74HC3G34

74HC3G34; 74HCT3G34 Triple buffer gate Rev. 05 — 7 May 2009 Product data sheet 1. General description The 74HC3G34; 74HCT3G34 are high-speed Si-gate CMOS devices. They provide three buffer gates. The HC device has CMOS input switching levels and supply voltage range 2 V to 6 V. The HCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V. 2. Features I I I I I I I Wide supply voltage range from 2.0 V to 6.0 V Symmetrical output impedance High noise immunity Low-power dissipation Balanced propagation delays Multiple package options ESD protection: N HBM JESD22-A114E exceeds 2000 V N MM JESD22-A115-A exceeds 200 V I Specified from −40 °C to +85 °C and −40 °C to +125 °C 3. Ordering information Table 1. Ordering information Package Temperature range Name 74HC3G34DP 74HCT3G34DP 74HC3G34DC 74HCT3G34DC 74HC3G34GD 74HCT3G34GD −40 °C to +125 °C XSON8U −40 °C to +125 °C VSSOP8 −40 °C to +125 °C TSSOP8 Description plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm Version SOT505-2 Type number plastic very thin shrink small outline package; 8 leads; SOT765-1 body width 2.3 mm plastic extremely thin small outline package; no leads; SOT996-2 8 terminals; UTLP based; body 3 × 2 × 0.5 mm NXP Semiconductors 74HC3G34; 74HCT3G34 Triple buffer gate 4. Marking Table 2. Marking Marking code H34 T34 P34 U34 P34 U34 Type number 74HC3G34DP 74HCT3G34DP 74HC3G34DC 74HCT3G34DC 74HC3G34GD 74HCT3G34GD 5. Functional diagram 1 1 7 1 1A 1Y 7 3 1 5 2 3Y 3A 6 3 2A 2Y 5 6 1 2 mna744 mna745 Fig 1. Logic symbol Fig 2. IEC logic symbol 6. Pinning information 6.1 Pinning 74HC3G34 74HCT3G34 74HC3G34 74HCT3G34 1A 3Y 2A GND 1 2 3 4 001aae470 1A 3Y 8 7 6 5 VCC 1Y 3A 2Y GND 2A 1 2 3 4 8 7 6 5 VCC 1Y 3A 2Y 001aak021 Transparent top view Fig 3. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8) Fig 4. Pin configuration SOT996-2 (XSON8U) 74HC_HCT3G34_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 7 May 2009 2 of 13 NXP Semiconductors 74HC3G34; 74HCT3G34 Triple buffer gate 6.2 Pin description Table 3. Symbol 1A, 2A, 3A 1Y, 2Y, 3Y GND VCC Pin description Pin 1, 3, 6 7, 5, 2 4 8 Description data input data output ground (0 V) supply voltage 7. Functional description Table 4. Input nA L H [1] H = HIGH voltage level; L = LOW voltage level. Function table [1] Output nY L H 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK IOK IO ICC IGND Tstg Ptot [1] [2] Parameter supply voltage input clamping current output clamping current output current quiescent supply current ground current storage temperature total power dissipation Conditions VI < −0.5 V or VI > VCC + 0.5 V VO < −0.5 V or VO > VCC + 0.5 V VO = −0.5 V to (VCC + 0.5 V) [1] [1] Min −0.5 −50 −65 Max +7.0 ±20 ±20 ±25 50 +150 300 Unit V mA mA mA mA mA °C mW Tamb = −40 °C to +125 °C [2] - The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For TSSOP8 package: above 55 °C the value of Ptot derates linearly with 2.5 mW/K. For VSSOP8 package: above 110 °C the value of Ptot derates linearly with 8 mW/K. For XSON8U package: above 118 °C the value of Ptot derates linearly with 7.8 mW/K. 74HC_HCT3G34_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 7 May 2009 3 of 13 NXP Semiconductors 74HC3G34; 74HCT3G34 Triple buffer gate 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC VI VO Tamb ∆t/∆V supply voltage input voltage output voltage ambient temperature input transition rise and fall rate VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V Conditions Min 2.0 0 0 −40 74HC3G34 Typ 5.0 +25 1.67 Max 6.0 VCC VCC +125 625 139 83 Min 4.5 0 0 −40 74HCT3G34 Typ 5.0 +25 1.67 Max 5.5 VCC VCC +125 139 V V V °C ns/V ns/V ns/V Unit 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol 74HC3G34 VIH HIGH-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VIL LOW-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VOH HIGH-level output voltage VI = VIH or VIL IO = −20 µA; VCC = 2.0 V IO = −20 µA; VCC = 4.5 V IO = −20 µA; VCC = 6.0 V IO = −4.0 mA; VCC = 4.5 V IO = −5.2 mA; VCC = 6.