SSL5031CTS/1X

SSL5031CTS Compact high power factor/low-THD buck LED driver IC Rev. 2 — 11 March 2015 Product data sheet 1. General description The SSL5031CTS is a highly integrated, high-precision, non-isolated buck controller with external MOSFET. It is intended to drive LED lamps in universal mains non-dimmable lighting applications up to 25 W. The SSL5031CTS is designed for high power factor/low-THD applications. The SSL5031CTS operates in Boundary Conduction Mode (BCM) with on-time regulation. Operating in BCM provides a constant output current control with high accuracy. Adaptive switching frequency gives freedom to choose the inductor, which enables the optimization of inductor size, efficiency and EMI. The SSL5031CTS starts up and operates in switching mode directly from an external resistor without dV/dt supply or auxiliary supply. This feature simplifies the VCC supply. It allows a low-cost off-the-shelf inductor to be used, providing flexibility in application design. The SSL5031CTS comes in a compact TSOP6 package. The SSL5031BTS is best suited for high power factor/low THD applications with a high-temperature foldback function. The SSL5021BTS is suitable for low-ripple applications. 2. Features and benefits  Driving LED strings from a rectified mains supply, high power factor/low-THD  Small electronic Bill of Materials (BOM) enabling a compact solution and a small, single layer Printed-Circuit Board (PCB) footprint  Excellent line and load regulation and LED output current accuracy  Efficient BCM operation with:  Minimal reverse recovery losses in freewheel diode  Zero Current Switching (ZCS) and valley switching for switch turn-on  Minimal inductance value and size required  High efficiency (up to 91 %)  Ultra low IC current during operation (< 150 A)  Auto-recovery protections:  UnderVoltage LockOut (UVLO)  Cycle-by-cycle OverCurrent Protection (OCP)  Internal OverTemperature Protection (OTP)  Output OverVoltage Protection (OVP) SSL5031CTS NXP Semiconductors Compact high power factor/low-THD buck LED driver IC  Output Short Protection (OSP)  Compatible with wall switches with built-in standby indicator lights (Hotaru switch)  Extended IC lifetime 3. Applications  The SSL5031CTS is intended for low-cost, non-isolated LED lighting applications with accurate fixed current output up to 25 W for single mains or universal mains voltage (90 V (AC) to 277 V (AC)). 4. Quick reference data Table 1. Symbol Quick reference data Parameter Conditions Min Typ Max Unit 9.5 - 16 V Tj = 25 C - 0.75 0.90  Tj = 125 C - 1.20 -  VCC supply voltage operating range RDSon on-state resistance of internal switch [1] II(SW) input current in pin SW triangle wave; duty cycle < 20 % 2 - +2 A VI(SW) input voltage on pin SW 0.4 - +22 V [1] current limited at 8.8 mA; internal switch off An internal clamp sets the supply voltage. The current into the VCC pin must not exceed the maximum IVCC value (see Table 4). 5. Ordering information Table 2. Ordering information Type number SSL5031CTS SSL5031CTS Product data sheet Package Name Description Version TSOP6 plastic surface-mounted package; 6 leads SOT457 All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 2 of 18 SSL5031CTS NXP Semiconductors Compact high power factor/low-THD buck LED driver IC 6. Block diagram 9&&  9$//(< '(7(&7,21 '(0293 6833/ Vstartup. SSL5031CTS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 6 of 18 SSL5031CTS NXP Semiconductors Compact high power factor/low-THD buck LED driver IC 8.7.2 Cycle-by-cycle OverCurrent Protection (OCP) The SSL5031CTS incorporates a built-in peak current detector. It triggers when the voltage at the ISNS pin reaches the peak level VI(max)ISNS. A resistor connected to ISNS pin senses the current through inductor IL. The maximum current in inductor, IL(max) equals: V I  max ISNS I L  max  = --------------------------R4 + 0.09 (2) The sense circuit is activated after the leading-edge blanking time (tleb). Because the LED current