PTN3360A
Enhanced performance HDMI/DVI level shifter with inverting
HPD
Rev. 02 — 8 October 2009
Product data sheet
1. General description
The PTN3360A is a high-speed level shifter device which converts four lanes of low-swing
AC-coupled differential input signals to DVI v1.0 and HDMI v1.3a compliant open-drain
current-steering differential output signals, up to 2.5 Gbit/s per lane. Each of these lanes
provides a level-shifting differential buffer to translate from low-swing AC-coupled
differential signaling on the source side, to TMDS-type DC-coupled differential
current-mode signaling terminated into 50 Ω to 3.3 V on the sink side. Additionally, the
PTN3360A provides a single-ended active buffer for voltage translation of the HPD signal
from 5 V on the sink side to 1.1 V on the source side and provides a channel for level
shifting of the DDC channel (consisting of a clock and a data line) between 3.3 V
source-side and 5 V sink-side. The DDC channel is implemented using pass-gate
technology providing level shifting as well as disablement (isolation between source and
sink) of the clock and data lines.
The low-swing AC-coupled differential input signals to the PTN3360A typically come from
a display source with multi-mode I/O, which supports multiple display standards, e.g.,
DisplayPort, HDMI and DVI. While the input differential signals are configured to carry DVI
or HDMI coded data, they do not comply with the electrical requirements of the DVI v1.0 or
HDMI v1.3a specification. By using PTN3360A, chip set vendors are able to implement
such reconfigurable I/Os on multi-mode display source devices, allowing the support of
multiple display standards while keeping the number of chip set I/O pins low. See
Figure 1.
The PTN3360A main high-speed differential lanes feature low-swing self-biasing
differential inputs which are compliant to the electrical specifications of DisplayPort
Standard v1.1 and/or PCI Express Standard v1.1, and open-drain current-steering
differential outputs compliant to DVI v1.0 and HDMI v1.3a electrical specifications. The
I2C-bus channel level-translates the DDC signals between 3.3 V (source) and 5.0 V (sink).
The PTN3360A is a fully featured HDMI as well as DVI level shifter. It is functionally
equivalent to PTN3300A but provides higher speed performance and higher ESD
robustness. The PTN3360A is also equivalent to PTN3360B with the exception that
PTN3360A provides inverting level shifting on the HPD channel.
PTN3360A is powered from a single 3.3 V power supply consuming a small amount of
power (120 mW typ.) and is offered in a 48-terminal HVQFN48 package.
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
MULTI-MODE DISPLAY SOURCE
OE_N
PTN3360A
reconfigurable I/Os
PCIe PHY ELECTRICAL
TMDS
coded
data
PCIe
output buffer
TX
FF
OUT_D4+
OUT_D4−
AC-coupled
differential pair
TMDS data
IN_D4+
DATA LANE
IN_D4−
TX
TMDS
coded
data
PCIe
output buffer
TX
FF
AC-coupled
differential pair
TMDS data
OUT_D3+
OUT_D3−
IN_D3+
DATA LANE
IN_D3−
TX
PCIe
output buffer
TX
FF
AC-coupled
differential pair
TMDS data
DATA LANE
OUT_D2+
OUT_D2−
IN_D2+
DVI CONNECTOR
TMDS
coded
data
IN_D2−
TX
TMDS
clock
pattern
PCIe
output buffer
TX
FF
AC-coupled
differential pair
clock
CLOCK LANE
OUT_D1+
OUT_D1−
IN_D1+
IN_D1−
TX
0 V to 1.1 V
3.3 V
HPD_SOURCE_N
HPD_SINK
0 V to 5 V
DDC_EN
(0 V to 3.3 V)
3.3 V
5V
SCL_SOURCE
SCL_SINK
3.3 V
5V
DDC I/O
(I2C-bus)
CONFIGURATION
SDA_SOURCE
SDA_SINK
002aae204
Remark: TMDS clock and data lanes can be assigned arbitrarily and interchangeably to D[4:1].
Fig 1.
