EMI8141, EMI8142,
EMI8143
Common Mode Filter with
ESD Protection
Functional Description
The EMI814x is a family of Common Mode Filters (CMF) with
integrated ESD protection, a first in the industry. Differential signaling
I/Os can now have both common mode filtering and ESD protection in
one package. The EMI814x protects against ESD pulses up to ±15 kV
contact per the IEC61000−4−2 standard.
The EMI814x is well−suited for protecting systems using
high−speed differential ports such as USB 3.0, MIPI D−PHY;
corresponding ports in removable storage, and other applications
where ESD protection are required in a small footprint package.
The EMI814x is available in a RoHS−compliant, XDFN6 for 1
Differential Pair, XDFN−10 for 2 Differential Pair and XDFN−16
package for 3 Differential Pair.
Features
• Total Insertion Loss DMLOSS < 2.5 dB at 2.5 GHz
• Large Differential Mode Cutoff Frequency f3dB > 5 GHz
• High Common Mode Stop Band Attenuation:
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XDFN6
CASE 711AV
XDFN10
CASE 711AU
XDFN16
CASE 711AW
MARKING DIAGRAMS
4A M
G
1
42 M
G
43 M
G
1
1
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
ELECTRICAL SCHEMATICS
> 10 dB at 500 MHz , 15 dB at 700 MHz
• Low Channel Resistance 6.0 W
• Provides ESD Protection to IEC61000−4−2 Level 4, ±15 kV Contact
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
EMI8142
Applications
•
•
•
•
•
•
USB 3.0
MHL 2.0
mSD Card
eSATA
HDMI/DVI Display in Mobile Phones
MIPI D−PHY (CSI−2, DSI, etc) in Mobile Phones and Digital Still
Cameras
EMI8143
ORDERING INFORMATION
Figure 1. EMI8141 Electrical Schematic
Shipping†
Device
Package
EMI8141MUTAG
XDFN6
3000 / Tape & Reel
EMI8142MUTAG
XDFN10
3000 / Tape & Reel
EMI8143MUTAG
XDFN16
3000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
June, 2014 − Rev. 0
1
Publication Order Number:
EMI8141/D
EMI8141, EMI8142, EMI8143
PIN FUNCTION DESCRIPTION
Device Pin
Pin Name
EMI8141
EMI8142
EMI8143
Type
In_1+
1
1
1
I/O
CMF Channel 1+ to Connector (External)
In_1−
2
2
2
I/O
CMF Channel 1− to Connector (External)
Out_1+
6
10
16
I/O
CMF Channel 1+ to ASIC (Internal)
Out_1−
5
9
15
I/O
CMF Channel 1− to ASIC (Internal)
In_2+
NA
4
4
I/O
CMF Channel 2+ to Connector (External)
In_2−
NA
5
5
I/O
CMF Channel 2− to Connector (External)
Out_2+
NA
7
13
I/O
CMF Channel 2+ to ASIC (Internal)
Out_2−
NA
6
12
I/O
CMF Channel 2− to ASIC (Internal)
In_3+
NA
NA
7
I/O
CMF Channel 3+ to Connector (External)
In_3−
NA
NA
8
I/O
CMF Channel 3− to Connector (External)
Out_3+
NA
NA
10
I/O
CMF Channel 3+ to ASIC (Internal)
Out_3−
NA
NA
9
I/O
CMF Channel 3− to ASIC (Internal)
VN
3,4
3, 8
3,6,14,11
GND
Description
Ground
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Symbol
Value
Unit
Operating Temperature Range
TOP
−40 to +85
°C
Storage Temperature Range
TSTG
−65 to +150
°C
TL
260
°C
ILINE
100
mA
Parameter
Maximum Lead Temperature for Soldering Purposes
(1/8” from Case for 10 seconds)
DC Current per Line
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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2
EMI8141, EMI8142, EMI8143
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
VRWM
Parameter
Test Conditions
Reverse Working Voltage
VBR
Breakdown Voltage
ILEAK
Channel Leakage Current
RCH
Channel Resistance
(Pins 1−6, 2−5) − EMI8141
(Pins 1−10, 2−9, 4−7 and 5−6) − EMI8142
(Pins 1−16, 2−15, 4−13, 5−12, 7−10 and 8−9) − EMI8143
IT = 1 mA; (Note 4)
Differential Mode Cut-off Frequency
Fatten
Common Mode Stop Band Attenuation
VESD
In-system ESD Withstand Voltage
a) Contact discharge per IEC 61000-4-2 standard, Level 4
(External Pins)
b) Contact discharge per IEC 61000-4-2 standard, Level 1
(Internal Pins)
VCL
Typ
Max
3.3
4.0
TA = 25°C, VIN = 3.3 V, GND = 0 V
Unit
V
9.0
V
1.0
mA
6.0
W
@ 2.5 GHz
2.5
dB
50 W Source and Load
Termination
5.0
GHz
@ 700 MHz
15
dB
DMLOSS Differential Mode Insertion Loss
f3dB
Min
(Note 3)
(Notes 1 and 2)
kV
±15
±2
TLP Clamping Voltage
Forward IPP = 8 A
Forward IPP = 16 A
Forward IPP = −8 A
Forward IPP = −16 A
7.26
11.8
−3.5
−6.7
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Standard IEC61000−4−2 with CDischarge = 150 pF, RDischarge = 330, GND grounded.
