BGA2800
MMIC wideband amplifier
Rev. 5 — 13 July 2015
Product data sheet
1. Product profile
1.1 General description
Silicon Monolitic Microwave Integrated Circuit (MMIC) wideband amplifier with internal
matching circuit in a 6-pin SOT363 plastic SMD package.
1.2 Features and benefits
Internally matched to 50
A gain of 20 dB at 250 MHz increasing to 20.6 dB at 2150 MHz
Output power at 1 dB gain compression = 1 dBm
Supply current = 10.5 mA at a supply voltage of 3.3 V
Reverse isolation > 30 dB up to 2 GHz
Good linearity with low second order and third order products
Noise figure = 4 dB at 950 MHz
Unconditionally stable (K > 1)
1.3 Applications
LNB IF amplifiers
General purpose low noise wideband amplifier for frequencies between
DC and 2.2 GHz
2. Pinning information
Table 1.
Pinning
Pin
Description
1
VCC
2, 5
GND2
3
RF_OUT
4
GND1
6
RF_IN
Simplified outline
Graphic symbol
V\P
BGA2800
NXP Semiconductors
MMIC wideband amplifier
3. Ordering information
Table 2.
Ordering information
Type number
BGA2800
Package
Name
Description
Version
-
plastic surface-mounted package; 6 leads
SOT363
4. Marking
Table 3.
Marking
Type number
Marking code
Description
BGA2800
*E7
* = - : made in Hong Kong
* = p : made in Hong Kong
* = W : made in China
* = t : made in Malaysia
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
RF input AC coupled
0.5
+5.0
V
ICC
supply current
-
55
mA
Ptot
total power dissipation
Tsp = 90 C
-
200
mW
Tstg
storage temperature
40
+125
C
Tj
junction temperature
-
125
C
Pdrive
drive power
-
+10
dBm
6. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Rth(j-sp)
thermal resistance from junction to Ptot = 200 mW; Tsp = 90 C
solder point
Conditions
Typ
Unit
300
K/W
7. Characteristics
Table 6.
Characteristics
VCC = 3.3 V; ZS = ZL = 50 ; Pi = 40 dBm; Tamb = 25 C; measured on demo board; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
VCC
supply voltage
3.0
3.3
3.6
V
ICC
supply current
8.8
10.5
12.1
mA
BGA2800
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 13 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
2 of 18
BGA2800
NXP Semiconductors
MMIC wideband amplifier
Table 6.
Characteristics …continued
VCC = 3.3 V; ZS = ZL = 50 ; Pi = 40 dBm; Tamb = 25 C; measured on demo board; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Gp
f = 250 MHz
19.4
19.9
20.5
dB
f = 950 MHz
19.8
20.5
21.2
dB
f = 2150 MHz
18.7
20.2
21.7
dB
f = 250 MHz
19
21
23
dB
f = 950 MHz
19
21
23
dB
f = 2150 MHz
10
15
22
dB
f = 250 MHz
15
19
24
dB
f = 950 MHz
16
17
18
dB
f = 2150 MHz
15
17
20
dB
f = 250 MHz
46
67
87
dB
f = 950 MHz
44
46
47
dB
f = 2150 MHz
35
37
40
dB
f = 250 MHz
3.2
3.7
4.2
dB
f = 950 MHz
3.1
3.6
4.0
dB
RLin
RLout
ISL
NF
power gain
input return loss
output return loss
isolation
noise figure
f = 2150 MHz
3.3
3.7
4.2
dB
B3dB
3 dB bandwidth
3 dB below gain at 1 GHz
2.9
3.2
3.5
GHz
K
Rollett stability factor
f = 250 MHz
49
105
160
f = 950 MHz
8
9
10
PL(sat)
PL(1dB)
IP3I
IP3O
PL(2H)
IM2
f = 2150 MHz
2.8
3.4
4.0
f = 250 MHz
1
1
2
dBm
f = 950 MHz
0
1
3
dBm
f = 2150 MHz
2
0
+1
dBm
output power at 1 dB gain compression f = 250 MHz
2
1
0
dBm
f = 950 MHz
2
1
0
dBm
f = 2150 MHz
3
2
1
dBm
f1 = 250 MHz; f2 = 251 MHz
11
9
7
dBm