Typical application system diagram
PTN3360A_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 8 October 2009
2 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
2. Features
2.1 High-speed TMDS level shifting
n Converts four lanes of low-swing AC-coupled differential input signals to DVI v1.0 and
HDMI v1.3a compliant open-drain current-steering differential output signals
n TMDS level shifting operation up to 2.5 Gbit/s per lane (250 MHz character clock)
n Integrated 50 Ω termination resistors for self-biasing differential inputs
n Back-current safe outputs to disallow current when device power is off and monitor is
on
n Disable feature to turn off TMDS inputs and outputs and to enter low-power state
2.2 DDC level shifting
n Integrated DDC level shifting (3.3 V source to 5 V sink side)
n 0 Hz to 400 kHz I2C-bus clock frequency
n Back-power safe sink-side terminals to disallow backdrive current when power is off or
when DDC is not enabled
2.3 HPD level shifting
n HPD inverting level shift from 0 V on the sink side to 1.1 V on the source side, or from
5 V on the sink side to 0 V on the source side
n Integrated 200 kΩ pull-down resistor on HPD sink input guarantees ‘input LOW’ when
no display is plugged in
n Back-power safe design on HPD_SINK to disallow backdrive current when power is off
2.4 General
n
n
n
n
n
Power supply 3.3 V ± 10 %
ESD resilience to 8 kV HBM, 500 V CDM
Power-saving modes (using output enable)
Back-current-safe design on all sink-side main link, DDC and HPD terminals
Transparent operation: no re-timing or software configuration required
3. Ordering information
Table 1.
Ordering information
Type number
PTN3360ABS
Package
Name
Description
HVQFN48
plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; SOT619-1
body 7 × 7 × 0.85 mm
Version
PTN3360A_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 8 October 2009
3 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
4. Functional diagram
OE_N
PTN3360A
input bias
enable
50 Ω
OUT_D4+
OUT_D4−
50 Ω
IN_D4+
IN_D4−
enable
input bias
enable
50 Ω
OUT_D3+
OUT_D3−
50 Ω
IN_D3+
IN_D3−
enable
input bias
enable
50 Ω
OUT_D2+
OUT_D2−
50 Ω
IN_D2+
IN_D2−
enable
input bias
enable
50 Ω
OUT_D1+
OUT_D1−
50 Ω
IN_D1+
IN_D1−
enable
HPD level shifter
HPD_SOURCE_N
(0 V to 1.1 V)
DDC_EN (0 V to 3.3 V)
200 kΩ
HPD_SINK
(0 V to 5 V)
DDC level shifter
SCL_SOURCE
SCL_SINK
SDA_SOURCE
SDA_SINK
002aae205
Fig 2.
Functional diagram of PTN3360A
PTN3360A_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 8 October 2009
4 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
5. Pinning information
37 GND
38 IN_D1−
40 VDD
39 IN_D1+
41 IN_D2−
42 IN_D2+
43 GND
44 IN_D3−
46 VDD
45 IN_D3+
terminal 1
index area
47 IN_D4−
48 IN_D4+
5.1 Pinning
GND
1
36 GND
VDD
2
35 n.c.
n.c.
3
34 n.c.
n.c.
4
33 VDD
GND
5
32 DDC_EN
REXT
6
HPD_SOURCE_N
7
SDA_SOURCE
8
29 SDA_SINK
SCL_SOURCE
9
28 SCL_SINK
31 GND
PTN3360ABS
30 HPD_SINK
n.c. 10
27 GND
VDD 11
26 VDD
GND 24
OUT_D1− 23
OUT_D1+ 22
VDD 21
OUT_D2− 20
OUT_D2+ 19
GND 18
OUT_D3− 17
OUT_D3+ 16
VDD 15
OUT_D4− 14
25 OE_N
OUT_D4+ 13
GND 12
002aae206
Transparent top view
HVQFN48 package supply ground is connected to both GND pins and exposed center pad. GND
pins must be connected to supply ground for proper device operation. For enhanced thermal,
electrical, and board level performance, the exposed pad needs to be soldered to the board using
a corresponding thermal pad on the board and for proper heat conduction through the board,
thermal vias need to be incorporated in the PCB in the thermal pad region.
Fig 3.
Pin configuration for HVQFN48
PTN3360A_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 8 October 2009
5 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
5.2 Pin description
Table 2.
Pin description
Symbol
Pin
Type
Description
OE_N, IN_Dx and OUT_Dx signals
OE_N
25
3.3 V low-voltage
Output Enable and power saving function for high-speed differential
CMOS single-ended level shifter path.
input
When OE_N = HIGH:
IN_Dx termination = high-impedance
OUT_Dx outputs = high-impedance; zero output current
When OE_N = LOW:
IN_Dx termination = 50 Ω
OUT_Dx outputs = active
IN_D4+
48
Self-biasing
differential input
Low-swing differential input from display source with PCI Express
electrical signalling. IN_D4+ makes a differential pair with IN_D4−.
