0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
BT138Y

BT138Y

  • 厂商:

    NXP(恩智浦)

  • 封装:

  • 描述:

    BT138Y - 12 A four-quadrant triacs, sensitive gate, insulated - NXP Semiconductors

  • 数据手册
  • 价格&库存
BT138Y 数据手册
BT138Y series E 12 A four-quadrant triacs, sensitive gate, insulated Rev. 01 — 3 June 2008 Product data sheet 1. Product profile 1.1 General description Passivated sensitive gate triac in an internally insulated TO-220 plastic package. 1.2 Features I Isolated mounting base I Sensitive gate I Direct interfacing to logic level ICs I 2500 V RMS isolation voltage I Gate triggering in four quadrants I Direct interfacing to low-power gate drive circuits 1.3 Applications I General-purpose switching and phase control I 230 V lamp dimmers 1.4 Quick reference data I IT(RMS) ≤ 12 A I VDRM ≤ 600 V (BT138Y-600E) I VDRM ≤ 800 V (BT138Y-800E) I IGT ≤ 10 mA I IGT ≤ 25 mA (T2− G+) I ITSM ≤ 95 A (t = 20 ms) 2. Pinning information Table 1. Pin 1 2 3 mb Pinning Description main terminal 1 (T1) main terminal 2 (T2) gate (G) mounting base; isolated mb T2 sym051 Simplified outline Graphic symbol T1 G 123 SOT78D (TO-220) NXP Semiconductors BT138Y series E 12 A four-quadrant triacs, sensitive gate, insulated 3. Ordering information Table 2. Ordering information Package Name BT138Y-600E BT138Y-800E TO-220 Description Version plastic single-ended package; isolated heatsink mounted; 1 mounting hole; SOT78D 3-lead TO-220 Type number 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDRM Parameter repetitive peak off-state voltage BT138Y-600E BT138Y-800E IT(RMS) ITSM RMS on-state current non-repetitive peak on-state current full sine wave; Tmb ≤ 85 °C; see Figure 4 and 5 full sine wave; Tj = 25 °C prior to surge; see Figure 2 and 3 t = 20 ms t = 16.7 ms I2t dIT/dt I2t for fusing tp = 10 ms ITM = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/µs T2+ G+ T2+ G− T2− G− T2− G+ IGM PGM PG(AV) Tstg Tj [1] [1] Conditions Min - Max 600 800 12 Unit V V A - 95 105 45 A A A2s rate of rise of on-state current - 50 50 50 10 2 5 0.5 +150 125 A/µs A/µs A/µs A/µs A W W °C °C peak gate current peak gate power average gate power storage temperature junction temperature over any 20 ms period −40 - Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 15 A/µs. BT138Y_SER_E_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 June 2008 2 of 12 NXP Semiconductors BT138Y series E 12 A four-quadrant triacs, sensitive gate, insulated 20 Ptot (W) 15 conduction angle (degrees) 30 60 90 120 180 form factor a 4 2.8 2.2 1.9 1.57 003aac227 α = 180° 120° α 90° 60° 30° 10 5 0 0 2 4 6 8 10 12 IT(RMS) (A) 14 α = conduction angle Fig 1. 120 ITSM (A) 100 Total power dissipation as a function of RMS on-state current; maximum values 003aac228 80 60 IT ITSM t 40 20 1/f Tj(init) = 25 °C max 0 1 10 102 number of cycles 103 f = 50 Hz Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values BT138Y_SER_E_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 June 2008 3 of 12 NXP Semiconductors BT138Y series E 12 A four-quadrant triacs, sensitive gate, insulated 103 ITSM (A) IT 003aac229 ITSM t tp Tj(init) = 25 °C max 102 (1) (2) 10 10-5 10-4 10-3 10-2 tp (s) 10-1 tp ≤ 20 ms (1) dIT/dt limit (2) T2− G+ quadrant limit Fig 3. 30 IT(RMS) (A) Non-repetitive peak on-state current as a function of pulse width; maximum values 003aac230 15 IT(RMS) (A) 003aac231 20 10 10 5 0 10-2 10-1 1 10 surge duration (s) 0 -50 0 50 100 150 Tmb (°C) f = 50 Hz Tmb = 85 °C Fig 4. RMS on-state current as a function of surge duration; maximum values Fig 5. RMS on-state current as a function of mounting base temperature; maximum values BT138Y_SER_E_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 June 2008 4 of 12 NXP Semiconductors BT138Y series E 12 A four-quadrant triacs, sensitive gate, insulated 5. Thermal characteristics Table 4. Symbol Rth(j-mb) Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to mounting base Conditions full cycle; see Figure 6 Min Typ 60 Max 2.3 Unit K/W K/W thermal resistance from junction to ambient full cycle; in free air 10 Zth(j-mb) (K/W) 1 003aab804 10−1 P 10−2 tp t 10−3 10−5 10−4 10−3 10−2 10−1 1 tp (s) 10 Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width 6. Isolation characteristics Table 5. Isolation limiting values and characteristics Th = 25 °C unless otherwise specified. Symbol Visol(RMS) Parameter Conditions Min Typ Max 