Common Mode Filter with
ESD Protection
> 900 MHz Common Mode Stop Band
Attenuation for HDMI Interfaces
EMI804x Series
www.onsemi.com
Functional Description
The EMI804x is a family of Common Mode Filters (CMF) with
integrated ESD protection, a first in the industry. Differential signaling
I/Os can now have both common mode filtering and ESD protection in
one package. The EMI804x protects against ESD pulses up to ±15 kV
contact per the IEC61000−4−2 standard.
The EMI804x is well−suited for protecting systems using
high−speed differential ports such as USB 3.0, HDMI 1.3/1.4/2.0;
corresponding ports in removable storage and other applications.
The EMI804x is available in a RoHS−compliant, XDFN6 for 1
Differential Pair, XDFN10 for 2 Differential Pair and XDFN16
package for 3 Differential Pair.
XDFN6
CASE 711AY
1
MARKING DIAGRAMS
XX M
G
• Total Insertion Loss DMLOSS < 2.5 dB at 2.5 GHz
• Large Differential Mode Cutoff Frequency f3dB > 5 GHz
• High Common Mode Stop Band Attenuation:
W2 M
G
1
15 dB at 700 MHz, 30 dB at 2.4 GHz
• Low Channel Resistance 6.0 W
• Provides ESD Protection to IEC61000−4−2 Level 4, ±15 kV Contact
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
XDFN16
CASE 711AZ
UDFN6
CASE 517DG
Features
•
XDFN10
CASE 711AX
1
1
1
XXXMG
G
W3 M
G
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
ELECTRICAL SCHEMATICS
Applications
•
•
•
•
•
USB 3.0
HDMI 1.3/1.4/2.0
MHL 2.0
ESATA
Automotive Cameras
EMI8042
EMI8043
Figure 1. EMI8041 Electrical Schematic
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
August, 2020 − Rev. 0
1
Publication Order Number:
EMI8041/D
EMI804x Series
PIN FUNCTION DESCRIPTION
Device Pin
Pin Name
EMI8041
EMI8042
EMI8043
Type
In_1+
1
1
1
I/O
CMF Channel 1+ to Connector (External)
In_1−
2
2
2
I/O
CMF Channel 1− to Connector (External)
Out_1+
6
10
16
I/O
CMF Channel 1+ to ASIC (Internal)
Out_1−
5
9
15
I/O
CMF Channel 1− to ASIC (Internal)
In_2+
NA
4
4
I/O
CMF Channel 2+ to Connector (External)
In_2−
NA
5
5
I/O
CMF Channel 2− to Connector (External)
Out_2+
NA
7
13
I/O
CMF Channel 2+ to ASIC (Internal)
Out_2−
NA
6
12
I/O
CMF Channel 2− to ASIC (Internal)
In_3+
NA
NA
7
I/O
CMF Channel 3+ to Connector (External)
In_3−
NA
NA
8
I/O
CMF Channel 3− to Connector (External)
Out_3+
NA
NA
10
I/O
CMF Channel 3+ to ASIC (Internal)
Out_3−
NA
NA
9
I/O
CMF Channel 3− to ASIC (Internal)
VN
3,4
3, 8
3,6,14,11
GND
Description
Ground
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Symbol
Value
Unit
Operating Temperature Range
TOP
−40 to +85
°C
Storage Temperature Range
TSTG
−65 to +150
°C
TL
260
°C
ILINE
100
mA
Parameter
Maximum Lead Temperature for Soldering Purposes
(1/8” from Case for 10 seconds)
DC Current per Line
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
www.onsemi.com
2
EMI804x Series
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
VRWM
Parameter
Test Conditions
Reverse Working Voltage
VBR
Breakdown Voltage
ILEAK
Channel Leakage Current
RCH
Channel Resistance
(Pins 1−6, 2−5) − EMI8041
(Pins 1−10, 2−9, 4−7 and 5−6) − EMI8042
(Pins 1−16, 2−15, 4−13, 5−12, 7−10 and 8−9) − EMI8043
IT = 1 mA; (Note 4)
Differential Mode Cut-off Frequency
Fatten
Common Mode Stop Band Attenuation
VESD
In-system ESD Withstand Voltage
a) Contact discharge per IEC 61000-4-2 standard, Level 4
(External Pins)
b) Contact discharge per IEC 61000-4-2 standard, Level 1
(Internal Pins)
VCL
Typ
Max
3.3
4.0
TA = 25°C, VIN = 3.3 V, GND = 0 V
Unit
V
9.0
V
1.0
mA
6.0
W
@ 2.5 GHz
2.5
dB
50 W Source and Load
Termination
5.0
GHz
@ 700 MHz
15
dB
DMLOSS Differential Mode Insertion Loss
f3dB
Min
(Note 3)
(Notes 1 and 2)
kV
±15
±2
TLP Clamping Voltage
Forward IPP = 8 A
Forward IPP = 16 A
Forward IPP = −8 A
Forward IPP = −16 A
7.26
11.8
−3.5
−6.7
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Standard IEC61000−4−2 with CDischarge = 150 pF, RDischarge = 330, GND grounded.