The input to this pin must be AC coupled externally.
IN_D4−
47
Self-biasing
differential input
Low-swing differential input from display source with PCI Express
electrical signalling. IN_D4− makes a differential pair with IN_D4+.
The input to this pin must be AC coupled externally.
IN_D3+
45
Self-biasing
differential input
Low-swing differential input from display source with PCI Express
electrical signalling. IN_D3+ makes a differential pair with IN_D3−.
The input to this pin must be AC coupled externally.
IN_D3−
44
Self-biasing
differential input
Low-swing differential input from display source with PCI Express
electrical signalling. IN_D3− makes a differential pair with IN_D3+.
The input to this pin must be AC coupled externally.
IN_D2+
42
Self-biasing
differential input
Low-swing differential input from display source with PCI Express
electrical signalling. IN_D2+ makes a differential pair with IN_D2−.
The input to this pin must be AC coupled externally.
IN_D2−
41
Self-biasing
differential input
Low-swing differential input from display source with PCI Express
electrical signalling. IN_D2− makes a differential pair with IN_D2+.
The input to this pin must be AC coupled externally.
IN_D1+
39
Self-biasing
differential input
Low-swing differential input from display source with PCI Express
electrical signalling. IN_D1+ makes a differential pair with IN_D1−.
The input to this pin must be AC coupled externally.
IN_D1−
38
Self-biasing
differential input
Low-swing differential input from display source with PCI Express
electrical signalling. IN_D1− makes a differential pair with IN_D1+.
The input to this pin must be AC coupled externally.
OUT_D4+
13
TMDS differential
output
HDMI compliant TMDS output. OUT_D4+ makes a differential pair
with OUT_D4−. OUT_D4+ is in phase with IN_D4+.
OUT_D4−
14
TMDS differential
output
HDMI compliant TMDS output. OUT_D4− makes a differential pair
with OUT_D4+. OUT_D4− is in phase with IN_D4−.
OUT_D3+
16
TMDS differential
output
HDMI compliant TMDS output. OUT_D3+ makes a differential pair
with OUT_D3−. OUT_D3+ is in phase with IN_D3+.
OUT_D3−
17
TMDS differential
output
HDMI compliant TMDS output. OUT_D3− makes a differential pair
with OUT_D3+. OUT_D3− is in phase with IN_D3−.
OUT_D2+
19
TMDS differential
output
HDMI compliant TMDS output. OUT_D2+ makes a differential pair
with OUT_D2−. OUT_D2+ is in phase with IN_D2+.
OUT_D2−
20
TMDS differential
output
HDMI compliant TMDS output. OUT_D2− makes a differential pair
with OUT_D2+. OUT_D2− is in phase with IN_D2−.
PTN3360A_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 8 October 2009
6 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
Table 2.
Pin description …continued
Symbol
Pin
Type
Description
OUT_D1+
22
TMDS differential
output
HDMI compliant TMDS output. OUT_D1+ makes a differential pair
with OUT_D1−. OUT_D1+ is in phase with IN_D1+.
OUT_D1−
23
TMDS differential
output
HDMI compliant TMDS output. OUT_D1− makes a differential pair
with OUT_D1+. OUT_D1− is in phase with IN_D1−.
HPD and DDC signals
HPD_SINK
30
5 V CMOS
single-ended input
0 V to 5 V (nominal) input signal. This signal comes from the DVI or
HDMI sink. A HIGH value indicates that the sink is connected; a
LOW value indicates that the sink is disconnected. HPD_SINK is
pulled down by an integrated 200 kΩ pull-down resistor.
HPD_SOURCE_
N
7
1.1 V CMOS
single-ended output
0 V to 1.1 V (nominal) output signal. This is level-shifted
logic-inverted version of the HPD_SINK signal.
SCL_SOURCE
9
single-ended 3.3 V
open-drain DDC I/O
3.3 V source-side DDC clock I/O. Pulled up by external termination
to 3.3 V.
SDA_SOURCE
8
single-ended 3.3 V
open-drain DDC I/O
3.3 V source-side DDC data I/O. Pulled up by external termination
to 3.3 V.
