PBSS302ND

PBSS302ND 40 V, 4 A NPN low VCEsat (BISS) transistor Rev. 02 — 18 February 2008 Product data sheet 1. Product profile 1.1 General description NPN low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT457 (SC-74) small Surface-Mounted Device (SMD) plastic package. PNP complement: PBSS302PD. 1.2 Features I I I I I Ultra low collector-emitter saturation voltage VCEsat 4 A continuous collector current capability IC Up to 15 A peak current Very low collector-emitter saturation resistance High efficiency due to less heat generation 1.3 Applications I I I I I I Power management functions Charging circuits DC-to-DC conversion MOSFET gate driving Power switches (e.g. motors, fans) Thin Film Transistor (TFT) backlight inverter 1.4 Quick reference data Table 1. Symbol VCEO IC ICM RCEsat [1] [2] Quick reference data Parameter collector-emitter voltage collector current peak collector current collector-emitter saturation resistance single pulse; tp ≤ 1 ms IC = 6 A; IB = 600 mA [2] Conditions open base [1] Min - Typ 55 Max 40 4 15 75 Unit V A A mΩ Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint. Pulse test: tp ≤ 300 µs; δ ≤ 0.02. NXP Semiconductors PBSS302ND 40 V, 4 A NPN low VCEsat (BISS) transistor 2. Pinning information Table 2. Pin 1 2 3 4 5 6 Pinning Description collector collector base emitter collector collector 1 2 3 6 5 4 3 4 sym014 Simplified outline Symbol 1, 2, 5, 6 3. Ordering information Table 3. Ordering information Package Name PBSS302ND SC-74 Description plastic surface-mounted package (TSOP6); 6 leads Version SOT457 Type number 4. Marking Table 4. Marking codes Marking code C7 Type number PBSS302ND 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IC ICM IB IBM Ptot Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current peak collector current base current peak base current total power dissipation single pulse; tp ≤ 1 ms Tamb ≤ 25 °C [2] [3] [4] [1] [2][5] Conditions open emitter open base open collector [1] Min - Max 60 40 5 4 15 0.8 2 360 600 750 1.1 2.5 Unit V V V A A A A mW mW mW W W single pulse; tp ≤ 1 ms PBSS302ND_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 18 February 2008 2 of 14 NXP Semiconductors PBSS302ND 40 V, 4 A NPN low VCEsat (BISS) transistor Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Tj Tamb Tstg [1] [2] [3] [4] [5] Parameter junction temperature ambient temperature storage temperature Conditions Min −65 −65 Max 150 +150 +150 Unit °C °C °C Device mounted on a ceramic PCB, Al2O3, standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. Operated under pulsed conditions: Duty cycle δ ≤ 10 % and pulse width tp ≤ 10 ms. 1600 Ptot (mW) 1200 (1) 006aaa270 800 (2) (3) 400 (4) 0 −75 −25 25 75 125 175 Tamb (°C) (1) Ceramic PCB, Al2O3, standard footprint (2) FR4 PCB, mounting pad for collector 6 cm2 (3) FR4 PCB, mounting pad for collector 1 cm2 (4) FR4 PCB, standard footprint Fig 1. Power derating curves PBSS302ND_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 18 February 2008 3 of 14 NXP Semiconductors PBSS302ND 40 V, 4 A NPN low VCEsat (BISS) transistor 6. Thermal characteristics Table 6. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air [1] [2] [3] [4] [1][5] Min - Typ - Max 350 208 167 113 50 45 Unit K/W K/W K/W K/W K/W K/W Rth(j-sp) [1] [2] [3] [4] [5] thermal resistance from junction to solder point Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. Device mounted on a ceramic PCB, Al2O3, standard footprint. Operated under pulsed conditions: Duty cycle δ ≤ 10 % and pulse width tp ≤ 10 ms. 103 Zth(j-a) (K/W) 102 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 10 0.02 0.01 1 006aaa271 0 10−1 10−5 10−4 10−3 10−2 10−1 1 10 102 tp (s) 103 FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PBSS302ND_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 