2. These measurements performed with no external capacitor.
3. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than the DC
or continuous peak operating voltage level.
4. VBR is measured at pulse test current IT.
www.onsemi.com
3
EMI804x Series
TYPICAL CHARACTERISTICS
0
0
m1
−1
m2
−2
−5
−10
m3
−15
dB (SCC21)
dB (SDD21)
−3
−4
−5
−6
−20
−25
−30
−7
−35
−8
−40
−9
−45
−50
−10
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 2. Typical Differential Mode Attenuation
vs. Frequency
Figure 3. Typical Common Mode Attenuation
vs. Frequency
Interface
Data Rate (Gb/s)
Fundamental Frequency (GHz)
EMI804x Insertion Loss (dB)
HDMI 1.3/1.4
3.4
1.7 (m1)
m1 = 1.65
USB 3.0
5.0
2.5 (m2)
m2 = 2.13
HDMI 2.0
6.0
3.0 (m3)
m3 = 2.41
www.onsemi.com
4
EMI804x Series
TRANSMISSION LINE PULSE (TLP) MEASUREMENTS
Transmission Line Pulse (TLP) provides current versus voltage (I−V) curves in which each data point is obtained from a
100 ns long rectangular pulse from a charged transmission line. A simplified schematic of a typical TLP system is shown in
Figure 4. TLP I−V curves of ESD protection devices accurately demonstrate the product’s ESD capability because the 10 s
of amps current levels and under 100 ns time scale match those of an ESD event. This is illustrated in Figure 5 where an 8 kV
IEC61000−4−2 current waveform is compared with TLP current pulses at 8 A and 16 A. A TLP curve shows the voltage at
which the device turns on as well as how well the device clamps voltage over a range of current levels. Typical TLP I−V curves
for the EMI804x are shown in Figure 4.
L
Attenuator
SW
50 W Coax Cable
÷
50 W Coax Cable
IM
VM
10 MQ
DUT
VC
Oscilloscope
Figure 4. Simplified Schematic of a Typical TLP System
18
−18
16
−16
14
−14
12
−12
10
−10
I (A)
I (A)
Figure 5. Comparison Between 8 kV IEC61000-4-2 and 8 A and 16 A TLP Waveforms
8
−8
6
−6
4
−4
2
−2
0
0
2
4
6
8
10
Vclamp (V)
12
14
16
0
18
0
−2
−4
−6
Figure 6. Positive and Negative TLP Waveforms
www.onsemi.com
5
−8 −10
Vclamp (V)
−12
−14
−16 −18
EMI804x Series
Pattern Generator
(5 Gbps, PRBS31 Pattern)
50 GHz Sampling Oscilloscope
ONsemi high speed test board
(Rogers 4003 Material, Southwest
Microwave 2.4mm Connectors)
Figure 7. Eye Diagram Test Setup for 5Gbps Data Rate
Figure 8. Eye Diagram 5Gbps with and without EMI804x
Eye Height (mVppd)
Rise Time (ps)
Fall Time (ps)
Jrms (ps)
Jpp (ps)
Reference (No Device)-Left Figure
724
30.4
29.6
1.997
9.6
EMI804x Right Figure
405
60
60.8
3.484
16
ORDERING INFORMATION
Marking
Package
Shipping†
EMI8041MUTAG,
SZEMI8041MUTAG*
WA
XDFN6
(Pb−Free)
3000 / Tape & Reel
EMI8042MUTAG,
SZEMI8042MUTAG*
W2
XDFN10
(Pb−Free)
3000 / Tape & Reel
EMI8043MUTAG,
SZEMI8043MUTAG*
W3
XDFN16
(Pb−Free)
3000 / Tape & Reel
EMI8041BMUTAG
MA
UDFN6
(Pb−Free)
3000 / Tape & Reel
Orderable Part Number
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
www.onsemi.com
6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.6x1.35, 0.5P
CASE 517DG
ISSUE O
1
SCALE 4:1
PIN ONE
REFERENCE
2X
0.10 C
2X
0.10 C
ÉÉ
ÉÉ
E
TOP VIEW
A
0.10 C
6X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
A B
D
A1
DETAIL A
0.08 C
DIM
A
A1
b
D
E
e
L
L2
DETAIL A
1
3
1
3X
3X
L2
4
6X
b
e
0.10 C A B
BOTTOM VIEW
0.05 C
(Note: Microdot may be in either location)
*This information is generic. Please refer
to device data sheet for actual part
marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
NOTE 3
RECOMMENDED
MOUNTING FOOTPRINT
0.50
PITCH
XXXMG
G
XXX = Specific Device Code
M = Date Code
G
= Pb−Free Package
L
6
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.15
0.25
1.60 BSC
1.35 BSC
0.50 BSC
0.35
0.55
0.65
0.85
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
C
SIDE VIEW
DATE 21 SEP 2015
3X
0.86
1.55
3X
1
6X
0.32
0.56
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON05041G
UDFN6, 1.6X1.35, 0.5P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN10 2.50x1.35, 0.5P
CASE 711AX
ISSUE A
DATE 12 APR 2016
SCALE 4:1
A B
D
PIN ONE
REFERENCE
2X
0.10 C
2X
0.10 C
ÇÇÇ
ÇÇÇ
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM THE TERMINAL TIP.