SCL_SINK
28
single-ended 5 V
open-drain DDC I/O
5 V sink-side DDC clock I/O. Pulled up by external termination to
5 V.
SDA_SINK
29
single-ended 5 V
open-drain DDC I/O
5 V sink-side DDC data I/O. Pulled up by external termination to 5 V.
DDC_EN
32
3.3 V CMOS input
Enables the DDC buffer and level shifter.
When DDC_EN = LOW, buffer/level shifter is disabled.
When DDC_EN = HIGH, buffer and level shifter are enabled.
Supply and ground
VDD
2, 11, 15, 3.3 V DC supply
21, 26, 33,
40, 46
VCC
-
GND[1]
ground
1, 5, 12,
18, 24, 27,
31, 36, 37,
43
Supply voltage; 3.3 V ± 10 %.
Supply ground. All GND pins must be connected to ground for
proper operation.
Feature control signals
REXT
6
analog I/O
Current sense port used to provide an accurate current reference
for the differential outputs OUT_Dx. For best output voltage swing
accuracy, use of a 10 kΩ resistor (1 % tolerance) from this terminal
to GND is recommended. May also be left open-circuit or tied to
either VDD or GND. See Section 6.2 for details.
3, 4, 10,
34, 35
no connection
to the die
Not connected. May be left open-circuit or tied to GND or VDD either
directly or via a resistor.
Miscellaneous
n.c.
[1]
HVQFN48 package supply ground is connected to both GND pins and exposed center pad. GND pins must be connected to supply
ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be
soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias
need to be incorporated in the PCB in the thermal pad region.
PTN3360A_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 8 October 2009
7 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
6. Functional description
Refer to Figure 2 “Functional diagram of PTN3360A”.
The PTN3360A level shifts four lanes of low-swing AC-coupled differential input signals to
DVI and HDMI compliant open-drain current-steering differential output signals, up to
2.5 Gbit/s per lane. It has integrated 50 Ω termination resistors for AC-coupled differential
input signals. An enable signal OE_N can be used to turn off the TMDS inputs and
outputs, thereby minimizing power consumption. The TMDS outputs, HPD_SINK input
and DDC_SINK I/Os are back-power safe to disallow current flow from a powered sink
while the PTN3360A is unpowered.
The PTN3360A's DDC channel provides active level shifting and buffering, allowing 3.3 V
source-side termination and 5 V sink-side termination. The sink-side DDC ports are
equipped with a rise time accelerator enabling drive of long cables or high bus
capacitance. This enables the system designer to isolate bus capacitance to meet HDMI
DDC version 1.3a distance specification. The PTN3360A offers back-power safe sink-side
I/Os to disallow backdrive current from the DDC clock and data lines when power is off or
when DDC is not enabled. An enable signal DCC_EN enables the DDC level shifter block.
The PTN3360A also provides voltage translation for the Hot Plug Detect (HPD) signal
from 0 V to 5 V on the sink side, inverting and level-shifting to 1.1V/0 V on the source side.
The PTN3360A does not re-time any data. It contains no state machines except for the
DDC/I2C-bus block. No inputs or outputs of the device are latched or clocked. Because
the PTN3360A acts as a transparent level shifter, no reset is required.
6.1 Enable and disable features
PTN3360A offers different ways to enable or disable functionality, using the Output Enable
(OE_N) and DDC Enable (DDC_EN) inputs. Whenever the PTN3360A is disabled, the
device will be in Standby mode and power consumption will be minimal; otherwise the
PTN3360A will be in Active mode and power consumption will be nominal. These two
inputs each affect the operation of PTN3360A differently: OE_N affects only the TMDS
channels, and DDC_EN affects only the DDC channel. HPD_SINK does not affect either
of the channels. The following sections and truth table describe their detailed operation.
6.1.1 Hot plug detect
The HPD channel of PTN3360A functions as a level-shifting buffer to pass the HPD logic
signal from the display sink device (via input HPD_SINK) on to the display source device
(via output HPD_SOURCE_N).
The output logic state of HPD_SOURCE_N output always follows the inverse logic state of
input HPD_SINK, regardless of whether the device is in Active or Standby mode.
PTN3360A_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 8 October 2009
8 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
6.1.2 Output Enable function (OE_N)
When input OE_N is asserted (active LOW), the IN_Dx and OUT_Dx signals are fully
functional. Input termination resistors are enabled and the internal bias circuits are turned
on.