2. These measurements performed with no external capacitor.
3. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than the DC
or continuous peak operating voltage level.
4. VBR is measured at pulse test current IT.
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3
EMI8141, EMI8142, EMI8143
TYPICAL CHARACTERISTICS
0
0
−5
m1
−2
−10
−3
−15
dB (SCC21)
dB (SDD21)
−1
−4
−5
−6
−20
−25
−30
−7
−35
−8
−40
−9
−45
−50
−10
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 2. Typical Differential Mode Attenuation
vs. Frequency
Figure 3. Typical Common Mode Attenuation
vs. Frequency
Interface
Data Rate (Gb/s)
Fundamental Frequency (GHz)
ESD814x Insertion Loss (dB)
USB 3.0
5
2.5 (m1)
m1 = 2.13
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4
EMI8141, EMI8142, EMI8143
TRANSMISSION LINE PULSE (TLP) MEASUREMENTS
Transmission Line Pulse (TLP) provides current versus voltage (I−V) curves in which each data point is obtained from a
100 ns long rectangular pulse from a charged transmission line. A simplified schematic of a typical TLP system is shown in
Figure 4. TLP I−V curves of ESD protection devices accurately demonstrate the product’s ESD capability because the 10 s
of amps current levels and under 100 ns time scale match those of an ESD event. This is illustrated in Figure 5 where an 8 kV
IEC61000−4−2 current waveform is compared with TLP current pulses at 8 A and 16 A. A TLP curve shows the voltage at
which the device turns on as well as how well the device clamps voltage over a range of current levels. Typical TLP I−V curves
for the EMI814x are shown in Figure 4.
L
SW
Attenuator
50 W Coax Cable
÷
50 W Coax Cable
IM
VM
10 MQ
DUT
VC
Oscilloscope
Figure 4. Simplified Schematic of a Typical TLP System
18
−18
16
−16
14
−14
12
−12
10
−10
I (A)
I (A)
Figure 5. Comparison Between 8 kV IEC61000-4-2 and 8 A and 16 A TLP Waveforms
8
−8
6
−6
4
−4
2
−2
0
0
0
2
4
6
8
10
Vclamp (V)
12
14
16
18
0
−2
−4
−6
Figure 6. Positive and Negative TLP Waveforms
http://onsemi.com
5
−8 −10
Vclamp (V)
−12
−14
−16 −18
EMI8141, EMI8142, EMI8143
Pattern Generator
(5 Gbps, PRBS31 Pattern)
50 GHz Sampling Oscilloscope
ONsemi high speed test board
(Rogers 4003 Material, Southwest
Microwave 2.4mm Connectors)
Figure 7. Eye Diagram Test Setup for 5Gbps Data Rate
Figure 8. Eye Diagram 5Gbps with and without EMI814x
Eye Height (mVppd)
Rise Time (ps)
Fall Time (ps)
Jrms (ps)
Jpp (ps)
Reference (No Device)-Left Figure
724
30.4
29.6
1.997
9.6
EMI814x Right Figure
405
60
60.8
3.484
16
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6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN10 2.2x1.35, 0.4P
CASE 711AU
ISSUE B
DATE 17 JUN 2014
SCALE 4:1
A B
D
PIN ONE
REFERENCE
2X
0.10 C
2X
ÇÇÇ
ÇÇÇ
0.10 C
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM THE TERMINAL TIP.