L
L1
E
DETAIL A
ALTERNATE
CONSTRUCTIONS
TOP VIEW
DETAIL B
ÉÉÉ
ÉÉÉ
ÇÇÇ
EXPOSED Cu
A
(A3)
0.10 C
DIM
A
A1
A3
b
D
E
e
L
L1
0.08 C
MOLD CMPD
DETAIL B
A1
SIDE VIEW
C
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.40
0.50
0.00
0.05
0.15 REF
0.15
0.25
2.50 BSC
1.35 BSC
0.50 BSC
0.40
0.60
--0.15
GENERIC
MARKING DIAGRAM*
ALTERNATE
CONSTRUCTION
XX M
G
DETAIL A
e
1
5
10X
10
L
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
6
10X
BOTTOM VIEW
b
0.10
M
C A B
0.05
M
C
NOTE 3
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
MOUNTING FOOTPRINT
9X
10X
0.25
0.65
PACKAGE
OUTLINE
1.55
1
0.47
0.50 PITCH
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
DESCRIPTION:
98AON90283F
XDFN10 2.50X1.35, 0.5P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN6 1.50x1.35, 0.5P
CASE 711AY
ISSUE O
SCALE 4:1
A B
D
PIN 1
REFERENCE
2X
ÇÇÇ
ÇÇÇ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
L
L
L1
E
0.10 C
2X
DATE 09 SEP 2014
DETAIL A
ALTERNATE
CONSTRUCTIONS
0.10 C
TOP VIEW
A
DETAIL B
0.10 C
6X
DIM
A
A1
A3
b
D
E
e
L
L1
L2
L3
ÉÉ
ÉÉ
ÇÇ
EXPOSED Cu
(A3)
A1
MOLD CMPD
DETAIL B
0.08 C
C
SIDE VIEW
ALTERNATE
CONSTRUCTION
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
e
DETAIL A
1
3X
3
L
3X
L2
XXMG
G
b
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
L3
6
4
6X
BOTTOM VIEW
MILLIMETERS
MIN
MAX
0.40
0.50
0.00
0.05
0.15 REF
0.15
0.25
1.50 BSC
1.35 BSC
0.50 BSC
0.35
0.55
--0.15
0.65
0.85
0.15 REF
0.10
M
C A B
0.05
M
C
NOTE 3
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
MOUNTING FOOTPRINT
0.50
PITCH
3X
0.86
3X
0.56
1.55
1
0.51
5X
0.32
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
DESCRIPTION:
98AON90322F
XDFN6 1.50X1.35, 0.5P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN16 4.0x1.35, 0.5P
CASE 711AZ
ISSUE O
16
DATE 09 SEP 2014
1
SCALE 4:1
A
B
D
2X
0.10 C
PIN ONE
REFERENCE
2X
ÉÉÉÉ
ÉÉÉÉ
0.10 C
L
L
L1
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
ÉÉÉ
ÉÉÉ
ÇÇÇ
TOP VIEW
EXPOSED Cu
DETAIL B
(A3)
0.10 C
A
MOLD CMPD
DETAIL B
16X
0.08 C
A1
SIDE VIEW
C
SEATING
PLANE
e/2
DETAIL A
e
16X
8
1
ALTERNATE
CONSTRUCTION
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
DIM
A
A1
A3
b
D
E
e
L
L1
L2
MILLIMETERS
MIN
MAX
0.40
0.50
0.00
0.05
0.15 REF
0.15
0.25
4.00 BSC
1.35 BSC
0.50 BSC
0.40
0.60
−−−
0.15
0.20 REF
GENERIC
MARKING DIAGRAM*
XXXM
G
L
1
L2
16
9
16X
XXX = Specific Device Code
M = Month Code
G
= Pb−Free Package
b
0.10 C A B
0.05 C
BOTTOM VIEW
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
0.50
PITCH
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
16X
0.65
1.55
1
15X
0.48
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON90324F
XDFN16 4.0X1.35, 0.5P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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