When OE_N is de-asserted (inactive HIGH), the OUT_Dx outputs are in a
high-impedance state and drive zero output current. The IN_Dx input buffers are disabled
and IN_Dx termination is disabled. Power consumption is minimized.
Remark: Note that OE_N has no influence on the HPD_SINK input, HPD_SOURCE_N
output, or the SCL and SDA level shifters. OE_N only affects the high-speed TMDS
channel.
6.1.3 DDC channel enable function (DDC_EN)
The DDC_EN pin is active HIGH and can be used to isolate a badly behaved slave. When
DDC_EN is LOW, the DDC channel is turned off. The DDC_EN input should never change
state during an I2C-bus operation. Note that disabling DDC_EN during a bus operation will
hang the bus, while enabling DDC_EN during bus traffic would corrupt the I2C-bus
operation. Hence, DDC_EN should only be toggled while the bus is idle. (See I2C-bus
specification).
PTN3360A_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 8 October 2009
9 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
6.1.4 Enable/disable truth table
Table 3.
HPD_SINK, OE_N and DDC_EN enabling truth table
Inputs
Channels
HPD_SINK OE_N
DDC_EN IN_Dx
Mode
OUT_Dx[3]
DDC[4]
HPD_SOURCE_N
[1]
[2]
[5]
LOW
LOW
LOW
50 Ω termination enabled
to VRX(bias)
high-impedance
HIGH
Active;
DDC
disabled
LOW
LOW
HIGH
50 Ω termination enabled
to VRX(bias)
SDA_SINK
connected to
SDA_SOURCE
and SCL_SINK
connected to
SCL_SOURCE
HIGH
Active;
DDC
enabled
LOW
HIGH
LOW
high-impedance
high-impedance;
zero output current
high-impedance
HIGH
Standby
LOW
HIGH
HIGH
high-impedance
high-impedance;
zero output current
SDA_SINK
connected to
SDA_SOURCE
and SCL_SINK
connected to
SCL_SOURCE
HIGH
Standby;
DDC
enabled
HIGH
LOW
LOW
50 Ω termination enabled
to VRX(bias)
high-impedance
LOW
Active;
DDC
disabled
HIGH
LOW
HIGH
50 Ω termination enabled
to VRX(bias)
SDA_SINK
connected to
SDA_SOURCE
and SCL_SINK
connected to
SCL_SOURCE
LOW
Active;
DDC
enabled
HIGH
HIGH
LOW
high-impedance
high-impedance;
zero output current
high-impedance
LOW
Standby
HIGH
HIGH
HIGH
high-impedance
high-impedance;
zero output current
SDA_SINK
connected to
SDA_SOURCE
and SCL_SINK
connected to
SCL_SOURCE
LOW
Standby;
DDC
enabled
[1]
A HIGH level on input OE_N disables only the TMDS channels.
[2]
A LOW level on input DDC_EN disables only the DDC channel.
[3]
OUT_Dx channels ‘enabled’ means outputs OUT_Dx toggling in accordance with IN_Dx differential input voltage switching.
[4]
DDC channel ‘enabled’ means SDA_SINK is connected to SDA_SOURCE and SCL_SINK is connected to SCL_SOURCE.
[5]
The HPD_SOURCE_N output logic state always follows the inverse of the HPD_SINK input logic state.
PTN3360A_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 8 October 2009
10 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
6.2 Analog current reference
The REXT pin (pin 6) is an analog current sense port used to provide an accurate current
reference for the differential outputs OUT_Dx. For best output voltage swing accuracy, use
of a 10 kΩ resistor (1 % tolerance) connected between this terminal and GND is
recommended.
If an external 10 kΩ ± 1 % resistor is not used, this pin can be left open-circuit, or
connected to GND or VDD, either directly (0 Ω) or using pull-up or pull-down resistors of
value less than 10 kΩ. In any of these cases, the output will function normally but at
reduced accuracy over voltage and temperature of the following parameters: output levels
(VOL), differential output voltage swing, and rise and fall time accuracy.
6.3 Backdrive current protection
The PTN3360A is designed for backdrive prevention on all sink-side TMDS outputs,
sink-side DDC I/Os and the HPD_SINK input. This supports user scenarios where the
display is connected and powered, but the PTN3360A is unpowered. In these cases, the
PTN3360A will sink no more than a negligible amount of leakage current, and will block
the display (sink) termination network from driving the power supply of the PTN3360A or
that of the inactive DVI or HDMI source.
