CAT3200HU2-GT3

CAT3200HU2 Low Noise Regulated Charge Pump DC-DC Converter Description The CAT3200HU2 is a switched capacitor boost converter that delivers a low noise, regulated output voltage. The CAT3200HU2 gives a fixed regulated 5 V output when the FB pin is tied to ground, otherwise it provides an adjustable output using external resistors. The constant frequency 2 MHz charge pump allows small 1 mF ceramic capacitors to be used. Maximum output loads of up to 100 mA can be supported over a wide range of input supply voltages making the device ideal for battery−powered applications. A shutdown control input allows the device to be placed in power−down mode, reducing the supply current to less than 1 mA. In the event of short circuit or overload conditions, the device is fully protected by both foldback current limiting and thermal overload detection. In addition, a soft start, slew rate control circuit limits inrush current during power−up. The CAT3200HU2 is available in the tiny 8−pad UDFN 2 mm x 2 mm package. Features • • • • • • • • • • • • Constant High Frequency (2 MHz) Operation 100 mA Output Current Regulated Output Voltage (5 V Fixed or Adjustable) Low Quiescent Current (1.7 mA Typ.) Soft Start, Slew Rate Control Reverse Leakage Protection Thermal Overload Shutdown Protection Low Value External Capacitors (1 mF) Foldback Current Overload Protection Shutdown Current less than 1 mA 8−pad UDFN 2 mm x 2 mm Package These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant http://onsemi.com UDFN−8 HU2 SUFFIX CASE 517AW MARKING DIAGRAM CAX YM CA = Product Name X = Assembly Location Y = Production Year (Last Digit) M = Production Month (1−9, O, N, D) PIN CONNECTIONS CPOS 1 VOUT VIN FB CNEG SHDN PGND SGND (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Typical Applications • • • • 3 V to 5 V Boost Conversion 2.5 V to 3.3 V Boost Conversion White LED Driver Handheld Portable Devices © Semiconductor Components Industries, LLC, 2014 September, 2014 − Rev. 5 1 Publication Order Number: CAT3200HU2/D CAT3200HU2 5 V Output Adjustable Output 1 mF 1 mF CPOS OUT CNEG IN VIN 3.3 V 5V ON OFF 1 mF VOUT 3.3 V 100 mA CAT3200HU2 VOUT CPOS OUT 100 mA CAT3200HU2 R1 ON OFF SHDN FB SGND PGND 1 mF 1 mF SHDN FB SGND PGND CNEG IN VIN V OUT + 1.27 V VOUT = 5 V 1 mF R2 ǒ Ǔ R 1) 1 R2 Figure 1. Typical Application Circuits Table 1. ORDERING INFORMATION Orderable Part Number Output Voltage Package Lead Finish Shipping (Note 1) CAT3200HU2−GT3 5 V and Adjustable UDFN−8 NiPdAu 3,000 1. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Table 2. PIN FUNCTION DESCRIPTION Pin No. Pin Name 1 CPOS Description Positive connection for the flying capacitor 2 VIN 3 CNEG Negative connection for the flying capacitor 4 PGND Power ground 5 SGND Ground reference for all voltages 6 SHDN Shutdown control logic input (Active LOW) 7 FB 8 VOUT Tab Input power supply Feedback to set the output voltage Regulated output voltage Connect to ground on PCB Table 3. ABSOLUTE MAXIMUM RATINGS Rating Value Unit VIN, VFB, SHDN, CNEG, CPOS Voltage −0.6 to +6 V VOUT −0.6 to +7 V VOUT Short Circuit Duration Indefinite Output Current 200 mA ESD Protection (HBM) 2000 V Junction Temperature Range 150 °C Storage Temperature Range −65 to +160 °C 300 °C Lead Soldering Temperature (10 sec) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. http://onsemi.com 2 CAT3200HU2 Table 4. RECOMMENDED OPERATING CONDITIONS Parameter Input Voltage Conditions Symbol Min 5 V output VIN 3.3 V adjustable output CIN, COUT, CFLY (Note 2) Max Unit 2.7 4.5 V 2.2 3.0 V 4.7 mF 100 mA 85 °C 1.0 Load Current ILOAD Ambient Temperature Range TAMB Typ 2.2 −40 Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 2. Refer to the Application Information section of this datasheet for more details. Table 5. ELECTRICAL CHARACTERISTICS (Recommended operating conditions unless otherwise specified. CIN, COUT, CFLY are 1 mF ceramic capacitors and VIN is set to 3.6 V.) Conditions Parameter Regulated Output ILOAD v 40 mA, VIN w 2.7 V, VFB = 0 V Symbol