is half the peak current by design, the sense circuit automatically provides protection for the maximum LED current during operation. A propagation delay exists between the overcurrent detection and the actual switch switch-off. Due to this delay, the actual peak current is slightly higher than the OCP level set by the resistor connected in series with the ISNS pin. 8.7.3 OverTemperature Protection (OTP) The converter stops switching when the internal OTP function is triggered at the IC junction temperature Tpl(IC). The safe-restart protection is triggered and the IC resumes switching when the IC temperature drops to below Trst(IC). 8.7.4 Cycle-by-cycle maximum on-time protection Measuring the inductor current IL using sense resistor R4 regulates the on-time. The on-time is limited to a fixed value (ton(max)). It protects the system and the IC when the ISNS pin is shorted or when the system works at very low mains voltage. 8.7.5 Output OverVoltage Protection (OVP) An accurate output OVP is implemented by measuring the voltage at the DEMOVP pin during the secondary stroke. The resistive divider connected between the LEDP node and the DEMOVP pin sets the maximum LED voltage. An internal counter prevents false OVP detection because of noise on the DEMOVP pin. After three continuous cycles with a DEMOVP pin voltage above the OVP level, the OVP protection is triggered. The over voltage protection triggers a restart sequence: A discharge current (ICC(dch)) is enabled and discharges the voltage on the VCC pin to below Vrst(latch). When Vrst(latch) is reached, the system restarts. 8.7.6 Output Short Protection (OSP) The converter operates in Discontinuous Conduction Mode (DCM). A new cycle is only started after the previous cycle has ended. The end of the cycle is detected by measuring the voltage on the DEMOVP pin. When the DEMOVP pin voltage drops to below the demagnetization level (Vth(comp)DEMOVP) and a valley is detected, a new cycle starts. When output is shorted, the demagnetization is not finalized within the 40 s. The converter still regulates the adjusted output current and the on-time is reduced to a safe value by this feedback. The reduced on-time in combination with very long demagnetization time prevents that the converter is damaged or excessive dissipation occurs. SSL5031CTS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 7 of 18 SSL5031CTS NXP Semiconductors Compact high power factor/low-THD buck LED driver IC A blanking time (tsup(xfmr_ring)) is implemented at the start of the secondary stroke to prevent false demagnetization detection. 8.8 Supply management The IC starts up when the voltage on the VCC pin increases to exceed Vstartup. The IC locks out (stops switching) when the voltage on the VCC pin drops to below Vth(UVLO). The hysteresis between the start and stop levels allows the VCC capacitor to supply the IC during zero-crossings of the mains. The SSL5031CTS incorporates an internal clamping circuit to limit the voltage on the VCC pin. The clamp limits the voltage on the VCC pin to the maximum value, Vclamp(VCC). If the maximum current of the external resistor minus the current consumption of the IC is lower than the limiting value of IVCC in Table 4, no external Zener diode is required. SSL5031CTS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 8 of 18 SSL5031CTS NXP Semiconductors Compact high power factor/low-THD buck LED driver IC 9. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCC supply voltage current limited [1][2] VI(SW) input voltage on pin SW current limited to 8.8 mA; internal switch off 0.4 +18 V [2] 0.4 +22 V VI(ISNS) VIO(COMP) input voltage on pin ISNS 0.4 +5 V input/output voltage on pin COMP 0.4 +5.3 V 6 +6 V - 8.8 mA RMS current - 380 mA triangle wave; duty cycle < 20 % 2 +2 A input current on pin ISNS triangle wave; duty cycle < 20 % 2 +2 A Ptot total power dissipation Tamb < 75 C - 0.28 W Tstg storage temperature 55 +150 C Tj junction temperature 40 +160 C Voltages VI(DEMOVP) input voltage on pin DEMOVP Currents II(VCC) input current on pin VCC II(SW) input current on pin SW II(ISNS) General ESD ESD electrostatic discharge class 1 human body model [3] 2000 +2000 V charged device model [4] 500 +500 V [1] The current into the VCC pin must not exceed the maximum I(VCC) value. [2] An internal clamp sets the supply voltage and current limits. [3] Equivalent to discharge a 100 pF capacitor through a 1.5 k series resistor. [4] Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each pin down to 0 V over a 1  resistor. 10. Thermal characteristics Table 5. SSL5031CTS Product data sheet Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient In free air; JEDEC test board 259 K/W Rth(j-c) thermal resistance from junction to case In free air; JEDEC test board 152 K/W All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 9 of 18 SSL5031CTS NXP Semiconductors Compact high power factor/low-THD buck LED driver IC 11. Characteristics Table 6. Characteristics Tamb = 25 C; VCC = 15 V; all voltages are measured with respect to ground pin (pin 5); currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supply (pin VCC) Vstartup start-up voltage 12.25 12.65 13.05 V Vth(UVLO) undervoltage lockout threshold voltage 9.6 9.9 10.2 V 0.17 0.30 0.43 V 15.2 15.8 16.4 V 6.0 6.2 6.4 V 100 125 150 A 120 145 170 A 3.7 4.8 5.5 mA VVCC voltage difference on pin VCC Vclamp(VCC) clamp voltage on pin VCC Vrst(latch) latched reset voltage ICC(oper) operating supply current ICC(startup) start-up supply current ICC(dch) discharge supply current II(VCC) = 2.6 mA [1] switching at 100 kHz VCC = Vrst(latch) Loop compensation (pin COMP) Vton(zero)COMP zero on-time voltage on pin COMP 1.96 2.04 2.12 V Vton(max)COMP maximum on-time voltage on pin COMP 3.8 4.0 4.2 V Vclamp(COMP) clamp voltage on pin COMP 4.3 4.7 5.1 V ton(max) maximum on-time VIO(COMP) = 4 V 12.3 15.5 18.7 s IO(COMP) output current on pin COMP VI(ISNS) = 0 V 3.2 4.0 4.8 A 250 180 50 nA Valley detection and overvoltage detection (pin DEMOVP) Iprot(DEMOVP) protection current on pin DEMOVP open current; VI(DEMOVP) = 0 V Vth(ovp) overvoltage protection threshold voltage 1.74 1.81 1.88 V Ncy(ovp) number of overvoltage protection cycles - 3 - - gmDEMOVP transconductance on pin DEMOVP 24 29 34 A/V Vth(comp)DEMOVP comparator threshold voltage on pin DEMOVP 4 18 32 mV (dV/dt)vrec valley recognition voltage change with time - 3.8 tsup(xmfr_ring) transformer ringing suppression time 1.2 1.5 1.8 s VI(DEMOVP) to IO(COMP) [2] V/s Current sensing (pin ISNS) VI(min)ISNS minimum input voltage on pin ISNS 75 100 125 mV VI(max)ISNS maximum input voltage on pin ISNS 1.7 1.8 1.9 V ton(min) minimum on-time 310 410 510 ns - 100 - ns td SSL5031CTS Product data sheet [3] [2][4] delay time All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 10 of 18 SSL5031CTS NXP Semiconductors Compact high power factor/low-THD buck LED driver IC Table 6. Characteristics …continued Tamb = 25 C; VCC = 15 V; all voltages are measured with respect to ground pin (pin 5); currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit gmISNS transconductance on pin ISNS VI(ISNS) to IO(COMP) 8.4 9.7 11.0 A/V Vintregd(AV)ISNS average internal regulated voltage on pin ISNS 0.396 0.410 0.424 V Tj = 25 C - 0.75 0.90  Tj = 125 C - 1.20 -  30 40 50 s Driver (pin SW) RDSon on-state resistance toff(max) maximum turn-off time Temperature protection Tpl(IC) IC protection level temperature 140 150 165 C Trst(IC) IC reset level temperature 106 118 130 C [1] The start-up voltage and the clamp voltage are correlated. [2] Guaranteed by design. [3] The minimum on-time is only effective when OCP is triggered. [4] t leb = t on  min  – t d SSL5031CTS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 11 of 18 SSL5031CTS NXP Semiconductors Compact high power factor/low-THD buck LED driver IC 12. Application information ' / ) 9PDLQV 59 8 5 8 & 9 & 9 5D ' 9PDLQV 5E 5 4 6: 9&& ,616 & 9    ,&    '(0293 *1' &203 & 9 5 5 5D 5E / /(' ' 5 & /('V DDD (1) R3b, R6b, C1 and C2 are the parts for the 230 V (AC) mains application. Short R3b and R6b out; reduce C1 and C2 voltage rating for the 120 V (AC) mains application. Fig 6. SSL5031CTS application diagram SSL5031CTS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 12 of 18 SSL5031CTS NXP Semiconductors Compact high power factor/low-THD buck LED driver IC 13. Package outline 3ODVWLFVXUIDFHPRXQWHGSDFNDJH7623OHDGV ' 627 % $ ( \ +(  ; Y 0 $   4 SLQ LQGH[ $ $ F    /S H ES Z 0 % GHWDLO;   PP VFDOH ',0(16,216PPDUHWKHRULJLQDOGLPHQVLRQV 81,7 $ $ ES F ' ( H +( /S 4 Y Z \ PP                       287/,1( 9(56,21 5()(5(1&(6 ,(& -('(& -(,7$  6& 627 Fig 7. (8523($1 352-(&7,21 ,668('$7(   Package outline SOT457 (TSOP6) SSL5031CTS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 13 of 18 SSL5031CTS NXP Semiconductors Compact high power factor/low-THD buck LED driver IC 14. Abbreviations Table 7. SSL5031CTS Product data sheet Abbreviations Acronym Description BCM Boundary Conduction Mode BOM Bill Of Materials LEB Leading-Edge Blanking OCP OverCurrent Protection OSP Output Short Protection OTP OverTemperature Protection OVP OverVoltage Protection PCB Printed-Circuit Board UVLO UnderVoltage LockOut ZCS Zero Current Switching All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 14 of 18 SSL5031CTS NXP Semiconductors Compact high power factor/low-THD buck LED driver IC 15. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes SSL5031CTS v.2 20150311 Product data sheet - SSL5031CTS v.1 Modifications: SSL5031CTS v.1 SSL5031CTS Product data sheet • • The data sheet status has changed from Preliminary to Product. Text and graphics have been updated throughout the data sheet. 20141015 Preliminary data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 March 2015 - © NXP Semiconductors N.V. 2015. All rights reserved. 15 of 18 SSL5031CTS NXP Semiconductors Compact high power factor/low-THD buck LED driver IC 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. 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However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 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SSL5031CTS Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 16 of 18 SSL5031CTS NXP Semiconductors Compact high power factor/low-THD buck LED driver IC Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. GreenChip — is a trademark of NXP Semiconductors N.V. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com SSL5031CTS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 11 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 17 of 18 SSL5031CTS NXP Semiconductors Compact high power factor/low-THD buck LED driver IC 18. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.7.1 8.7.2 8.7.3 8.7.4 8.7.5 8.7.6 8.8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Converter operation . . . . . . . . . . . . . . . . . . . . . 4 On-time control . . . . . . . . . . . . . . . . . . . . . . . . . 4 Valley detection. . . . . . . . . . . . . . . . . . . . . . . . . 5 Start-up current . . . . . . . . . . . . . . . . . . . . . . . . . 6 Leading-Edge Blanking (LEB) . . . . . . . . . . . . . 6 Magnetization switching . . . . . . . . . . . . . . . . . . 6 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 UnderVoltage LockOut (UVLO) . . . . . . . . . . . . 7 Cycle-by-cycle OverCurrent Protection (OCP) . 7 OverTemperature Protection (OTP) . . . . . . . . . 7 Cycle-by-cycle maximum on-time protection . . 7 Output OverVoltage Protection (OVP) . . . . . . . 7 Output Short Protection (OSP) . . . . . . . . . . . . . 7 Supply management. . . . . . . . . . . . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 Thermal characteristics . . . . . . . . . . . . . . . . . . 9 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10 Application information. . . . . . . . . . . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 March 2015 Document identifier: SSL5031CTS