L
L1
E
DETAIL A
ALTERNATE
CONSTRUCTIONS
TOP VIEW
DETAIL B
ÉÉÉ
ÉÉÉ
ÇÇÇ
EXPOSED Cu
A
(A3)
0.10 C
0.08 C
MOLD CMPD
DETAIL B
A1
SIDE VIEW
SEATING
PLANE
C
GENERIC
MARKING DIAGRAM*
ALTERNATE
CONSTRUCTION
XX M
G
DETAIL A
e
1
5
8X
10
L
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
6
b
10X
BOTTOM VIEW
MILLIMETERS
MIN
MAX
0.40
0.50
0.00
0.05
0.15 REF
0.15
0.25
2.20 BSC
1.35 BSC
0.40 BSC
0.40
0.60
--0.15
DIM
A
A1
A3
b
D
E
e
L
L1
0.10
M
C A B
0.05
M
C
NOTE 3
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
MOUNTING FOOTPRINT
9X
8X
0.25
0.65
PACKAGE
OUTLINE
1.55
1
0.50
0.40 PITCH
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
DESCRIPTION:
98AON83517F
XDFN10 2.2X1.35, 0.4P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN6 1.40x1.35, 0.4P
CASE 711AV
ISSUE A
SCALE 4:1
PIN 1
REFERENCE
2X
ÇÇÇ
ÇÇÇ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
E
0.10 C
2X
L
L
A B
D
DATE 04 JUN 2014
L1
DETAIL A
DIM
A
A1
A3
b
D
E
e
L
L1
ALTERNATE TERMINAL
CONSTRUCTIONS
0.10 C
TOP VIEW
A
DETAIL B
0.10 C
6X
ÉÉ
ÉÉ
ÇÇ
EXPOSED Cu
(A3)
A1
MOLD CMPD
DETAIL B
0.08 C
C
SIDE VIEW
GENERIC
MARKING DIAGRAM*
XXMG
G
4
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
6X
L
DETAIL A
6
ALTERNATE
CONSTRUCTION
3
e
1
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.40
0.50
0.00
0.05
0.15 REF
0.15
0.25
1.40 BSC
1.35 BSC
0.40 BSC
0.40
0.60
--0.15
6X
BOTTOM VIEW
b
0.10
M
C A B
0.05
M
C
NOTE 3
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
MOUNTING FOOTPRINT
0.40
PITCH
6X
0.65
1.55
1
0.50
5X
0.25
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
DESCRIPTION:
98AON83554F
XDFN6 1.40X1.35, 0.4P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN16 3.5x1.35, 0.4P
CASE 711AW
ISSUE A
16
DATE 17 JUN 2014
1
SCALE 4:1
A
B
D
2X
ÉÉÉÉ
ÉÉÉÉ
0.10 C
PIN ONE
REFERENCE
2X
0.10 C
L
L
L1
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
ÉÉÉ
ÉÉÉ
ÇÇÇ
TOP VIEW
EXPOSED Cu
DETAIL B
(A3)
0.10 C
A
MOLD CMPD
DETAIL B
16X
0.08 C
NOTE 4
A1
SIDE VIEW
C
SEATING
PLANE
e/2
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
e
12X
8
1
ALTERNATE
CONSTRUCTION
DIM
A
A1
A3
b
D
E
e
L
L1
MILLIMETERS
MIN
MAX
0.40
0.50
0.00
0.05
0.15 REF
0.15
0.25
3.50 BSC
1.35 BSC
0.40 BSC
0.40
0.60
−−−
0.15
GENERIC
MARKING DIAGRAM*
XXXM
G
L
1
16
9
16X
XXX = Specific Device Code
M = Month Code
G
= Pb−Free Package
b
0.10 C A B
0.05 C
BOTTOM VIEW
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
0.40
PITCH
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
12X
0.65
1.55
1
15X
0.55
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON83555F
XDFN16 3.5X1.35, 0.4P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
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