Min Typ Max Units VOUT 4.8 5.0 5.2 V ILOAD v 100 mA, VIN w 3.1 V, VFB = 0 V Line Regulation 3.1 V v VIN v 4.5 V, ILOAD = 50 mA, VFB = 0 V VLINE 6 mV Load Regulation ILOAD = 10 mA to 100 mA, VIN = 3.6 V, VFB = 0 V VLOAD 20 mV Switching Frequency FOSC 1.3 2.0 2.6 MHz VR 25 30 45 mVp−p h 77 81 85 % 1.6 4 mA 1 mA 1.32 V 50 nA Output Ripple Voltage ILOAD = 100 mA, VOUT = 5 V, COUT = 1 mF, excluding ESR on COUT and PCB Efficiency ILOAD = 50 mA, VIN = 3 V, VOUT = 5 V Ground Current ILOAD = 0 mA, SHDN = VIN IGND Shutdown Input Current ILOAD = 0 mA, SHDN = 0 V ISHDN FB Voltage Adjustable output only FB Input Current VFB 1.22 IFB −50 1.27 Open−Loop Resistance ILOAD = 100 mA, VIN = 3 V ROL 10 W VOUT Turn−on time (10% to 90%) ILOAD = 0 mA, VIN = 3 V TON 0.5 ms SHDN Logic High Level VIH SHDN Logic Low Level VIL Reverse Leakage into OUT pin VOUT = 5 V, Shutdown mode, VIN = 3.0 V IROUT Reverse Leakage from IN pin VOUT = 5 V, Shutdown mode, VIN = 3.0 V IRIN Short−circuit Output VOUT = 0 V 1.3 V 15 0.4 V 30 mA 1 mA ISC 80 mA Thermal Shutdown TSD 160 °C Thermal Hysteresis THYST 20 °C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. http://onsemi.com 3 CAT3200HU2 TYPICAL PERFORMANCE CHARACTERISTICS (VIN = 3.3 V, VFB = GND (5 V output), CIN = COUT = CFLY = 1 mF, [C0805C105K9RACTU], TAMB = 25°C) 2.2 QUIESCENT CURRENT (mA) SHUTDOWN VOLTAGE (V) 1.50 1.25 1.00 0.75 0.50 0.25 0 2.0 1.8 1.6 1.4 1.2 2.7 3.0 3.3 3.6 3.9 4.2 4.5 2.7 3.0 3.3 3.6 3.9 4.2 4.5 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 2. Shutdown Input Threshold vs. Input Voltage Figure 3. Quiescent Current vs. Input Voltage (No Load) 5.2 5.2 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 5.1 IOUT = 40 mA 5.0 IOUT = 100 mA 4.9 4.8 5.1 VIN = 3.6 V 5.0 VIN = 3.3 V 4.9 4.7 4.6 2.7 3.0 3.3 3.6 3.9 4.2 4.5 0 30 VIN = 3.0 V 60 90 120 150 INPUT VOLTAGE (V) OUTPUT CURRENT (mA) Figure 4. Output Voltage vs. Input Voltage Figure 5. Output Voltage vs. Output Current 250 CURRENT LIMIT (mA) 3.0 SWITCHING FREQUENCY (MHz) VIN = 2.7 V 4.8 2.5 2.0 1.5 200 150 100 50 0 1.0 2.7 3.0 3.3 3.6 3.9 4.2 2.7 4.5 3.0 3.3 3.6 3.9 4.2 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 6. Oscillator Frequency vs. Input Voltage Figure 7. Short Circuit Current vs. Input Voltage http://onsemi.com 4 4.5 CAT3200HU2 TYPICAL PERFORMANCE CHARACTERISTICS (VIN = 3.3 V, VFB = GND (5 V output), CIN = COUT = CFLY = 1 mF, [C0805C105K9RACTU], TAMB = 25°C) 100 VIN = 2.7 V 90 VIN = 3.0 V EFFICIENCY (%) 1 0 −1 −2 −40 80 VIN = 3.3 V 70 VIN = 3.6 V 60 50 40 IOUT = 10 mA 30 −20 0 20 40 60 80 100 1 10 TEMPERATURE (°C) 100 OUTPUT CURRENT (mA) Figure 8. Output Voltage Change vs. Temperature Figure 9. Efficiency vs. Output Current Figure 10. Power Up Waveform (IOUT = 100 mA) Figure 11. Output Ripple Voltage (IOUT = 100 mA) 6 5 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE CHANGE (%) 2 VIN = 4.2 V 4 VIN = 3.8 V 3 2 VIN = 3.3 V 1 0 0 50 100 150 200 250 LOAD CURRENT (mA) Figure 12. Load Transient Response Figure 13. Foldback Current Limit http://onsemi.com 5 300 CAT3200HU2 TYPICAL PERFORMANCE CHARACTERISTICS (VIN = 2.5 V, VOUT = 3.3 V (adjustable output), R1 = 16 kW, R2 = 10 kW, CIN = COUT = CFLY = 1 mF, [C0805C105K9RACTU], TAMB = 25°C) 3.6 3.5 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 3.5 3.4 3.3 3.2 IOUT = 50 mA 3.4 3.3 VIN = 2.5 V VIN = 2.7 V 3.2 3.1 3.0 VIN = 2.2 V 3.1 2.0 2.2 2.4 2.6 2.8 3.0 0 30 VIN = 3.0 V 60 90 120 150 INPUT VOLTAGE (V) OUTPUT CURRENT (mA) Figure 14. Output Voltage vs. Input Voltage Figure 15. Output Voltage vs. Output Current 5 90 80 OUTPUT VOLTAGE (V) EFFICIENCY (%) VIN = 2.2 V 70 VIN = 2.5 V 60 VIN = 2.7 V 50 VIN = 3.0 V 40 4 3 VIN = 3.0 V VIN = 2.7 V 2 VIN = 2.5 V 1 VIN = 2.2 V 30 0 20 1 10 0 100 25 50 75 100 125 150 175 OUTPUT CURRENT (mA) LOAD CURRENT (mA) Figure 16. Efficiency vs. Output Current Figure 17. Foldback Current Limit Figure 18. Power Up Waveform (IOUT = 50 mA) Figure 19. Output Ripple Voltage (IOUT = 50 mA) http://onsemi.com 6 200 CAT3200HU2 Pin Functions VIN is the power supply. During