PTN3360A_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 8 October 2009
11 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VDD
supply voltage
VI
input voltage
Min
Max
Unit
−0.3
+4.6
V
3.3 V CMOS inputs
−0.3
VDD + 0.5
V
5.0 V CMOS inputs
−0.3
6.0
V
−65
+150
°C
HBM
[1]
-
8000
V
CDM
[2]
-
500
V
storage temperature
Tstg
VESD
electrostatic discharge
voltage
[1]
Human Body Model: ANSI/EOS/ESD-S5.1-1994, standard for ESD sensitivity testing, Human Body Model Component level; Electrostatic Discharge Association, Rome, NY, USA.
[2]
Charged-Device Model: ANSI/EOS/ESD-S5.3-1-1999, standard for ESD sensitivity testing,
Charged-Device Model - Component level; Electrostatic Discharge Association, Rome, NY, USA.
8. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
Parameter
VDD
supply voltage
VI
input voltage
Conditions
3.3 V CMOS inputs
5.0 V CMOS inputs
VI(AV)
average input voltage IN_Dn+, IN_Dn− inputs
Rref(ext)
external reference
resistance[2]
Tamb
ambient temperature operating in free air
connected between pin
REXT (pin 6) and GND
[1]
Min
Typ
Max
Unit
3.0
3.3
3.6
V
0
-
3.6
V
0
-
5.5
V
-
0
-
V
-
10 ± 1 %
-
kΩ
−40
-
+85
°C
[1]
Input signals to these pins must be AC-coupled.
[2]
Operation without external reference resistor is possible but will result in reduced output voltage swing
accuracy. For details, see Section 6.2.
8.1 Current consumption
Table 6.
Current consumption
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IDD
supply current
OE_N = 0; Active mode
10
35
50
mA
OE_N = 1 and DDC_EN = 0;
Standby mode
-
0.8
1.5
mA
PTN3360A_2
Product data sheet
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PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
9. Characteristics
9.1 Differential inputs
Table 7.
Symbol
UI
Differential input characteristics for IN_Dx signals
Parameter
unit
Conditions
interval[1]
[2]
[3]
VRX_DIFFp-p
differential input peak-to-peak voltage
TRX_EYE
receiver eye time
minimum eye width at
IN_Dx input pair
Vi(cm)M(AC)
peak common-mode input voltage (AC)
includes all frequencies
above 30 kHz
ZRX_DC
DC input impedance
VRX(bias)
ZI(se)
[4]
Min
Typ
Max
Unit
360
-
4000
ps
0.175
-
1.200
V
0.8
-
-
UI
-
-
100
mV
40
50
60
Ω
bias receiver voltage
[5]
1.0
1.2
1.4
V
single-ended input impedance
[6]
100
-
-
kΩ
inputs in
high-impedance state
[1]
UI (unit interval) = tbit (bit time).
[2]
UI is determined by the display mode. Nominal bit rate ranges from 250 Mbit/s to 2.5 Gbit/s per lane. Nominal UI at 2.5 Gbit/s = 400 ps.
360 ps = 400 ps − 10 %.
[3]
VRX_DIFFp-p = 2 × |VRX_D+ − VRX_D−|. Applies to IN_Dx signals.
[4]
Vi(cm)M(AC) = |VRX_D+ + VRX_D−| / 2 − VRX(cm).
VRX(cm) = DC (avg) of |VRX_D+ + VRX_D−| / 2.
[5]
Intended to limit power-up stress on chip set’s PCIe output buffers.
[6]
Differential inputs will switch to a high-impedance state when OE_N is LOW.
PTN3360A_2
Product data sheet
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Rev. 02 — 8 October 2009
13 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
9.2 Differential outputs
The level shifter’s differential outputs are designed to meet HDMI version 1.3 and
DVI version 1.0 specifications.
Table 8.
Symbol
Differential output characteristics for OUT_Dx signals
Parameter
Conditions
Min
Typ
VTT − 0.01 VTT
Max
Unit
VOH(se)
single-ended HIGH-level
output voltage
[1]
VOL(se)
single-ended LOW-level
output voltage
[2]
VTT − 0.60 VTT − 0.50 VTT − 0.40 V
∆VO(se)
single-ended output
voltage variation
logic 1 and logic 0 state applied
respectively to differential inputs
IN_Dn; Rref(ext) connected;
see Table 5
[3]
400
IOZ
OFF-state output current
single-ended
-
tr
rise time
20 % to 80 %
[4]
75
80 % to 20 %
[4]
75
intra-pair
[5]
inter-pair
[6]
jitter contribution
[7]
fall time
tf
skew time
tsk
jitter time
tjit
[1]
500
VTT + 0.01 V
600
mV
-
10
µA
-
160
ps
-
160
ps
-
-
10
ps
-
-
250
ps
-
-
7.4
ps
VTT is the DC termination voltage in the HDMI or DVI sink. VTT is nominally 3.3 V.