f1 = 950 MHz; f2 = 951 MHz
12
10
7
dBm
f1 = 2150 MHz; f2 = 2151 MHz
15
12
9
dBm
f1 = 250 MHz; f2 = 251 MHz
9
11
13
dBm
f1 = 950 MHz; f2 = 951 MHz
9
11
13
dBm
f1 = 2150 MHz; f2 = 2151 MHz
5
8
11
dBm
f1H = 250 MHz; f2H = 500 MHz
62
60
58
dBm
f1H = 950 MHz; f2H = 1900 MHz
51
49
48
dBm
f1 = 250 MHz; f2 = 251 MHz
42
53
64
dBc
f1 = 950 MHz; f2 = 951 MHz
44
55
67
dBc
saturated output power
Pdrive = 36 dBm (for each tone)
input third-order intercept point
output third-order intercept point
Pdrive = 34 dBm
second harmonic output power
second-order intermodulation distance
BGA2800
Product data sheet
Pdrive = 36 dBm (for each tone)
Pdrive = 36 dBm (for each tone)
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 13 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
3 of 18
BGA2800
NXP Semiconductors
MMIC wideband amplifier
8. Application information
Figure 1 shows a typical application circuit for the BGA2800 MMIC. The device is
internally matched to 50 , and therefore does not need any external matching. The value
of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF
for applications above 100 MHz. However, when the device is operated below 100 MHz,
the capacitor value should be increased.
The 22 nF supply decoupling capacitor C1 should be located as close as possible to the
MMIC.
The PCB top ground plane, connected to pins 2, 4 and 5 must be as close as possible to
the MMIC, preferably also below the MMIC. When using via holes, use multiple via holes
as close as possible to the MMIC.
96
&
&
5)LQSXW
96
5)B287 &
5)B,1
5)RXWSXW
*1'
*1'
DDI
Fig 1.
Typical application circuit
8.1 Application examples
PL[HU
ZLGHEDQG
DPSOLILHU
IURP5)
FLUFXLW
/1$
WR,)FLUFXLW
RUGHPRGXODWRU
RVFLOODWRU
Application as IF amplifier
BGA2800
Product data sheet
PL[HU
WR,)FLUFXLW
RUGHPRGXODWRU
DQWHQQD
RVFLOODWRU
DDI
The MMIC is very suitable as IF amplifier in e.g. LNB’s.
The excellent wideband characteristics make it an easy
building block.
Fig 2.
ZLGHEDQG
DPSOLILHU
DDI
As second amplifier after an LNA, the MMIC offers an
easy matching, low noise solution.
Fig 3.
Application as RF amplifier
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 13 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
4 of 18
BGA2800
NXP Semiconductors
MMIC wideband amplifier
8.2 Graphs
DDP
Tamb = 25 C; ICC = 10.5 mA; VCC = 3.3 V; Z0 = 50 .
(1) f = 250 MHz
(2) f = 950 MHz
(3) f = 2150 MHz
Fig 4.
BGA2800
Product data sheet
Input reflection coefficient (S11); typical values
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 13 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
5 of 18
BGA2800
NXP Semiconductors
MMIC wideband amplifier
DDP
Tamb = 25 C; ICC = 10.5 mA; VCC = 3.3 V; Z0 = 50 .
(1) f = 250 MHz
(2) f = 950 MHz
(3) f = 2150 MHz
Fig 5.
BGA2800
Product data sheet
Output reflection coefficient (S22); typical values
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 13 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
6 of 18
BGA2800
NXP Semiconductors
MMIC wideband amplifier
DDP
.
DDP
5/LQ
G%
I *+]
I *+]
(1) VCC = 3.0 V; Tamb = 85 C; ICC = 8.80 mA
(1) VCC = 3.0 V; Tamb = 85 C; ICC = 8.80 mA
Pdrive = 40 dBm; Z0 = 50 .
Pdrive = 40 dBm; Z0 = 50 .