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 µA; VCC = 2.0 V IO = 20 µA; VCC = 4.5 V IO = 20 µA; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V II ICC CI input leakage current supply current input capacitance VI = VCC or GND; VCC = 6.0 V per input pin; VI = VCC or GND; IO = 0 A; VCC = 6.0 V 0 0 0 0.15 0.16 1.5 0.1 0.1 0.1 0.33 0.33 ±1.0 10 0.1 0.1 0.1 0.4 0.4 ±1.0 20 V V V V V µA µA pF 1.9 4.4 5.9 4.13 5.63 2.0 4.5 6.0 4.32 5.81 1.9 4.4 5.9 3.7 5.2 V V V V V 1.5 3.15 4.2 1.2 2.4 3.2 0.8 2.1 2.8 0.5 1.35 1.8 1.5 3.15 4.2 0.5 1.35 1.8 V V V V V V Parameter Conditions −40 °C to +85 °C Min Typ[1] Max −40 °C to +125 °C Min Max Unit 74HC_HCT3G34_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 7 May 2009 4 of 13 NXP Semiconductors 74HC3G34; 74HCT3G34 Triple buffer gate Table 7. Static characteristics …continued Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions −40 °C to +85 °C Min 74HCT3G34 VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V VI = VIH or VIL IO = −20 µA; VCC = 4.5 V IO = −4.0 mA; VCC = 4.5 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 µA; VCC = 4.5 V IO = 4.0 mA; VCC = 4.5 V II ICC ∆ICC CI [1] −40 °C to +125 °C Min 2.0 Max 0.8 Unit Typ[1] 1.6 1.2 Max 0.8 2.0 - V V 4.4 4.13 - 4.5 4.32 0 0.15 1.5 0.1 0.33 ±1.0 10 375 - 4.4 3.7 - 0.1 0.4 ±1.0 20 410 - V V V V µA µA µA pF input leakage current supply current additional supply current input capacitance VI = VCC or GND; VCC = 5.5 V VI = VCC or GND; IO = 0 A; VCC = 5.5 V per input; VCC = 4.5 V to 5.5 V; VI = VCC − 2.1 V; IO = 0 A All typical values are measured at Tamb = 25 °C. 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6. Symbol Parameter 74HC3G34 tpd propagation delay nA to nY; see Figure 5 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tt transition time nY; see Figure 5 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V CPD power dissipation VI = GND to VCC capacitance [4] [3] [2] Conditions −40 °C to +85 °C Min Typ[1] Max −40 °C to +125 °C Unit Min Max - 29 9 8 18 6 5 10 95 19 16 95 19 16 - - 125 25 20 125 25 20 - ns ns ns ns ns ns pF 74HC_HCT3G34_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 7 May 2009 5 of 13 NXP Semiconductors 74HC3G34; 74HCT3G34 Triple buffer gate Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6. Symbol Parameter 74HCT3G34 tpd tt CPD propagation delay nA to nY; see Figure 5 VCC = 4.5 V transition time nY; VCC = 4.5 V; see Figure 5 [3] [4] [2] Conditions −40 °C to +85 °C Min Typ[1] Max −40 °C to +125 °C Unit Min Max - 10 6 9 23 19 - - 29 25 - ns ns pF power dissipation VI = GND to VCC − 1.5 V capacitance All typical values are measured at Tamb = 25 °C. tpd is the same as tPLH and tPHL. tt is the same as tTLH and tTHL. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of outputs. [1] [2] [3] [4] 12. Waveforms VI input nA GND t PHL VOH output nY VOL t THL VM VM 10 % t TLH 001aad982 VM VM t PLH 90 % Measurement points are given in Table 9. Fig 5. Table 9. Type Propagation delay data input (nA) to data output (nY) and transition time output (nY) Measurement points Input VM 0.5 × VCC 1.3 V Output VM 0.5 × VCC 1.3 V 74HC3G34 74HCT3G34 74HC_HCT3G34_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 7 May 2009 6 of 13 NXP Semiconductors 74HC3G34; 74HCT3G34 Triple buffer gate VI negative pulse 0V tW 90 % VM 10 % tf tr tr tf 90 % VM 10 % tW VM VM VI positive