normal operation the device draws a supply current which is almost constant. A very brief interval of non−conduction will occur at the switching frequency. The duration of the non−conduction interval is set by the internal non−overlapping “break−before−make” timing. VIN should be bypassed with a 1 mF to 4.7 mF low ESR (Equivalent Series Resistance) ceramic capacitor. For filtering, a low ESR ceramic bypass capacitor (1 mF) in close proximity to the IN pin prevents noise from being injected back into the power supply. SHDN is the logic control input (active low) that places the device into shutdown mode. The internal logic is CMOS and the pin does not use an internal pull−down resistor. The SHDN pin should not be allowed to float. CPOS, CNEG pins are the positive and negative connections respectively for the charge pump flying capacitor. A low ESR ceramic capacitor (1 mF) should be connected between these pins. During initial power−up it may be possible for the capacitor to experience a voltage reversal and for this reason, avoid using a polarized (tantalum or aluminum) flying capacitor. VOUT is the regulated output voltage to power the load. During normal operation, the device will deliver a train of current pulses to the pin at a frequency of 2 MHz. Adequate filtering on the pin can typically be achieved through the use of a low ESR ceramic bypass capacitor (1 mF to 4.7 mF) in close proximity to the VOUT pin. The ESR of the output capacitor will directly influence the output ripple voltage. When the shutdown mode is entered, the output is immediately isolated from the input supply, however, the output will remain connected to the internal feedback resistor network (400 kW). The feedback network will result in a reverse current of 10 mA to 20 mA to flow back through the device to ground. Whenever the device is taken out of shutdown mode, the output voltage will experience a slew rate controlled power−up. Full operating voltage is typically achieved in less than 0.5 ms. SGND is the ground reference for all voltages on the CAT3200HU2. FB is the feedback input pin. An output divider should be connected from VOUT to FB to program the output voltage when used in adjustable output mode. When used in 5 V fixed output mode, connect the FB pin directly to GND. PGND is the power ground. error signal. A 2−phase non−overlapping clock activates the charge pump switches. The flying capacitor is charged from the IN voltage on the first phase of the clock. On the second phase of the clock it is stacked in series with the input voltage and connected to VOUT. The charging and discharging the flying capacitor continues at a free running frequency of typically 2 MHz. In shutdown mode all circuitry is turned off and the CAT3200HU2 draws only leakage current from the VIN supply. VOUT is disconnected from VIN. The SHDN pin is a CMOS input with a threshold voltage of approximately 0.8 V. The CAT3200HU2 is in shutdown when a logic LOW is applied to the SHDN pin. The SHDN pin is a high impedance CMOS input. SHDN does not have an internal pull−down resistor and should not be allowed to float. It must always be driven with a valid logic level. Short−Circuit and Thermal Protection The CAT3200HU2 has built−in short−circuit current limiting and over temperature protection. During overload conditions, output current is limited to approximately 225 mA. At higher temperatures, or if the input voltage is high enough to cause excessive chip self heating, the thermal shutdown circuit shuts down the charge pump as the junction temperature exceeds approximately 160°C. Once the junction temperature drops back to approximately 140°C, the charge pump is enabled. The CAT3200HU2 will cycle in and out of thermal shutdown indefinitely without latch−up or damage until a short−circuit on VOUT is removed. Programming the CAT3200HU2 Output Voltage (FB Pin) The CAT3200HU2 version has an internal resistive divider to program the output voltage. The programmable CAT3200HU2 may be set to an arbitrary voltage via an