(2) VCC = 3.0 V; Tamb = 40 C; ICC = 9.18 mA
(2) VCC = 3.0 V; Tamb = 40 C; ICC = 9.18 mA
(3) VCC = 3.3 V; Tamb = 25 C; ICC = 10.52 mA
(3) VCC = 3.3 V; Tamb = 25 C; ICC = 10.52 mA
(4) VCC = 3.6 V; Tamb = 85 C; ICC = 11.62 mA
(4) VCC = 3.6 V; Tamb = 85 C; ICC = 11.62 mA
(5) VCC = 3.6 V; Tamb = 40 C; ICC = 12.07 mA
(5) VCC = 3.6 V; Tamb = 40 C; ICC = 12.07 mA
Fig 6.
Rollett stability factor as function of
frequency; typical values
BGA2800
Product data sheet
Fig 7.
Input return loss as function of frequency;
typical values
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 13 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
7 of 18
BGA2800
NXP Semiconductors
MMIC wideband amplifier
DDP
DDP
*S
G%
5/RXW
G%
I *+]
I *+]
(1) VCC = 3.0 V; Tamb = 85 C; ICC = 8.80 mA
(1) VCC = 3.0 V; Tamb = 85 C; ICC = 8.80 mA
Pdrive = 40 dBm; Z0 = 50 .
Pdrive = 40 dBm; Z0 = 50 .
(2) VCC = 3.0 V; Tamb = 40 C; ICC = 9.18 mA
(2) VCC = 3.0 V; Tamb = 40 C; ICC = 9.18 mA
(3) VCC = 3.3 V; Tamb = 25 C; ICC = 10.52 mA
(3) VCC = 3.3 V; Tamb = 25 C; ICC = 10.52 mA
(4) VCC = 3.6 V; Tamb = 85 C; ICC = 11.62 mA
(4) VCC = 3.6 V; Tamb = 85 C; ICC = 11.62 mA
(5) VCC = 3.6 V; Tamb = 40 C; ICC = 12.07 mA
(5) VCC = 3.6 V; Tamb = 40 C; ICC = 12.07 mA
Fig 8.
Output return loss as function of frequency;
typical values
BGA2800
Product data sheet
Fig 9.
Insertion power gain as function of frequency;
typical values
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 13 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
8 of 18
BGA2800
NXP Semiconductors
MMIC wideband amplifier
DDP
DDP
,6/
G%
1)
G%
I *+]
I *+]
(1) VCC = 3.0 V; Tamb = 85 C; ICC = 8.80 mA
(1) VCC = 3.0 V; Tamb = 85 C; ICC = 8.80 mA
Pdrive = 40 dBm; Z0 = 50 .
Z0 = 50 .
(2) VCC = 3.0 V; Tamb = 40 C; ICC = 9.18 mA
(2) VCC = 3.0 V; Tamb = 40 C; ICC = 9.18 mA
(3) VCC = 3.3 V; Tamb = 25 C; ICC = 10.52 mA
(3) VCC = 3.3 V; Tamb = 25 C; ICC = 10.52 mA
(4) VCC = 3.6 V; Tamb = 85 C; ICC = 11.62 mA
(4) VCC = 3.6 V; Tamb = 85 C; ICC = 11.62 mA
(5) VCC = 3.6 V; Tamb = 40 C; ICC = 12.07 mA
(5) VCC = 3.6 V; Tamb = 40 C; ICC = 12.07 mA
Fig 10. Isolation as function of frequency;
typical values
Fig 11. Noise figure as function of frequency;
typical values
8.3 Tables
Table 7.
Supply current over temperature and supply voltages
Typical values.
Symbol
ICC
Parameter
Conditions
supply current
Tamb (C)
Unit
40
+25
+85
VCC = 3.0 V
9.18
8.96
8.80
mA
VCC = 3.3 V
11.18
10.52
10.83
mA
VCC = 3.6 V
12.07
12.28
11.62
mA
Table 8.
Second harmonic output power over temperature and supply voltages
Typical values.