pulse 0V VCC VCC G VI VO RL S1 DUT RT CL open 001aad983 Test data is given in Table 10. Definitions for test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch. Fig 6. Table 10. Type Test circuit for measuring switching times Test data Input VI tr, tf ≤ 6 ns ≤ 6 ns GND to VCC GND to 3 V Load CL 50 pF 50 pF RL 1 kΩ 1 kΩ S1 position tPHL, tPLH open open 74HC3G34 74HCT3G34 74HC_HCT3G34_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 7 May 2009 7 of 13 NXP Semiconductors 74HC3G34; 74HCT3G34 Triple buffer gate 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 D E A X c y HE vMA Z 8 5 A pin 1 index A2 A1 (A3) Lp L θ 1 e bp 4 wM detail X 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.00 A2 0.95 0.75 A3 0.25 bp 0.38 0.22 c 0.18 0.08 D(1) 3.1 2.9 E(1) 3.1 2.9 e 0.65 HE 4.1 3.9 L 0.5 Lp 0.47 0.33 v 0.2 w 0.13 y 0.1 Z(1) 0.70 0.35 θ 8° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 REFERENCES IEC JEDEC --JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16 Fig 7. Package outline SOT505-2 (TSSOP8) © NXP B.V. 2009. All rights reserved. 74HC_HCT3G34_5 Product data sheet Rev. 05 — 7 May 2009 8 of 13 NXP Semiconductors 74HC3G34; 74HCT3G34 Triple buffer gate VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 D E A X c y HE vMA Z 8 5 Q A pin 1 index A2 A1 (A3) θ Lp L 1 e bp 4 wM detail X 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1 A1 0.15 0.00 A2 0.85 0.60 A3 0.12 bp 0.27 0.17 c 0.23 0.08 D(1) 2.1 1.9 E(2) 2.4 2.2 e 0.5 HE 3.2 3.0 L 0.4 Lp 0.40 0.15 Q 0.21 0.19 v 0.2 w 0.13 y 0.1 Z(1) 0.4 0.1 θ 8° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC MO-187 JEITA EUROPEAN PROJECTION ISSUE DATE 02-06-07 Fig 8. Package outline SOT765-1 (VSSOP8) © NXP B.V. 2009. All rights reserved. 74HC_HCT3G34_5 Product data sheet Rev. 05 — 7 May 2009 9 of 13 NXP Semiconductors 74HC3G34; 74HCT3G34 Triple buffer gate XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 x 2 x 0.5 mm SOT996-2 D B A E A A1 detail X terminal 1 index area e1 L1 1 e b 4 v w M M CAB C C y1 C y L2 L 8 5 X 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 0.05 0.00 b 0.35 0.15 D 2.1 1.9 E 3.1 2.9 e 0.5 e1 1.5 L 0.5 0.3 L1 0.15 0.05 L2 0.6 0.4 v 0.1 w 0.05 y 0.05 y1 0.1 OUTLINE VERSION SOT996-2 REFERENCES IEC --JEDEC JEITA --- EUROPEAN PROJECTION ISSUE DATE 07-12-18 07-12-21 Fig 9. Package outline SOT996-2 (XSON8U) © NXP B.V. 2009. All rights reserved. 74HC_HCT3G34_5 Product data sheet Rev. 05 — 7 May 2009 10 of 13 NXP Semiconductors 74HC3G34; 74HCT3G34 Triple buffer gate 14. Abbreviations Table 11. Acronym CMOS DUT ESD HBM MM TTL Abbreviations Description Complementary Metal Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic 15. Revision history Table 12. Revision history Release date 20090507 Data sheet status Product data sheet Change notice Supersedes 74HC_HCT3G34_4 Document ID 74HC_HCT3G34_5 Modifications: • • • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Added type number 74HC3G34GD and 74HCT3G34GD (XSON8U package) Product data sheet Product specification Product specification Product specification 74HC_HCT3G34_3 74HC_HCT3G34_2 74HC_HCT3G34_1 - 74HC_HCT3G34_4 74HC_HCT3G34_3 74HC_HCT3G34_2 74HC_HCT3G34_1 20060309 20030519 20030210 20031003 74HC_HCT3G34_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 7 May 2009 11 of 13 NXP Semiconductors 74HC3G34; 74HCT3G34 Triple buffer gate 16. Legal information 16.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 74HC_HCT3G34_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 7 May 2009 12 of 13 NXP Semiconductors 74HC3G34; 74HCT3G34 Triple buffer gate 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 7 May 2009 Document identifier: 74HC_HCT3G34_5