[2]
The open-drain output pulls down from VTT.
[3]
Swing down from TMDS termination voltage (3.3 V ± 10 %).
[4]
Maximum rise/fall time at 2.5 Gbit/s = 400 ps. 360 ps = 400 ps − 10 %.
[5]
This differential skew budget is in addition to the skew presented between IN_D+ and IN_D− paired input pins.
[6]
This lane-to-lane skew budget is in addition to skew between differential input pairs.
[7]
Jitter budget for differential signals as they pass through the level shifter.
PTN3360A_2
Product data sheet
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Rev. 02 — 8 October 2009
14 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
9.3 HPD_SINK input, HPD_SOURCE_N output
Table 9.
Symbol
HPD characteristics
Parameter
Conditions
VIH
HIGH-level input voltage
HPD_SINK
VIL
LOW-level input voltage
HPD_SINK
[1]
Min
Typ
Max
Unit
2.0
5.0
5.3
V
0
-
0.8
V
ILI
input leakage current
HPD_SINK
-
-
10
µA
VOH
HIGH-level output voltage
HPD_SOURCE_N; IOH = 100 µA;
HPD_SINK = LOW
0.7
-
1.1
V
VOL
LOW-level output voltage
HPD_SOURCE_N; IOH = 100 µA;
HPD_SINK = HIGH
0
-
0.2
V
tPD
propagation delay
from HPD_SINK to HPD_SOURCE_N;
50 % to 50 %; CL = 10 pF
[3]
-
-
200
ns
tt
transition time
HPD_SOURCE_N rise/fall;
10 % to 90 %; CL = 10 pF
[4]
1
-
20
ns
Rpd
pull-down resistance
HPD_SINK input pull-down resistor
[5]
100
200
300
kΩ
[2]
[1]
Low-speed input changes state on cable plug/unplug.
[2]
Measured with HPD_SINK at VIH maximum and VIL minimum.
[3]
Time from HPD_SINK changing state to HPD_SOURCE_N changing state. Includes HPD_SOURCE_N rise/fall time.
[4]
Time required to transition from VOH to VOL or from VOL to VOH.
[5]
Guarantees HPD_SINK is LOW when no display is plugged in.
9.4 OE_N, DDC_EN inputs
Table 10.
OE_N, DDC_EN and DDET input characteristics
Symbol
Parameter
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
input leakage current
ILI
[1]
Conditions
OE_N pin
[1]
Min
Typ
Max
Unit
2.0
-
-
V
-
-
0.8
V
-
-
10
µA
Measured with input at VIH maximum and VIL minimum.
9.5 DDC characteristics
Table 11.
DDC characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fclk
clock frequency
SCL_SOURCE, SDA_SOURCE, SCL_SINK,
SDA_SINK
-
-
400
kHz
ON state (DDC_EN = HIGH)
RON
ON resistance
pass gate in ON state; IO = 15 mA; VO = 0.4 V
-
7
30
Ω
VO(sw)
switch output voltage
source side; VI = 3.3 V; IO = −100 µA
1.7
2.1
2.5
V
sink side; VI = 5.0 V; IO = −100 µA
1.7
2.1
2.5
V
VI = 3.3 V
-
5
10
pF
source side; 0 V < VI < 3.3 V
−10
-
+10
µA
sink side; 0 V < VI < 5.0 V
−10
-
+10
µA
VI = 3.3 V
-
1
5
pF
Cio
input/output capacitance
OFF state (DDC_EN = LOW)
ILI
Cio
input leakage current
input/output capacitance
PTN3360A_2
Product data sheet
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Rev. 02 — 8 October 2009
15 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
10. Package outline
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 7 x 7 x 0.85 mm
A
B
D
SOT619-1
terminal 1
index area
A
E
A1
c
detail X
C
e1
1/2 e
e
24
y
y1 C
v M C A B
w M C
b
13
L
25
12
e
e2
Eh
1/2 e
1
36
terminal 1
index area
48
37
Dh
X
0
2.5
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A(1)
max.