Symbol Parameter
Conditions
Tamb (C)
Unit
40 +25 +85
PL(2H)
second harmonic output power f = 250 MHz; Pdrive = 34 dBm
VCC = 3.0 V
53 58 63 dBm
VCC = 3.3 V
57 60 63 dBm
VCC = 3.6 V
58 61 62 dBm
f = 950 MHz; Pdrive = 34 dBm
BGA2800
Product data sheet
VCC = 3.0 V
46 49 51 dBm
VCC = 3.3 V
47 49 51 dBm
VCC = 3.6 V
47 49 51 dBm
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 13 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
9 of 18
BGA2800
NXP Semiconductors
MMIC wideband amplifier
Table 9.
Input power at 1 dB gain compression over temperature and supply voltages
Typical values.
Symbol Parameter
Pi(1dB)
Conditions
input power at 1 dB gain compression
Tamb (C)
Unit
40
+25
+85
VCC = 3.0 V
21
21
21
dBm
VCC = 3.3 V
20
20
20
dBm
VCC = 3.6 V
20
20
20
dBm
VCC = 3.0 V
21
21
21
dBm
VCC = 3.3 V
20
20
20
dBm
VCC = 3.6 V
20
20
20
dBm
VCC = 3.0 V
21
21
22
dBm
VCC = 3.3 V
21
21
22
dBm
VCC = 3.6 V
20
21
22
dBm
f = 250 MHz
f = 950 MHz
f = 2150 MHz
Table 10. Output power at 1 dB gain compression over temperature and supply voltages
Typical values.
Symbol
Parameter
Conditions
PL(1dB)
output power at 1 dB gain compression
f = 250 MHz
Tamb (C)
Unit
40
+25
+85
VCC = 3.0 V
3
3
3
dBm
VCC = 3.3 V
1
1
1
dBm
VCC = 3.6 V
0
0
1
dBm
VCC = 3.0 V
3
3
3
dBm
VCC = 3.3 V
1
1
2
dBm
VCC = 3.6 V
0
0
1
dBm
VCC = 3.0 V
3
3
4
dBm
VCC = 3.3 V
1
2
3
dBm
VCC = 3.6 V
0
1
3
dBm
f = 950 MHz
f = 2150 MHz
BGA2800
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 13 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
10 of 18
BGA2800
NXP Semiconductors
MMIC wideband amplifier
Table 11. Saturated output power over temperature and supply voltages
Typical values.
Symbol
Parameter
Conditions
PL(sat)
saturated output power
f = 250 MHz
Tamb (C)
Unit
40
+25
+85
VCC = 3.0 V
1
1
1
dBm
VCC = 3.3 V
1
1
1
dBm
VCC = 3.6 V
2
2
2
dBm
VCC = 3.0 V
1
1
1
dBm
VCC = 3.3 V
2
1
1
dBm
VCC = 3.6 V
3
2
2
dBm
VCC = 3.0 V
1
1
3
dBm
VCC = 3.3 V
1
0
2
dBm
VCC = 3.6 V
1
0
1
dBm
f = 950 MHz
f = 2150 MHz
Table 12. Second-order intermodulation distance over temperature and supply voltages
Typical values.
Symbol
Parameter
Conditions
Tamb (C)
IM2
second-order intermodulation distance
f1 = 250 MHz;
f2 = 251 MHz;
Pdrive = 36 dBm
Unit
40 +25 +85
VCC = 3.0 V
40
51
49
dBc
VCC = 3.3 V
52
53
46
dBc
VCC = 3.6 V
58
50
45
dBc
VCC = 3.0 V
38
47
52
dBc
VCC = 3.3 V
48
55
46
dBc
VCC = 3.6 V
55
51
44
dBc
f1 = 950 MHz;
f2 = 951 MHz;
Pdrive = 36 dBm
BGA2800
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 13 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
11 of 18
BGA2800
NXP Semiconductors
MMIC wideband amplifier
Table 13. Output third-order intercept point over temperature and supply voltages
Typical values.