18 February 2008 4 of 14 NXP Semiconductors PBSS302ND 40 V, 4 A NPN low VCEsat (BISS) transistor 103 Zth(j-a) (K/W) 102 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 10 0.05 0.02 0.01 1 0 10−1 10−5 006aaa272 10−4 10−3 10−2 10−1 1 10 102 tp (s) 103 FR4 PCB, mounting pad for collector 1 cm2 Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 103 Zth(j-a) (K/W) 102 006aaa273 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 10 1 0 10−1 10−5 10−4 10−3 10−2 10−1 1 10 102 tp (s) 103 FR4 PCB, mounting pad for collector 6 cm2 Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PBSS302ND_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 18 February 2008 5 of 14 NXP Semiconductors PBSS302ND 40 V, 4 A NPN low VCEsat (BISS) transistor 7. Characteristics Table 7. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter ICBO Conditions Min 300 [1] [1] [1] [1] Typ 500 475 385 190 100 35 65 115 220 330 55 0.79 0.81 0.83 1.0 0.79 12 52 64 390 120 510 150 30 Max 0.1 50 0.1 0.1 60 110 180 300 450 75 0.85 0.9 1 1.1 1.0 - Unit µA µA µA µA collector-base cut-off VCB = 40 V; IE = 0 A current VCB = 40 V; IE = 0 A; Tj = 150 °C collector-emitter cut-off current emitter-base cut-off current DC current gain VCE = 30 V; VBE = 0 V VEB = 5 V; IC = 0 A VCE = 2 V; IC = 0.5 A VCE = 2 V; IC = 1 A VCE = 2 V; IC = 2 A VCE = 2 V; IC = 4 A VCE = 2 V; IC = 6 A ICES IEBO hFE 300 250 100 50 - VCEsat collector-emitter saturation voltage IC = 0.5 A; IB = 50 mA IC = 1 A; IB = 50 mA IC = 2 A; IB = 200 mA IC = 4 A; IB = 400 mA IC = 6 A; IB = 600 mA [1] [1] [1] mV mV mV mV mV mΩ V V V V V ns ns ns ns ns ns MHz pF - RCEsat VBEsat collector-emitter IC = 6 A; IB = 600 mA saturation resistance base-emitter saturation voltage IC = 0.5 A; IB = 50 mA IC = 1 A; IB = 50 mA IC = 1 A; IB = 100 mA IC = 4 A; IB = 400 mA [1] [1] - VBEon td tr ton ts tf toff fT Cc [1] base-emitter turn-on VCE = 2 V; IC = 2 A voltage delay time rise time turn-on time storage time fall time turn-off time transition frequency VCE = 10 V; IC = 0.1 A; f = 100 MHz VCC = 10 V; IC = 2 A; IBon = 0.1 A; IBoff = −0.1 A - collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz Pulse test: tp ≤ 300 µs; δ ≤ 0.02. PBSS302ND_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 18 February 2008 6 of 14 NXP Semiconductors PBSS302ND 40 V, 4 A NPN low VCEsat (BISS) transistor 1000 hFE 800 (1) 006aaa274 14 IC (A) 12 10 IB (mA) = 400 360 320 280 240 200 160 120 80 40 006aaa280 600 (2) 8 6 400 (3) 4 200 2 0 10−1 0 0 0.4 0.8 1.2 1.6 2.0 VCE (V) 1 10 102 103 104 105 IC (mA) VCE = 2 V (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Tamb = 25 °C Fig 5. DC current gain as a function of collector current; typical values 1.6 VBE (V) 1.2 006aaa275 Fig 6. Collector current as a function of collector-emitter voltage; typical values 006aaa344 1.6 VBEsat (V) 1.2 (1) 0.8 (1) (2) (3) 0.8 (2) (3) 0.4 0.4 0 10−1 1 10 102 103 104 105 IC (mA) 0 10−1 1 10 102 103 104 105 IC (mA) VCE = 2 V (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 100 °C IC/IB = 20 (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 100 °C Fig 7. Base-emitter voltage as a function of collector current; typical values Fig 8. Base-emitter saturation voltage as a function of collector current; typical values PBSS302ND_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 18 February 2008 7 of 14 NXP Semiconductors PBSS302ND 40 V, 4 A NPN low VCEsat (BISS) transistor 1 VCEsat (V) 10−1 006aaa276 1 VCEsat (V) 10−1 (1) (2) 006aaa277 (1) (2) (3) 10−2 10−2 (3) 10−3 10−1 1 10 102 103 104 105 IC (mA) 10−3 10−1 1 10 102 103 104 105 IC (mA) IC/IB = 20 (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Tamb = 25 °C (1) IC/IB = 100 (2) IC/IB = 50 (3) IC/IB = 10 Fig 9. Collector-emitter saturation voltage as a function of collector current; typical values 103 