external resistive divider. Since it employs a voltage doubling charge pump, it is not possible to achieve output voltages greater than twice the available input voltage. Figure 20 shows the required voltage divider connection. The voltage divider ratio is given by the formula: R1 + V OUT * 1 R2 1.27 V Typical values for total voltage divider resistance can range from several kW up to 1 MW. 1 CPOS 2 IN Device Operation 3 CNEG OUT FB The CAT3200HU2 uses a switched capacitor charge pump to boost the voltage at IN to a regulated output voltage. Regulation is achieved by sensing the output voltage through an internal resistor divider (FB pin = GND) and modulating the charge pump output current based on the PGND 6 SHDN SGND 8 7 4 ǒ R1 COUT R2 5 Figure 20. Programming the Adjustable Output http://onsemi.com 7 Ǔ V OUT + 1.27 V 1 ) R1 R2 CAT3200HU2 Application Information Efficiency Ceramic Capacitors The efficiency is basically set by the ratio between the input voltage VIN and the output voltage VOUT, and can be calculated using the formula below: Ceramic capacitors of different dielectric materials lose their capacitance with higher temperature and voltage at different rates. For example, a capacitor made of X5R or X7R material will retain most of its capacitance from −40°C to 85°C whereas a Z5U or Y5V style capacitor will lose considerable capacitance over that range. Z5U and Y5V capacitors may also have voltage coefficient causing them to lose 60% or more of their capacitance when the rated voltage is applied. When comparing different capacitors it is often useful to consider the amount of achievable capacitance for a given case size rather than discussing the specified capacitance value. For example, over rated voltage and temperature conditions, a 1 mF, 10 V, Y5V ceramic capacitor in an 0603 case may not provide any more capacitance than a 0.22 mF, 10 V, X7R available in the same 0603 case. For many CAT3200HU2 applications these capacitors can be considered roughly equivalent. Efficiency [%] + 100 @ P OUT ń P IN + 100 @ V OUT @ I LOAD ń (V IN @ I IN) where FOSC is the switching frequency, and I IN + I GND ) 2 @ I LOAD If we neglect the Ground current (IGND), then the efficiency is basically equal to: Efficiency [%] ^ 100 @ V OUT ń (2 @ V IN) Layout Guidance The CAT3200HU2 2 MHz switching frequency requires minimum trace length and impedance for CIN, COUT, and CFLY capacitors. This can be accomplished by placing these components close to the IC. The CIN capacitor ground connection can connect directly to PGND and a wide, single trace should connect PGND and SGND. COUT should be star-connected to SGND, along with FB resistor network, if used. Output Ripple The output ripple voltage is related to the output capacitor size COUT and ESR (equivalent series resistance) and can be calculated using the formula below: V R + I LOAD ń (2 @ F OSC @ C OUT) ) 2 @ ESR COUT @ I LOAD where FOSC is the switching frequency. http://onsemi.com 8 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN8, 2x2 CASE 517AW ISSUE A 1 SCALE 2:1 ÇÇ ÇÇ E DETAIL A ALTERNATE CONSTRUCTIONS 0.10 C 2X L L L1 PIN ONE REFERENCE 2X B A D DATE 13 NOV 2015 0.10 C TOP VIEW DETAIL B A 0.10 C A3 A1 0.08 C A1 SIDE VIEW NOTE 4 C D2 DETAIL A 1 8X 4 SEATING PLANE 5 e e/2 A3 ALTERNATE CONSTRUCTION MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.18 0.30 2.00 BSC 1.50 1.70 2.00 BSC 0.80 1.00 0.50 BSC 0.20 0.45 −−− 0.15 GENERIC MARKING DIAGRAM* 8X 1 b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* 1.73 PACKAGE OUTLINE DETAIL B DIM A A1 A3 b D D2 E E2 e L L1 L E2 8 ÇÇ ÇÇ ÉÉ MOLD CMPD EXPOSED Cu NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINALS AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. FOR DEVICE OPN CONTAINING W OPTION, DETAIL B ALTERNATE CONSTRUCTION IS NOT APPLICABLE. 8X 0.50 XX MG G XX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 2.30 1.00 1 8X 0.50 PITCH 0.30 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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