable and disable times. 2003 Sep 08 9 Philips Semiconductors Product specification Octal buffer/line driver; 3-state 74ALVC244 VEXT handbook, full pagewidth VCC PULSE GENERATOR VI RL VO D.U.T. CL RT RL MNA616 VCC VI CL RL VEXT tPLH/tPHL tPZH/tPHZ tPZL/tPLZ 1.65 to 1.95 V VCC 30 pF 1 kΩ open GND 2 × VCC 2.3 to 2.7 V VCC 30 pF 500 Ω open GND 2 × VCC 2.7 V 2.7 V 50 pF 500 Ω open GND 6V 3.0 to 3.6 V 2.7 V 50 pF 500 Ω open GND 6V Definitions for test circuit: RL = Load resistor. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.8 Load circuitry for switching times. 2003 Sep 08 10 Philips Semiconductors Product specification Octal buffer/line driver; 3-state 74ALVC244 PACKAGE OUTLINES SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.1 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013 2003 Sep 08 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 11 Philips Semiconductors Product specification Octal buffer/line driver; 3-state 74ALVC244 TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 E D A X c HE y v M A Z 11 20 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 10 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8 0o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 2003 Sep 08 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-153 12 o Philips Semiconductors Product specification Octal buffer/line driver; 3-state 74ALVC244 DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 9 y y1 C v M C A B w M C b L 1 10 Eh e 20 11 19 12 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 4.6 4.4 3.15 2.85 2.6 2.4 1.15 0.85 0.5 3.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT764-1 --- MO-241 --- 2003 Sep 08 13 EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Philips Semiconductors Product specification Octal buffer/line driver; 3-state 74ALVC244 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification  The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications  These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes  Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Sep 08 14 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. SCA75 © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R20/03/pp15 Date of release: 2003 Sep 08 Document order number: 9397 750 12018