2500 Unit V RMS isolation voltage from all three terminals to external heatsink; f = 50 Hz to 60 Hz; sinusoidal waveform; RH ≤ 65 %; clean and dust free isolation capacitance from pin 2 to external heatsink; f = 1 MHz Cisol - 10 - pF BT138Y_SER_E_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 June 2008 5 of 12 NXP Semiconductors BT138Y series E 12 A four-quadrant triacs, sensitive gate, insulated 7. Static characteristics Table 6. Static characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter IGT gate trigger current Conditions VD = 12 V; IT = 0.1 A; see Figure 8 T2+ G+ T2+ G− T2− G− T2− G+ IL latching current VD = 12 V; IG = 0.1 A; see Figure 10 T2+ G+ T2+ G− T2− G− T2− G+ IH VT VGT ID holding current on-state voltage gate trigger voltage off-state current VD = 12 V; IG = 0.1 A; see Figure 11 IT = 15 A; see Figure 9 VD = 12 V; IT = 0.1 A; see Figure 7 VD = VDRM; IT = 0.1 A; Tj = 125 °C VD = VDRM(max); Tj = 125 °C 0.25 1.4 0.7 0.4 0.1 30 40 30 40 30 1.65 1.5 0.5 mA mA mA mA mA V V V mA 10 10 10 25 mA mA mA mA Min Typ Max Unit BT138Y_SER_E_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 June 2008 6 of 12 NXP Semiconductors BT138Y series E 12 A four-quadrant triacs, sensitive gate, insulated 8. Dynamic characteristics Table 7. dVD/dt tgt Dynamic characteristics Conditions Min Typ 50 2 Max Unit V/µs µs rate of rise of off-state voltage VDM = 0.67 × VDRM(max); Tj = 125 °C; exponential waveform; gate open circuit gate-controlled turn-on time ITM = 16 A; VD = VDRM(max); IG = 0.1 A; dIG/dt = 5 A/µs Symbol Parameter 1.6 VGT VGT(25°C) 1.2 003aac223 3 IGT IGT(25°C) (1) (2) (3) (4) (1) (2) (3) (4) 003aac224 2 0.8 1 0.4 0 −60 −10 40 90 Tj (°C) 140 0 −60 −10 40 90 Tj (°C) 140 (1) T2− G+ (2) T2− G− (3) T2+ G− (4) T2+ G+ Fig 7. Normalized gate trigger voltage as a function of junction temperature Fig 8. Normalized gate trigger current as a function of junction temperature BT138Y_SER_E_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 June 2008 7 of 12 NXP Semiconductors BT138Y series E 12 A four-quadrant triacs, sensitive gate, insulated 40 IT (A) 30 003aac214 3 IL IL(25°C) 003aac225 2 20 (1) (2) (3) 1 10 0 0 0.5 1 1.5 2 2.5 VT (V) 0 −60 −10 40 90 Tj (°C) 140 Vo = 1.175 V Rs = 0.032 Ω (1) Tj = 125 °C; typical values (2) Tj = 125 °C; maximum values (3) Tj = 25 °C; maximum values Fig 9. On-state current as a function of on-state voltage 2.0 IH IH(25°C) 1.5 Fig 10. Normalized latching current as a function of junction temperature 003aac226 1.0 0.5 0 −60 −10 40 90 Tj (°C) 140 Fig 11. Normalized holding current as a function of junction temperature BT138Y_SER_E_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 June 2008 8 of 12 NXP Semiconductors BT138Y series E 12 A four-quadrant triacs, sensitive gate, insulated 9. Package outline Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3-lead TO-220 SOT78D E p mounting base A A1 q D1 D L1 Q b2 L b1 1 2 3 w b e e M c 0 5 scale 10 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 4.7 4.3 A1 1.40 1.25 b 0.9 0.6 b1 1.4 1.1 b2 1.72 1.32 c 0.6 0.4 D 16.0 15.2 D1 ref 6.5 E 10.3 9.7 e 2.54 L 14.0 12.8 L1 ref 3.0 p 3.7 3.5 Q 2.6 2.2 q 3.0 2.7 w 0.2 OUTLINE VERSION SOT78D REFERENCES IEC JEDEC TO-220 JEITA EUROPEAN PROJECTION ISSUE DATE 07-04-04 07-07-10 Fig 12. Package outline SOT78D (TO-220) BT138Y_SER_E_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 June 2008 9 of 12 NXP Semiconductors BT138Y series E 12 A four-quadrant triacs, sensitive gate, insulated 10. Revision history Table 8. Revision history Release date 20080603 Data sheet status Product data sheet Change notice Supersedes Document ID BT138Y_SER_E_1 BT138Y_SER_E_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 June 2008 10 of 12 NXP Semiconductors BT138Y series E 12 A four-quadrant triacs, sensitive gate, insulated 11. Legal information 11.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 11.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BT138Y_SER_E_1 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 01 — 3 June 2008 11 of 12 NXP Semiconductors BT138Y series E 12 A four-quadrant triacs, sensitive gate, insulated 13. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Isolation characteristics . . . . . . . . . . . . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 3 June 2008 Document identifier: BT138Y_SER_E_1
BT138Y 价格&库存

很抱歉,暂时无法提供与“BT138Y”相匹配的价格&库存,您可以联系我们找货

免费人工找货