RCEsat (Ω) 102 006aaa281 Fig 10. Collector-emitter saturation voltage as a function of collector current; typical values 103 RCEsat (Ω) 102 (1) 006aaa326 10 10 (2) (3) 1 (1) (2) (3) 1 10−1 10−1 10−2 10−1 1 10 102 103 104 105 IC (mA) 10−2 10−1 1 10 102 103 104 105 IC (A) IC/IB = 20 (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Tamb = 25 °C (1) IC/IB = 100 (2) IC/IB = 50 (3) IC/IB = 10 Fig 11. Collector-emitter saturation resistance as a function of collector current; typical values Fig 12. Collector-emitter saturation resistance as a function of collector current; typical values PBSS302ND_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 18 February 2008 8 of 14 NXP Semiconductors PBSS302ND 40 V, 4 A NPN low VCEsat (BISS) transistor 8. Test information IB 90 % input pulse (idealized waveform) IBon (100 %) 10 % IBoff IC 90 % output pulse (idealized waveform) IC (100 %) 10 % t td ton tr ts toff tf 006aaa003 Fig 13. BISS transistor switching time definition VBB VCC RB (probe) oscilloscope 450 Ω VI R1 R2 RC Vo (probe) 450 Ω DUT oscilloscope mlb826 VCC = 10 V; IC = 2 A; IBon = 0.1 A; IBoff = −0.1 A Fig 14. Test circuit for switching times PBSS302ND_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 18 February 2008 9 of 14 NXP Semiconductors PBSS302ND 40 V, 4 A NPN low VCEsat (BISS) transistor 9. Package outline 3.1 2.7 6 5 4 0.6 0.2 1.1 0.9 3.0 2.5 1.7 1.3 pin 1 index 1 0.95 1.9 Dimensions in mm 2 3 0.40 0.25 0.26 0.10 04-11-08 Fig 15. Package outline SOT457 (SC-74) 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PBSS302ND Package SOT457 Description 4 mm pitch, 8 mm tape and reel; T1 4 mm pitch, 8 mm tape and reel; T2 [1] [2] [3] [2] [3] Packing quantity 3000 -115 -125 10000 -135 -165 For further information and the availability of packing methods, see Section 14. T1: normal taping T2: reverse taping PBSS302ND_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 18 February 2008 10 of 14 NXP Semiconductors PBSS302ND 40 V, 4 A NPN low VCEsat (BISS) transistor 11. Soldering 3.45 1.95 solder lands 0.95 3.30 2.825 0.45 0.55 occupied area solder paste solder resist 1.60 1.70 3.10 3.20 msc422 Dimensions in mm Fig 16. Reflow soldering footprint SOT457 (SC-74) 5.30 solder lands 5.05 0.45 1.45 4.45 solder resist occupied area 1.40 4.30 msc423 Dimensions in mm Fig 17. Wave soldering footprint SOT457 (SC-74) PBSS302ND_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 18 February 2008 11 of 14 NXP Semiconductors PBSS302ND 40 V, 4 A NPN low VCEsat (BISS) transistor 12. Revision history Table 9. Revision history Release date 20080218 Data sheet status Product data sheet Change notice Supersedes PBSS302ND_1 Document ID PBSS302ND_2 Modifications: • • • • • • • • • • • • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Section 1.1 “General description”: amended Section 1.4 “Quick reference data”: ICM conditions amended Figure 2, 3, 4, and 6: amended Table 5: ICM conditions amended Table 5: IBM conditions amended Table 6: typing error for maximum value on 6 cm2 footprint amended Table 7: typical values for hFE added Section 8 “Test information”: added Section 11 “Soldering”: added Section 13 “Legal information”: updated Product data sheet - PBSS302ND_1 20050419 PBSS302ND_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 18 February 2008 12 of 14 NXP Semiconductors PBSS302ND 40 V, 4 A NPN low VCEsat (BISS) transistor 13. Legal information 13.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com PBSS302ND_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 18 February 2008 13 of 14 NXP Semiconductors PBSS302ND 40 V, 4 A NPN low VCEsat (BISS) transistor 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Packing information. . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 18 February 2008 Document identifier: PBSS302ND_2