Symbol
Parameter
Conditions
IP3O
output third-order intercept point
f1 = 250 MHz;
f2 = 251 MHz;
Pdrive = 36 dBm
Tamb (C)
40
+25
Unit
+85
VCC = 3.0 V
9
9
8
dBm
VCC = 3.3 V
12
11
10
dBm
VCC = 3.6 V
14
12
11
dBm
VCC = 3.0 V
10
9
8
dBm
VCC = 3.3 V
12
11
10
dBm
VCC = 3.6 V
13
12
11
dBm
f1 = 950 MHz;
f2 = 951 MHz;
Pdrive = 36 dBm
f1 = 2150 MHz;
f2 = 2151 MHz;
Pdrive = 36 dBm
VCC = 3.0 V
8
7
5
dBm
VCC = 3.3 V
10
8
6
dBm
VCC = 3.6 V
11
9
7
dBm
Table 14. 3 dB bandwidth over temperature and supply voltages
Typical values.
Symbol
B3dB
BGA2800
Product data sheet
Parameter
Conditions
3 dB bandwidth
Tamb (C)
Unit
40
+25
+85
VCC = 3.0 V
3.287
3.198
3.082
GHz
VCC = 3.3 V
3.240
3.162
3.055
GHz
VCC = 3.6 V
3.226
3.144
3.034
GHz
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 13 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
12 of 18
BGA2800
NXP Semiconductors
MMIC wideband amplifier
9. Test information
PP
,&
PP
&
&
&
DDO
True size = 30 mm 30 mm.
Fig 12. PCB layout and demo board with components
Table 15.
List of components used for the typical application
Component
BGA2800
Product data sheet
Description
Value
C1, C2
multilayer ceramic chip capacitor
100 pF
0603
C3
multilayer ceramic chip capacitor
22 nF
0603
IC1
BGA2800 MMIC
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 13 July 2015
Dimensions
SOT363
© NXP Semiconductors N.V. 2015. All rights reserved.
13 of 18
BGA2800
NXP Semiconductors
MMIC wideband amplifier
10. Package outline
3ODVWLFVXUIDFHPRXQWHGSDFNDJH OHDGV
627
'
%
$
(
\
;
+(
Y 0 $
4
SLQ
LQGH[
$
$
H
ES
F
/S
Z 0 %
H
GHWDLO;
PP
VFDOH
',0(16,216 PPDUHWKHRULJLQDOGLPHQVLRQV
81,7
$
$
PD[
ES
F
'
(
H
H
+(
/S
4
Y
Z
\
PP
287/,1(
9(56,21
5()(5(1&(6
,(&
627
-('(&
-(,7$
6&
(8523($1
352-(&7,21
,668('$7(
Fig 13. Package outline SOT363
BGA2800
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 13 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
14 of 18
BGA2800
NXP Semiconductors
MMIC wideband amplifier
11. Abbreviations
Table 16.
Abbreviations
Acronym
Description
IF
Intermediate Frequency
LNA
Low-Noise Amplifier
LNB
Low-Noise Block converter
PCB
Printed-Circuit Board
SMD
Surface Mounted Device
12. Revision history
Table 17.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGA2800 v.5
20150713
Product data sheet
-
BGA2800 v.4
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
•
Legal texts have been adapted to the new company name where appropriate.
BGA2800 v.4
20141208
Product data sheet
-
BGA2800 v.3
BGA2800 v.3
20121010
Product data sheet
-
BGA2800 v.2
BGA2800 v.2
20101018
Product data sheet
-
BGA2800 v.1
BGA2800 v.1
20100803
Product data sheet
-
-
BGA2800
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 13 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
15 of 18
BGA2800
NXP Semiconductors
MMIC wideband amplifier
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BGA2800
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 13 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
16 of 18
BGA2800
NXP Semiconductors
MMIC wideband amplifier
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BGA2800
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 13 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
17 of 18
BGA2800
NXP Semiconductors
MMIC wideband amplifier
15. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
8.1
8.2
8.3
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Application information. . . . . . . . . . . . . . . . . . . 4
Application examples . . . . . . . . . . . . . . . . . . . . 4
Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Test information . . . . . . . . . . . . . . . . . . . . . . . . 13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Contact information. . . . . . . . . . . . . . . . . . . . . 17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 July 2015
Document identifier: BGA2800
工商网监
湘ICP备2023018690号