A1
b
1
0.05
0.00
0.30
0.18
5 mm
c
D (1)
Dh
E (1)
Eh
0.2
7.1
6.9
5.25
4.95
7.1
6.9
5.25
4.95
e
e1
5.5
0.5
e2
L
v
5.5
0.5
0.3
0.1
w
0.05
y
y1
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Fig 4.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT619-1
---
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
01-08-08
02-10-18
Package outline SOT619-1 (HVQFN48)
PTN3360A_2
Product data sheet
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Rev. 02 — 8 October 2009
16 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
11. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
11.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
11.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
11.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
PTN3360A_2
Product data sheet
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Rev. 02 — 8 October 2009
17 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
11.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 5) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 12 and 13
Table 12.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 13.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 5.
PTN3360A_2
Product data sheet
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Rev. 02 — 8 October 2009
18 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 5.
Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
12. Abbreviations
Table 14.
Abbreviations
Acronym
Description
CDM
Charged-Device Model
DDC
Data Display Channel
DVI
Digital Visual Interface
ESD
ElectroStatic Discharge
HBM
Human Body Model
HDMI
High-Definition Multimedia Interface
HPD
Hot Plug Detect
I2C-bus
Inter-IC bus
I/O
Input/Output
TMDS
Transition Minimized Differential Signaling
13. Revision history
Table 15.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PTN3360A_2
20091008
Product data sheet
-
PTN3360A_1
Modifications:
PTN3360A_1
•
Table 8 “Differential output characteristics for OUT_Dx signals”, Table note [7]: deleted second
sentence
20090504
Product data sheet
PTN3360A_2
Product data sheet
-
-
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 8 October 2009
19 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
14.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
14.4 Licenses
Purchase of NXP ICs with HDMI technology
Use of an NXP IC with HDMI technology in equipment that complies with
the HDMI standard requires a license from HDMI Licensing LLC, 1060 E.
Arques Avenue Suite 100, Sunnyvale CA 94085, USA, e-mail:
admin@hdmi.org.
14.5 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PTN3360A_2
Product data sheet
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Rev. 02 — 8 October 2009
20 of 21
PTN3360A
NXP Semiconductors
Enhanced HDMI/DVI level shifter with inverting 1.1 V HPD
16. Contents
1
2
2.1
2.2
2.3
2.4
3
4
5
5.1
5.2
6
6.1
6.1.1
6.1.2
6.1.3
6.1.4
6.2
6.3
7
8
8.1
9
9.1
9.2
9.3
9.4
9.5
10
11
11.1
11.2
11.3
11.4
12
13
14
14.1
14.2
14.3
14.4
14.5
15
16
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
High-speed TMDS level shifting . . . . . . . . . . . . 3
DDC level shifting . . . . . . . . . . . . . . . . . . . . . . . 3
HPD level shifting . . . . . . . . . . . . . . . . . . . . . . . 3
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . . 8
Enable and disable features . . . . . . . . . . . . . . . 8
Hot plug detect . . . . . . . . . . . . . . . . . . . . . . . . . 8
Output Enable function (OE_N) . . . . . . . . . . . . 9
DDC channel enable function (DDC_EN). . . . . 9
Enable/disable truth table . . . . . . . . . . . . . . . . 10
Analog current reference . . . . . . . . . . . . . . . . 11
Backdrive current protection . . . . . . . . . . . . . . 11
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
Recommended operating conditions. . . . . . . 12
Current consumption . . . . . . . . . . . . . . . . . . . 12
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13
Differential inputs . . . . . . . . . . . . . . . . . . . . . . 13
Differential outputs . . . . . . . . . . . . . . . . . . . . . 14
HPD_SINK input, HPD_SOURCE_N output . 15
OE_N, DDC_EN inputs. . . . . . . . . . . . . . . . . . 15
DDC characteristics . . . . . . . . . . . . . . . . . . . . 15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
Soldering of SMD packages . . . . . . . . . . . . . . 17
Introduction to soldering . . . . . . . . . . . . . . . . . 17
Wave and reflow soldering . . . . . . . . . . . . . . . 17
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 17
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 18
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19
Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Contact information. . . . . . . . . . . . . . . . . . . . . 20
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 October 2009
Document identifier: PTN3360A_2
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